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1. 发明申请

US20120194996A1 Liquid Cooling System for Stackable Modules in Energy-Efficient Computing Systems 有权
标题翻译：节能计算系统中可堆叠模块的液体冷却系统
公开(公告)号：US20120194996A1
公开(公告)日：2012-08-02
申请号：US13435811
申请日：2012-03-30
申请人： Wael R. El-Essawy , Thomas W. Keller, JR. , Jarrod A. Roy , Juan C. Rubio
发明人： Wael R. El-Essawy , Thomas W. Keller, JR. , Jarrod A. Roy , Juan C. Rubio
IPC分类号： H05K7/20
CPC分类号： H05K7/02 , G06F1/18 , G06F1/181 , G06F1/20 , H05K7/20
摘要： A computing system is provided. In the computing system, a plurality of modules physically arranged in a three dimensional hexadron configuration. In the computing system, the at least one module is either a liquid-tight module filled with a non-conductive liquid coolant or a module cooled with a liquid coolant circulating through cold plates mounted on electronic components. In the computing system, the liquid coolant is circulated in a closed loop by at least one pump through a plurality of hoses through at least one of a plurality of heat exchangers. In the computing system, the plurality of heat exchangers is coupled to an exterior portion of the surface of the computing system. In the computing system, the plurality of heat exchangers cool the liquid coolant through tinned tubes exposed to the surrounding air.
摘要翻译：提供了一种计算系统。在计算系统中，以三维十六指肠配置物理排列的多个模块。在计算系统中，所述至少一个模块是填充有非导电液体冷却剂的液密模块或者通过冷却剂循环冷却的模块，所述冷却剂循环通过安装在电子部件上的冷板。在计算系统中，液体冷却剂通过至少一个泵通过多个软管通过多个热交换器中的至少一个在闭环中循环。在计算系统中，多个热交换器耦合到计算系统表面的外部部分。在计算系统中，多个热交换器通过暴露于周围空气的镀锡管冷却液体冷却剂。

2. 发明授权

US08174826B2 Liquid cooling system for stackable modules in energy-efficient computing systems 有权
标题翻译：用于节能计算系统中可堆叠模块的液体冷却系统
公开(公告)号：US08174826B2
公开(公告)日：2012-05-08
申请号：US12788863
申请日：2010-05-27
申请人： Wael R. El-Essawy , Thomas W. Keller, Jr. , Jarrod A. Roy , Juan C. Rubio
发明人： Wael R. El-Essawy , Thomas W. Keller, Jr. , Jarrod A. Roy , Juan C. Rubio
IPC分类号： H05K7/02
CPC分类号： H05K7/02 , G06F1/18 , G06F1/181 , G06F1/20 , H05K7/20
摘要： A computing system is provided. In the computing system, a plurality of modules physically arranged in a three dimensional hexadron configuration. In the computing system, the at least one module is either a liquid-tight module filled with a non-conductive liquid coolant or a module cooled with a liquid coolant circulating through cold plates mounted on electronic components. In the computing system, the liquid coolant is circulated in a closed loop by at least one pump through a plurality of hoses through at least one of a plurality of heat exchangers. In the computing system, the plurality of heat exchangers is coupled to an exterior portion of the surface of the computing system. In the computing system, the plurality of heat exchangers cool the liquid coolant through finned tubes exposed to the surrounding air.
摘要翻译：提供了一种计算系统。在计算系统中，以三维十六指肠配置物理排列的多个模块。在计算系统中，所述至少一个模块是填充有非导电液体冷却剂的液密模块或者通过冷却剂循环冷却的模块，所述冷却剂循环通过安装在电子部件上的冷板。在计算系统中，液体冷却剂通过至少一个泵通过多个软管通过多个热交换器中的至少一个在闭环中循环。在计算系统中，多个热交换器耦合到计算系统表面的外部部分。在计算系统中，多个热交换器通过暴露于周围空气的翅片管来冷却液体冷却剂。

