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1. 发明申请

US20070181655A1 WAVE SOLDER APPARATUS 审中-公开
标题翻译：波形焊接设备
公开(公告)号：US20070181655A1
公开(公告)日：2007-08-09
申请号：US11380229
申请日：2006-04-26
申请人： Wen-Chi Chen , Jauwhei Hong
发明人： Wen-Chi Chen , Jauwhei Hong
IPC分类号： B23K35/12 , B23K37/04
CPC分类号： B23K1/0016 , B23K1/085 , B23K3/0653 , B23K35/26 , B23K2101/42
摘要： A wave solder apparatus. A conveyer carries a circuit board. A solder tank is disposed under the conveyer and includes a turbulent nozzle and a laminar nozzle separated therefrom. The turbulent nozzle includes a plurality of turbulent spouting holes. The ratio of the cross-sectional area of the turbulent spouting holes to that of the turbulent nozzle exceeds 0.377. A first heater is disposed under the conveyer and adjacent to the solder tank, heating the bottom surface of the circuit board. A second heater is disposed above the conveyer and opposes the first heater, heating the top surface of the circuit board.
摘要翻译：波峰焊设备。输送机携带电路板。焊料槽设置在输送机下方，并包括湍流喷嘴和与其分开的层流喷嘴。湍流喷嘴包括多个湍流喷射孔。湍流喷嘴的横截面积与湍流喷嘴的截面积的比值超过0.377。第一加热器设置在输送机下方并且靠近焊料槽，加热电路板的底面。第二加热器设置在输送机上方并与第一加热器相对，加热电路板的顶表面。

2. 发明申请

US20070181640A1 LEAD-FREE SOLDER REWORKING SYSTEM AND METHOD THEREOF 审中-公开
标题翻译：无铅焊枪制作系统及其方法
公开(公告)号：US20070181640A1
公开(公告)日：2007-08-09
申请号：US11380224
申请日：2006-04-26
申请人： Wen-Chi Chen , Jauwhei Hong
发明人： Wen-Chi Chen , Jauwhei Hong
IPC分类号： A47J36/02
CPC分类号： B23K3/0653 , B23K2101/42 , H05K3/3447 , H05K3/3463 , H05K3/3468 , H05K2203/111 , H05K2203/176
摘要： A lead-free solder reworking method. A solder tank including a nozzle and containing molten lead-free solder is provided. A printed circuit board assembly is placed on the solder tank. The printed circuit board assembly has a printed circuit board and a first electronic member. The printed circuit board has at least one through hole. The first electronic member has at least one first pin soldered in the through hole by lead-free solder. The through hole and first pin are located above the nozzle. A reworking temperature and a reworking time are established. The printed circuit board is heated until the temperature thereof reaches the reworking temperature. The nozzle outputs the molten lead-free solder from the solder tank to the through hole of the printed circuit board until the nozzle operates for the reworking time.
摘要翻译：无铅焊锡返修方法。提供了包括喷嘴并且包含熔融无铅焊料的焊料槽。印刷电路板组件放置在焊料槽上。印刷电路板组件具有印刷电路板和第一电子部件。印刷电路板至少有一个通孔。第一电子部件具有通过无铅焊料在通孔中焊接的至少一个第一引脚。通孔和第一销位于喷嘴上方。建立了返工温度和返工时间。印刷电路板被加热直到其温度达到返工温度。喷嘴将熔融无铅焊料从焊料槽输出到印刷电路板的通孔，直到喷嘴工作为返工时间。

