专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07128134B2 Heat dissipation module 失效
标题翻译：散热模块
公开(公告)号：US07128134B2
公开(公告)日：2006-10-31
申请号：US10981697
申请日：2004-11-05
申请人： Jung-Sung Shih , Wei-Fang Wu , Yu-Hung Huang , Chin-Ming Chen
发明人： Jung-Sung Shih , Wei-Fang Wu , Yu-Hung Huang , Chin-Ming Chen
IPC分类号： F28D15/04
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/046 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation module is disclosed for providing good heat-dissipating efficiency. First and second cases correspond to each other, with a heat conducting structure connecting to an opening of the second case. The first and second cases and the heat conducting structure form a closed structure with a porous structure therein.
摘要翻译：公开了一种散热模块，以提供良好的散热效率。第一和第二壳体彼此对应，具有连接到第二壳体的开口的导热结构。第一和第二壳体和导热结构在其中形成具有多孔结构的封闭结构。

2. 发明授权

US07007746B2 Circulative cooling apparatus 失效
标题翻译：循环冷却装置
公开(公告)号：US07007746B2
公开(公告)日：2006-03-07
申请号：US10621452
申请日：2003-07-18
申请人： Wei-Fang Wu , Yu-Hung Huang , Chin-Ming Chen
发明人： Wei-Fang Wu , Yu-Hung Huang , Chin-Ming Chen
IPC分类号： F28D15/02
CPC分类号： H01L23/427 , F28D15/043 , H01L2924/0002 , H01L2924/00
摘要： The circulative cooling apparatus has a first chamber, a second chamber, a first pipe, and a second pipe. There are porous structures on internal walls of the first chamber and the second pipe. There is work fluid in the second chamber and the porous structures. The work fluid is evaporated by heat in the first chamber, and owing to the pressure drop the vapor of the work fluid moves to the second chamber through the first pipe. Then the vapor of the work fluid condenses into the work fluid in the second chamber. Afterward the work fluid is transported back to the first chamber through the second pipe using the porous structures thereof, thus forming a circulative cooling apparatus.
摘要翻译：循环冷却装置具有第一室，第二室，第一管和第二管。在第一室和第二管的内壁上存在多孔结构。在第二室和多孔结构中存在工作流体。工作流体在第一室中通过热量蒸发，并且由于压力下降，工作流体的蒸汽通过第一管道移动到第二室。然后，工作流体的蒸汽冷凝到第二个室中的工作流体。之后，通过多孔结构将工作流体通过第二管道运送回第一室，从而形成循环冷却装置。

3. 发明申请

US20050211419A1 Heat dissipation module 失效
标题翻译：散热模块
公开(公告)号：US20050211419A1
公开(公告)日：2005-09-29
申请号：US10981697
申请日：2004-11-05
申请人： Jung-Sung Shih , Wei-Fang Wu , Yu-Hung Huang , Chin-Ming Chen
发明人： Jung-Sung Shih , Wei-Fang Wu , Yu-Hung Huang , Chin-Ming Chen
IPC分类号： F28D15/00 , F28D15/02 , F28D15/04 , H01L23/427 , H05K7/20
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/046 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation module is disclosed for providing good heat-dissipating efficiency. First and second cases correspond to each other, with a heat conducting structure connecting to an opening of the second case. The first and second cases and the heat conducting structure form a closed structure with a porous structure therein.
摘要翻译：公开了一种散热模块，以提供良好的散热效率。第一和第二壳体彼此对应，具有连接到第二壳体的开口的导热结构。第一和第二壳体和导热结构在其中形成具有多孔结构的封闭结构。