3. 发明申请

US20120188719A1 Liquid Cooling System for Stackable Modules in Energy-Efficient Computing Systems 失效
标题翻译：节能计算系统中可堆叠模块的液体冷却系统
公开(公告)号：US20120188719A1
公开(公告)日：2012-07-26
申请号：US13435998
申请日：2012-03-30
申请人： Wael R. El-Essawy , Thomas W. Keller, JR. , Jarrod A. Roy , Juan C. Rubio
发明人： Wael R. El-Essawy , Thomas W. Keller, JR. , Jarrod A. Roy , Juan C. Rubio
IPC分类号： H05K7/20
CPC分类号： H05K7/02 , G06F1/18 , G06F1/181 , G06F1/20 , H05K7/20
摘要： A processing module is provided that comprises a set of processing module sides, each comprising a circuit board, a plurality of connectors coupled to the circuit board, and a plurality of processing nodes coupled to the circuit board. Each processing module side couples to another processing module side to form a modular processing module. The modular processing module comprises an exterior connection to a power source and a communication system and a plurality of cold plates coupled to the plurality of processing nodes. Liquid coolant is circulated through the plurality of cold plates via a closed loop by at least one pump through a plurality of tubes and through at least one heat exchanger. The at least one heat exchanger is coupled to an exterior portion of the processing module. The at least one heat exchanger cools the liquid coolant using air surrounding the processing module.
摘要翻译：提供一种处理模块，其包括一组处理模块侧面，每个处理模块侧面包括电路板，耦合到电路板的多个连接器以及耦合到电路板的多个处理节点。每个处理模块侧耦合到另一处理模块侧以形成模块化处理模块。模块化处理模块包括到电源和通信系统的外部连接以及耦合到多个处理节点的多个冷板。液体冷却剂通过多个冷板通过至少一个泵通过多个管并通过至少一个热交换器经由闭环循环。至少一个热交换器耦合到处理模块的外部部分。所述至少一个热交换器使用围绕所述处理模块的空气冷却所述液体冷却剂。

4. 发明申请

US20110292595A1 Liquid Cooling System for Stackable Modules in Energy-Efficient Computing Systems 有权
标题翻译：节能计算系统中可堆叠模块的液体冷却系统
公开(公告)号：US20110292595A1
公开(公告)日：2011-12-01
申请号：US12788863
申请日：2010-05-27
申请人： Wael R. El-Essawy , Thomas W. Keller, JR. , Jarrod A. Roy , Juan C. Rubio
发明人： Wael R. El-Essawy , Thomas W. Keller, JR. , Jarrod A. Roy , Juan C. Rubio
IPC分类号： G06F1/20
CPC分类号： H05K7/02 , G06F1/18 , G06F1/181 , G06F1/20 , H05K7/20
摘要： A computing system is provided. In the computing system, a plurality of modules physically arranged in a three dimensional hexadron configuration. In the computing system, the at least one module is either a liquid-tight module filled with a non-conductive liquid coolant or a module cooled with a liquid coolant circulating through cold plates mounted on electronic components. In the computing system, the liquid coolant is circulated in a closed loop by at least one pump through a plurality of hoses through at least one of a plurality of heat exchangers. In the computing system, the plurality of heat exchangers is coupled to an exterior portion of the surface of the computing system. In the computing system, the plurality of heat exchangers cool the liquid coolant through finned tubes exposed to the surrounding air.
摘要翻译：提供了一种计算系统。在计算系统中，以三维十六指肠配置物理排列的多个模块。在计算系统中，所述至少一个模块是填充有非导电液体冷却剂的液密模块或者通过冷却剂循环冷却的模块，所述冷却剂循环通过安装在电子部件上的冷板。在计算系统中，液体冷却剂通过至少一个泵通过多个软管通过多个热交换器中的至少一个在闭环中循环。在计算系统中，多个热交换器耦合到计算系统表面的外部部分。在计算系统中，多个热交换器通过暴露于周围空气的翅片管来冷却液体冷却剂。

