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    • 4. 发明申请
    • A MULTI-AXIS PROJECTION IMAGING SYSTEM
    • 多轴投影成像系统
    • WO2004027521A3
    • 2004-04-22
    • PCT/US0329785
    • 2003-09-19
    • DMETRIX INCOLSZAK ARTUR GDESCOUR MICHAEL R
    • OLSZAK ARTUR GDESCOUR MICHAEL R
    • G02B3/00G03F7/20G02B21/02G02B21/18
    • G02B3/0056G02B21/002G02B21/367G03F7/7005G03F7/70275G03F7/70291G03F7/70391
    • A multi-axis projection imaging system. Such a system includes a plurality of objectives (134a) defining respective object fields of view and corresponding image fields of view. An object (0) is adapted for controllably illuminating the object fields of view with light that varies spatially in one or more selected characteristics, for creating respective images within the image fields of view. A preferred use of the present invention is in standard photolithographic manufacturing of an integrated circuit, where a semiconductor wafer device Ob includes a layer 136 of photoresist. Light produced by the object 128 is imaged onto the photoresist to expose the photoresist according to a defined pattern of circuit features known as a "mask" in the art of integrated circuit manufacture. However, it should be understood that the light may be imaged onto any device for any purpose without departing from the principles of the invention.
    • 多轴投影成像系统。 这样的系统包括限定相应的对象视场和对应的图像视场的多个目标(134a)。 物体(0)适于用在一个或多个所选特征中空间变化的光来可控地照亮物体视野,以在图像视场内创建各自的图像。 本发明的优选用途是集成电路的标准光刻制造,其中半导体晶片装置Ob包括光刻胶层136。 由物体128产生的光被成像到光致抗蚀剂上以根据集成电路制造领域中被称为“掩模”的已定义的电路特征图案曝光光致抗蚀剂。 然而,应当理解,在不脱离本发明的原理的情况下,光可以成像到任何设备上用于任何目的。