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    • 5. 发明授权
    • Method and apparatus for drying a wafer
    • 干燥晶片的方法和装置
    • US08703403B2
    • 2014-04-22
    • US13334266
    • 2011-12-22
    • Wei-Chieh HuangHung Chang Hsieh
    • Wei-Chieh HuangHung Chang Hsieh
    • G03F7/26
    • G03F7/3021B05C9/12B05C11/02B05C11/023B05C11/08B05C13/00H01L21/67017H01L21/67028H01L21/67034H01L21/6715
    • The present disclosure provides a method of fabricating a semiconductor device. The method includes dispensing a liquid on a wafer. The method includes raising the wafer. The method includes lowering the wafer after the raising. The wafer is spun as it is lowered, thereby removing at least a portion of the liquid from the wafer. The present disclosure also provides an apparatus for fabricating a semiconductor device. The apparatus includes a wafer chuck that is operable to hold a semiconductor wafer and secure the wafer thereto. The wafer has a front surface and a back surface. The apparatus includes a dispenser that is operable to dispense a liquid to the front surface of the wafer. The apparatus includes a mechanical structure that is operable to: spin the wafer chuck in a horizontal direction; and move the wafer chuck downwards in a vertical direction while the wafer chuck is being rotated.
    • 本公开提供了制造半导体器件的方法。 该方法包括将液体分配在晶片上。 该方法包括升高晶片。 该方法包括在升高之后降低晶片。 晶片在降低时旋转,从而从晶片去除至少一部分液体。 本公开还提供了一种用于制造半导体器件的装置。 该装置包括可操作以保持半导体晶片并将晶片固定到其上的晶片卡盘。 晶片具有前表面和后表面。 该装置包括可操作以将液体分配到晶片的前表面的分配器。 该装置包括机械结构,其可操作以:在水平方向上旋转晶片卡盘; 并且在晶片卡盘旋转的同时沿着垂直方向向下移动晶片卡盘。
    • 7. 发明申请
    • METHOD AND APPARATUS FOR DRYING A WAFER
    • 干燥方法和装置
    • US20130164685A1
    • 2013-06-27
    • US13334266
    • 2011-12-22
    • Wei-Chieh HuangHung Chang Hsieh
    • Wei-Chieh HuangHung Chang Hsieh
    • G03F7/20H01L21/306G03F7/30
    • G03F7/3021B05C9/12B05C11/02B05C11/023B05C11/08B05C13/00H01L21/67017H01L21/67028H01L21/67034H01L21/6715
    • The present disclosure provides a method of fabricating a semiconductor device. The method includes dispensing a liquid on a wafer. The method includes raising the wafer. The method includes lowering the wafer after the raising. The wafer is spun as it is lowered, thereby removing at least a portion of the liquid from the wafer. The present disclosure also provides an apparatus for fabricating a semiconductor device. The apparatus includes a wafer chuck that is operable to hold a semiconductor wafer and secure the wafer thereto. The wafer has a front surface and a back surface. The apparatus includes a dispenser that is operable to dispense a liquid to the front surface of the wafer. The apparatus includes a mechanical structure that is operable to: spin the wafer chuck in a horizontal direction; and move the wafer chuck downwards in a vertical direction while the wafer chuck is being rotated.
    • 本公开提供了制造半导体器件的方法。 该方法包括将液体分配在晶片上。 该方法包括升高晶片。 该方法包括在升高之后降低晶片。 晶片在降低时旋转,从而从晶片去除至少一部分液体。 本公开还提供了一种用于制造半导体器件的装置。 该装置包括可操作以保持半导体晶片并将晶片固定到其上的晶片卡盘。 晶片具有前表面和后表面。 该装置包括可操作以将液体分配到晶片的前表面的分配器。 该装置包括机械结构,其可操作以:在水平方向上旋转晶片卡盘; 并且在晶片卡盘旋转的同时沿着垂直方向向下移动晶片卡盘。