3. 发明申请

US20070181634A1 WAVE SOLDER APPARATUS 审中-公开
标题翻译：波形焊接设备
公开(公告)号：US20070181634A1
公开(公告)日：2007-08-09
申请号：US11380221
申请日：2006-04-26
申请人： Wen-Chi Chen , Jauwhei Hong
发明人： Wen-Chi Chen , Jauwhei Hong
IPC分类号： B23K1/08
CPC分类号： B23K3/0646 , B23K2101/42 , H05K3/3463 , H05K3/3468 , H05K3/3494 , H05K2203/111
摘要： A wave solder apparatus. A conveyer carries a circuit board. A solder tank is disposed under the conveyer and includes a turbulent nozzle and a laminar nozzle separated therefrom by a predetermined distance. A first heater is disposed under the conveyer and adjacent to the solder tank, heating the bottom surface of the circuit board. A second heater is disposed above the conveyer and opposes the first heater, heating the top surface of the circuit board. A third heater is disposed above the conveyer and opposes the turbulent and laminar nozzles of the solder tank, heating the top surface of the circuit board.
摘要翻译：波峰焊设备。输送机携带电路板。焊料槽设置在输送机下面，并包括一个湍流喷嘴和一个与其隔开预定距离的层流喷嘴。第一加热器设置在输送机下方并且靠近焊料槽，加热电路板的底面。第二加热器设置在输送机上方并与第一加热器相对，加热电路板的顶表面。第三加热器设置在输送机上方并与焊料槽的湍流和层状喷嘴相对，加热电路板的顶表面。

4. 发明授权

US4840850A Emissive coating for X-ray target 失效
标题翻译：用于X射线靶的发射涂层
公开(公告)号：US4840850A
公开(公告)日：1989-06-20
申请号：US861523
申请日：1986-05-09
申请人： Clarence O. Clark , Jauwhei Hong
发明人： Clarence O. Clark , Jauwhei Hong
IPC分类号： H01J35/10 , C23C4/10 , C23C4/18 , C23C24/10 , H01J35/08
CPC分类号： C23C24/10 , C23C4/10 , C23C4/11 , C23C4/18 , H01J35/08
摘要： The present invention employs a mechanical mixture of titanium dioxide and calcium oxide which is sintered and ground to produce a ceramic powder for application to a target of an X-ray tube. The powder is fused by baking the target at a predetermined baking temperature to produce a coating having an enhanced coefficient of emissivity. The required baking temperature is controllable by varying the proportion of titanium dioxide to calcium oxide. Baking time may be extended without degrading the coating by mechanically mixing zirconium dioxide to the sintered and ground ceramic powder prior to application to the X-ray target in order to enhance outgassing from the target substrate. The resulting coating on the target improves the emissivity thereof and exhibits and improved bond strength over coatings of the prior art.
摘要翻译：本发明使用二氧化钛和氧化钙的机械混合物，其被烧结并研磨以产生用于X射线管的靶的陶瓷粉末。通过在预定的烘烤温度下烘烤目标物来熔化粉末，以产生具有增强的发射率系数的涂层。通过改变二氧化钛与氧化钙的比例来控制所需的烘烤温度。烘烤时间可以延长，而不会降低涂层，在施加到X射线靶之前将二氧化锆机械地混合到烧结和磨碎的陶瓷粉末中，以便增强从靶基底的脱气。目标上得到的涂层改善了其现有技术的辐射率，并显示和改善了粘合强度。

5. 发明授权

US4600659A Emissive coating on alloy x-ray tube target 失效
标题翻译：合金X射线管靶上的发射涂层
公开(公告)号：US4600659A
公开(公告)日：1986-07-15
申请号：US643981
申请日：1984-08-24
申请人： Jauwhei Hong , Richard A. Jens , Steve S. Shen , Earle L. Manson, Jr.
发明人： Jauwhei Hong , Richard A. Jens , Steve S. Shen , Earle L. Manson, Jr.
IPC分类号： H01J9/14 , H01J35/08 , H01J35/10 , B32B9/00 , B05D5/06 , B05D5/12 , B32B15/04
CPC分类号： H01J35/08 , H01J35/105
摘要： An x-ray tube target composed of a molybdenum alloy material such as TZM is coated with a mixture containing from 40 percent to 70 percent of TiO.sub.2 with the remaining material being a stabilized oxide. The coating is then fused to a smooth, glossy condition to provide an enhanced thermal-emittance surface that adheres well to the target substrate.
摘要翻译：由诸如TZM的钼合金材料构成的X射线管靶涂覆有含有40％至70％的TiO 2的混合物，剩余的材料是稳定的氧化物。然后将涂层熔合成光滑的光泽条件，以提供与目标基材良好粘合的增强的热发射表面。

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