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    • 8. 发明授权
    • Wood adhesives
    • 木材胶粘剂
    • US07056415B2
    • 2006-06-06
    • US10014053
    • 2001-12-11
    • Walter Meckel
    • Walter Meckel
    • C08G18/10C08G18/40
    • C09J175/04C08G18/0857C08G18/10C08G18/409C08G18/7664C08G18/307
    • The present invention relates to a process for bonding two or more wood substrates by using as the adhesive isocyanate-terminated prepolymers having an isocyanate content of 8 to 20 wt. % and containing the reaction product of a) at least one organic polyisocyanate with b) at least one organic polyhydroxyl compound containing the reaction products of i) organic polyisocyanates with ii) polyamines, hydrazines and/or hydrazides having primary and/or secondary amino groups dispersed in a iii) polyethers having at least two hydroxyl groups and a number average molecular weight of 500 to 12,000; and, the present invention also relates to the bonded substrates obtained by this process.
    • 本发明涉及通过使用具有异氰酸酯含量为8〜20重量%的异氰酸酯封端的预粘合剂的粘合剂来粘合两个或多个木质基材的方法。 并且含有a)至少一种有机多异氰酸酯与b)至少一种含有i)有机多异氰酸酯与ii)有机多异氰酸酯的反应产物的有机多羟基化合物与ii)具有伯和/或仲氨基的多胺,肼和/或酰肼的反应产物 分散在iii)具有至少两个羟基并且数均分子量为500至12,000的聚醚; 并且本发明还涉及通过该方法获得的粘合基材。