5. 发明授权

US08914495B2 Automatically detecting and locating equipment within an equipment rack 有权
标题翻译：自动检测和定位设备机架内的设备
公开(公告)号：US08914495B2
公开(公告)日：2014-12-16
申请号：US13154825
申请日：2011-06-07
申请人： Rajarshi Das , Wael R. El-Essawy , Thomas W. Keller, Jr. , Jeffrey O. Kephart , Juan C. Rubio
发明人： Rajarshi Das , Wael R. El-Essawy , Thomas W. Keller, Jr. , Jeffrey O. Kephart , Juan C. Rubio
IPC分类号： G06F15/173 , H05K7/14
CPC分类号： H05K7/1498
摘要： A mechanism is provided for automatically detecting and locating equipment within an intelligent equipment rack. The intelligent equipment rack comprises a rack controller that determines whether a signal has been received indicating that a rack space in a plurality of rack spaces in the intelligent equipment rack has been occupied by a piece of electronic equipment. Responsive to receiving the signal indicating that the rack space has been occupied by the piece of electronic equipment, the rack controller updates a rack information table in the memory with occupation information related to the rack space occupied by the piece of electronic equipment.
摘要翻译：提供了一种用于自动检测和定位智能设备机架内的设备的机构。智能设备机架包括：机架控制器，其确定是否已经接收到指示智能设备机架中的多个机架空间中的机架空间已被一块电子设备占用的信号。响应于接收到指示机架空间已被该电子设备占用的信号，机架控制器利用与该电子设备所占用的机架空间有关的占用信息来更新存储器中的机架信息表。

6. 发明授权

US08358503B2 Stackable module for energy-efficient computing systems 有权
标题翻译：用于节能计算系统的可堆叠模块
公开(公告)号：US08358503B2
公开(公告)日：2013-01-22
申请号：US12789617
申请日：2010-05-28
申请人： John B. Carter , Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Wesley M. Felter , Madhusudan K. Iyengar , Thomas W. Keller, Jr. , Karthick Rajamani , Juan C. Rubio , William E. Speight , Lixin Zhang
发明人： John B. Carter , Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Wesley M. Felter , Madhusudan K. Iyengar , Thomas W. Keller, Jr. , Karthick Rajamani , Juan C. Rubio , William E. Speight , Lixin Zhang
IPC分类号： H05K7/20
CPC分类号： H05K7/20 , G06F1/181 , G06F1/20
摘要： A modular processing module is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors coupled to the circuit board, and a plurality of processing nodes coupled to the circuit board. Each processing module side in the set of processing module sides couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system.
摘要翻译：提供模块化处理模块。模块化处理模块包括一组处理模块侧面。每个处理模块侧包括电路板，耦合到电路板的多个连接器以及耦合到电路板的多个处理节点。处理模块组中的每个处理模块侧均使用多个连接器中的至少一个连接器耦合到另一个处理模块侧，使得当所有这组处理模块侧面耦合在一起时，形成模块化处理模块。模块化处理模块包括到电源和通信系统的外部连接。

7. 发明授权

US08179674B2 Scalable space-optimized and energy-efficient computing system 失效
标题翻译：可扩展的空间优化和节能计算系统
公开(公告)号：US08179674B2
公开(公告)日：2012-05-15
申请号：US12789583
申请日：2010-05-28
申请人： John B. Carter , Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, Jr. , Jian Li , Karthick Rajamani , Juan C. Rubio , William E. Speight , Lixin Zhang
发明人： John B. Carter , Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, Jr. , Jian Li , Karthick Rajamani , Juan C. Rubio , William E. Speight , Lixin Zhang
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： G06F1/20
摘要： A scalable space-optimized and energy-efficient computing system is provided. The computing system comprises a plurality of modular compartments in at least one level of a frame configured in a hexadron configuration. The computing system also comprises an air inlet, an air mixing plenum, and at least one fan. In the computing system the plurality of modular compartments are affixed above the air inlet, the air mixing plenum is affixed above the plurality of modular compartments, and the at least one fan is affixed above the air mixing plenum. When at least one module is inserted into one of the plurality of modular compartments, the module couples to a backplane within the frame.
摘要翻译：提供了可扩展的空间优化和节能计算系统。计算系统包括在六排配置中配置的框架的至少一个级别中的多个模块化隔间。计算系统还包括空气入口，空气混合增压室和至少一个风扇。在计算系统中，多个模块化隔间固定在空气入口上方，空气混合气室固定在多个模块化隔间上方，并且至少一个风扇固定在空气混合气室的上方。当至少一个模块被插入多个模块化隔间中的一个时，模块耦合到框架内的背板。