4. 发明申请

US20120240401A1 MANUFACTURING METHOD OF A HEAT SINK 审中-公开
标题翻译：散热器的制造方法
公开(公告)号：US20120240401A1
公开(公告)日：2012-09-27
申请号：US13436229
申请日：2012-03-30
申请人： Wei-Fang Wu , Cheng-Chih Lee , Yu-Hung Huang , Chin-Ming Chen
发明人： Wei-Fang Wu , Cheng-Chih Lee , Yu-Hung Huang , Chin-Ming Chen
IPC分类号： B21D53/02
CPC分类号： H01L23/3672 , F28F3/02 , H01L21/4878 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A manufacturing method of a heat sink is disclosed. A board having a first width is transported to a machine tool. The board is punched to form multiple sheet bodies. A bent part is formed on a terminal end of each sheet body having a second width. A first combined part protrudes from the bent part. A second combined part is hollowly disposed on the edge of the bent part as an indentation corresponding to the first combined part. The bent part is bent to stand correspondingly to each of the sheet bodies. Each sheet body is cut to form multiple heat dissipation fins. The second width is equal to the first width. When the heat dissipation fins overlap with each other, the first combined part of one heat dissipation fin is connected to the second combined part of another dissipation fin.
摘要翻译：公开了散热器的制造方法。具有第一宽度的板被运送到机床。板被冲压成多个板体。在具有第二宽度的每个片体的终端上形成弯曲部分。第一组合部分从弯曲部分突出。第二组合部分被中空地设置在弯曲部分的边缘上，作为对应于第一组合部分的压痕。弯曲部分被弯曲成对应于每个片体。每个片体被切割以形成多个散热片。第二宽度等于第一宽度。当散热片彼此重叠时，一个散热片的第一组合部分连接到另一个散热片的第二组合部分。

5. 发明授权

US07277285B2 Heat dissipation module 有权
标题翻译：散热模块
公开(公告)号：US07277285B2
公开(公告)日：2007-10-02
申请号：US11097323
申请日：2005-04-04
申请人： Jung-Sung Shih , Wei-Fang Wu , Yu-Hung Huang , Chin-Ming Chen
发明人： Jung-Sung Shih , Wei-Fang Wu , Yu-Hung Huang , Chin-Ming Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0266 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： The invention discloses a heat dissipation module. The heat dissipation module includes two separate cases and a porous structure. The cases are U-shaped and correspondingly connect to each other to form a sealed chamber. The porous structure is formed on an inner surface of the chamber. The heat dissipation module further includes at least one heat conducting structure connected to an exterior surface of the sealed chamber. The heat conducting structure may be fins or heat conducting plates connected to the chamber by welding, locking, fitting, engaging, or adhering.
摘要翻译：本发明公开了一种散热模块。散热模块包括两个分开的壳体和多孔结构。壳体是U形的并且相应地彼此连接以形成密封室。多孔结构形成在腔室的内表面上。散热模块还包括连接到密封室的外表面的至少一个导热结构。导热结构可以是通过焊接，锁定，配合，接合或粘附而连接到室的翅片或导热板。

6. 发明申请

US20050225943A1 Heat dissipation module 有权
标题翻译：散热模块
公开(公告)号：US20050225943A1
公开(公告)日：2005-10-13
申请号：US11097323
申请日：2005-04-04
申请人： Jung-Sung Shih , Wei-Fang Wu , Yu-Hung Huang , Chin-Ming Chen
发明人： Jung-Sung Shih , Wei-Fang Wu , Yu-Hung Huang , Chin-Ming Chen
IPC分类号： H05K7/20 , H01L23/427
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0266 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： The invention discloses a heat dissipation module. The heat dissipation module includes two separate cases and a porous structure. The cases are U-shaped and correspondingly connect to each other to form a sealed chamber. The porous structure is formed on an inner surface of the chamber. The heat dissipation module further includes at least one heat conducting structure connected to an exterior surface of the sealed chamber. The heat conducting structure may be fins or heat conducting plates connected to the chamber by welding, locking, fitting, engaging, or adhering.
摘要翻译：本发明公开了一种散热模块。散热模块包括两个分开的壳体和多孔结构。壳体是U形的并且相应地彼此连接以形成密封室。多孔结构形成在腔室的内表面上。散热模块还包括连接到密封室的外表面的至少一个导热结构。导热结构可以是通过焊接，锁定，配合，接合或粘附而连接到室的翅片或导热板。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式