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1. 发明申请

US20120160697A1 PROCESS FOR APPLYING A METAL COATING TO A NON-CONDUCTIVE SUBSTRATE 审中-公开
标题翻译：将金属涂层应用于非导电性基材的方法
公开(公告)号：US20120160697A1
公开(公告)日：2012-06-28
申请号：US13394165
申请日：2010-09-22
申请人： Wei Jie Wu , Ke Liang Pan
发明人： Wei Jie Wu , Ke Liang Pan
IPC分类号： C25D5/34
CPC分类号： C25D5/10 , C25D3/38 , C25D5/56
摘要： Described is a new process for applying a metal coating to a non-conductive substrate comprising the steps of (a) contacting the substrate with an activator comprising a noble metal/group IVA metal sol to obtain a treated substrate, (b) contacting said treated substrate with a composition comprising a solution of: (i) a Cu(II), Ag, Au or Ni soluble metal salt or mixtures thereof, (ii) 0.05 to 5 mol/l of a group IA metal hydroxide and (iii) a complexing agent for an ion of the metal of said metal salt comprising an organic material having a cumulative formation constant log K of from about 0.73 to about 21.95 for an ion of the metal of said metal salt, characterised in that the composition according to step (b) is treated with an electrical current for a period of time prior to and/or during contacting said solution with the substrate.
摘要翻译：描述了将金属涂层施加到非导电基底上的新方法，其包括以下步骤：（a）使基底与包含贵金属/ⅣA族金属溶胶的活化剂接触以获得经处理的基底，（b）使所述经处理的底物，其组合物包含以下溶液：（i）Cu（II），Ag，Au或Ni可溶性金属盐或其混合物，（ii）0.05至5mol / l的IA族金属氢氧化物和（iii）所述金属盐的金属离子的络合剂包含对于所述金属盐的金属离子具有约0.73至约21.95的累积形成常数log K的有机材料，其特征在于根据步骤（ b）在与基底接触所述溶液之前和/或期间用电流处理一段时间。

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