8. 发明申请

US20110292596A1 Heatsink Allowing In-Situ Maintenance in a Stackable Module 有权
标题翻译：散热器可以在可堆叠模块中进行原位维护
公开(公告)号：US20110292596A1
公开(公告)日：2011-12-01
申请号：US12788925
申请日：2010-05-27
申请人： Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, JR. , Juan C. Rubio
发明人： Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, JR. , Juan C. Rubio
IPC分类号： G06F1/20
CPC分类号： H05K7/20 , G06F1/181 , G06F1/20
摘要： A modular processing module allowing in-situ maintenance is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors, and a plurality of processing nodes. Each processing module side couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system and at least one heatsink that couples to at least a portion of the plurality of processing nodes on one of the processing module sides and is designed such that, when a set of heatsinks in the modular processing module are installed, an empty space is left in a center of the modular processing module.
摘要翻译：提供允许现场维护的模块化处理模块。模块化处理模块包括一组处理模块侧面。每个处理模块侧包括电路板，多个连接器和多个处理节点。每个处理模块侧使用多个连接器中的至少一个连接器耦合到另一个处理模块侧，使得当所述一组处理模块侧面都耦合在一起时，形成模块化处理模块。模块化处理模块包括到电源和通信系统的外部连接以及耦合到处理模块侧之一上的多个处理节点的至少一部分的至少一个散热器，并被设计成使得当一组在模块化处理模块中安装散热器，在模块化处理模块的中心留有空的空间。

9. 发明申请

US20110292594A1 Scalable Space-Optimized and Energy-Efficient Computing System 失效
标题翻译：可扩展空间优化和节能计算系统
公开(公告)号：US20110292594A1
公开(公告)日：2011-12-01
申请号：US12789583
申请日：2010-05-28
申请人： John B. Carter , Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, JR. , Jian Li , Karthick Rajamani , Juan C. Rubio , William E. Speight , Lixin Zhang
发明人： John B. Carter , Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, JR. , Jian Li , Karthick Rajamani , Juan C. Rubio , William E. Speight , Lixin Zhang
IPC分类号： G06F1/20 , G06F13/00
CPC分类号： G06F1/20
摘要： A scalable space-optimized and energy-efficient computing system is provided. The computing system comprises a plurality of modular compartments in at least one level of a frame configured in a hexadron configuration. The computing system also comprises an air inlet, an air mixing plenum, and at least one fan. In the computing system the plurality of modular compartments are affixed above the air inlet, the air mixing plenum is affixed above the plurality of modular compartments, and the at least one fan is affixed above the air mixing plenum. When at least one module is inserted into one of the plurality of modular compartments, the module couples to a backplane within the frame.
摘要翻译：提供了可扩展的空间优化和节能计算系统。计算系统包括在六排配置中配置的框架的至少一个级别中的多个模块化隔间。计算系统还包括空气入口，空气混合增压室和至少一个风扇。在计算系统中，多个模块化隔间固定在空气入口上方，空气混合气室固定在多个模块化隔间上方，并且至少一个风扇固定在空气混合气室的上方。当至少一个模块被插入多个模块化隔间中的一个时，模块耦合到框架内的背板。

10. 发明授权

US08279597B2 Heatsink allowing in-situ maintenance in a stackable module 有权
标题翻译：散热器允许在可堆叠模块中进行现场维护
公开(公告)号：US08279597B2
公开(公告)日：2012-10-02
申请号：US12788925
申请日：2010-05-27
申请人： Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, Jr. , Juan C. Rubio
发明人： Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, Jr. , Juan C. Rubio
IPC分类号： H05K7/20 , F28F7/00 , H05K5/00
CPC分类号： H05K7/20 , G06F1/181 , G06F1/20
摘要： A modular processing module allowing in-situ maintenance is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors, and a plurality of processing nodes. Each processing module side couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system and at least one heatsink that couples to at least a portion of the plurality of processing nodes on one of the processing module sides and is designed such that, when a set of heatsinks in the modular processing module are installed, an empty space is left in a center of the modular processing module.
摘要翻译：提供允许现场维护的模块化处理模块。模块化处理模块包括一组处理模块侧面。每个处理模块侧包括电路板，多个连接器和多个处理节点。每个处理模块侧使用多个连接器中的至少一个连接器耦合到另一个处理模块侧，使得当所述一组处理模块侧面都耦合在一起时，形成模块化处理模块。模块化处理模块包括到电源和通信系统的外部连接以及耦合到处理模块侧之一上的多个处理节点的至少一部分的至少一个散热器，并被设计成使得当一组在模块化处理模块中安装散热器，在模块化处理模块的中心留有空的空间。

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