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    • 2. 发明专利
    • Low dopant polycrystalline silicon lump
    • 低掺杂多晶硅硅油
    • JP2013151413A
    • 2013-08-08
    • JP2013008500
    • 2013-01-21
    • Wacker Chemie Agワッカー ケミー アクチエンゲゼルシャフトWacker Chemie AG
    • WOCHNER HANNSKILLINGER ANDREASREINER PECH
    • C01B33/02
    • C01B33/02C01B33/021C01B33/035C01B33/037
    • PROBLEM TO BE SOLVED: To provide a low dopant polycrystalline silicon lump.SOLUTION: In a polycrystalline silicon lump, contamination on the surface is 1-50 ppta boron and 1-50 ppta phosphorus. Further, in a polycrystalline silicon lump, following requirements are further added with respect to the silicon lump: the arsenic concentration on the surface is 0.01-10 ppta, the aluminum concentration on the surface is 0.01-10 ppta, the metal concentration on the surface is 10-200 pptw, and on the surface, the Fe concentration is 1-40 pptw, the Cr concentration is 0.1-5 pptw, the Cu concentration is 0.1-5 pptw, the Na concentration is 1-30 pptw, the Ni concentration is o.1-5 pptw, the Ca concentration is 0.1-10 pptw, the Ti concentration is 0.1-10 pptw, the W concentration is 0.1-10 pptw and the Zn concentration is 0.1-10 pptw.
    • 要解决的问题:提供低掺杂剂多晶硅块。解决方案:在多晶硅块中,表面上的污染物为1-50 ppta硼和1-50 ppta磷。 此外,在多晶硅块中,相对于硅块进一步添加以下要求:表面上的砷浓度为0.01-10ppta,表面上的铝浓度为0.01-10ppta,表面上的金属浓度 为10-200 pptw,表面Fe浓度为1-40 pptw,Cr浓度为0.1-5 pptw,Cu浓度为0.1-5 pptw,Na浓度为1-30 pptw,Ni浓度 为0.1〜pptw,Ca浓度为0.1-10 pptw,Ti浓度为0.1-10 pptw,W浓度为0.1-10 pptw,Zn浓度为0.1-10 pptw。
    • 3. 发明专利
    • Packaging of polycrystalline silicon
    • 多晶硅包装
    • JP2014122153A
    • 2014-07-03
    • JP2013225121
    • 2013-10-30
    • Wacker Chemie Agワッカー ケミー アクチエンゲゼルシャフトWacker Chemie AG
    • VIETZ MATTHIASLICHTENEGGER BRUNOREINER PECH
    • C01B33/02B65D77/04
    • B65D29/00B65B1/28B65B5/067B65B25/00B65B29/00B65B31/04B65B51/146
    • PROBLEM TO BE SOLVED: To provide a packaging method unaccompanied, in a case where a polysilicon lump having sharp edges is packaged by a plastic bag, by the punch-through of the plastic bag and concomitant contamination.SOLUTION: A polysilicon lump is introduced into a first plastic bag, and the first plastic bag is introduced, following the introduction therein of the lump, into a second plastic bag or the first plastic bag is preliminarily inserted, prior to the introduction of the lump into the first plastic bag, into the second plastic bag so as to ensure the existence of the lump within the two-tier bag hermetically sealing the former, whereas air existing within the two plastic bags within the two-tier bag is removed, prior to the hermetic sealing of the two-tier bag, in such a way that the ratio of the total volume of the two-tier bag with respect to the volume of the lump will be 2.4-3.0.
    • 要解决的问题:为了提供一种无人陪伴的包装方法,在通过塑料袋包装具有尖锐边缘的多晶硅块的情况下,通过塑料袋的穿透以及伴随的污染。解决方案:将多晶硅块引入 第一塑料袋,并且在将块体引入其中之后,将第一塑料袋引入到第二塑料袋中,或者在将块体引入第一塑料袋之前,将第一塑料袋预先插入到第一塑料袋中 第二个塑料袋,以确保两层袋子内部的块体存在密封,而两层袋子内的两个塑料袋中存在的空气被去除,在两层袋子的气密密封之前 袋子,使得两层袋子的总体积相对于块体积的比例将为2.4-3.0。