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    • 2. 发明申请
    • SYSTEM AND METHOD FOR OPTIMIZING CURRENT OVERLOAD PROTECTION CIRCUIT
    • 用于优化电流过载保护电路的系统和方法
    • US20110238233A1
    • 2011-09-29
    • US12774685
    • 2010-05-05
    • TSUNG-SHENG HUANGCHUN-JEN CHENDUEN-YI HOWEI-CHIEH CHOU
    • TSUNG-SHENG HUANGCHUN-JEN CHENDUEN-YI HOWEI-CHIEH CHOU
    • G06F19/00
    • G06F17/5063
    • A system for optimizing a current overload protection circuit includes an input device, a data storage device, a central processing device, and a display. The central processing device includes a storage module, a control module, and a calculation module. The storage module stores a VI application therein. The control module receives instructions from the input device and selects virtual electronic components of the current overload protection circuit from the data storage device and connection of the selected electronic components. The current overload protection circuit is completed and run in the VI application; electronic components significantly affecting the maximum protection current are labeled. The calculation module calculates normal distribution samples of the current overload protection circuit based on the labeled electronic components. The display shows whether the current overload protection circuit meets a process capability standard.
    • 用于优化电流过载保护电路的系统包括输入装置,数据存储装置,中央处理装置和显示器。 中央处理装置包括存储模块,控制模块和计算模块。 存储模块在其中存储VI应用。 控制模块从输入设备接收指令,并从数据存储设备中选择电流过载保护电路的虚拟电子部件,并选择电子部件的连接。 电流过载保护电路在VI应用中完成并运行; 显着影响最大保护电流的电子元件被标记。 计算模块基于标记的电子元件计算电流过载保护电路的正态分布样本。 显示屏显示电流过载保护电路是否符合过程能力标准。
    • 6. 发明申请
    • ELECTRONIC DEVICE AND SIMULATION METHOD FOR CHECKING PRINTED CIRCUIT BOARD POWER LOSS
    • 电子设备和模拟方法,用于检查印刷电路板的功率损耗
    • US20130007690A1
    • 2013-01-03
    • US13441849
    • 2012-04-07
    • TSUNG-SHENG HUANGCHUN-JEN CHENDUEN-YI HOWEI-CHIEH CHOUSHIN-TING YEN
    • TSUNG-SHENG HUANGCHUN-JEN CHENDUEN-YI HOWEI-CHIEH CHOUSHIN-TING YEN
    • G06F17/50
    • G06F17/5036G06F2217/78
    • An electronic device reads a layout file of a printed circuit board (PCB) to be manufactured from a storage device, obtains length information and section area information of copper cladding distributed on power source areas and ground trace areas in each of one or more layers of the PCB to be manufactured by analyzing the layout file, and calculates power loss in each of the one or more layers according to the length information, the section area information, a resistance value of the copper cladding, and preset parameters of a power supply module and an integrated circuit (IC) load to be located on the PCB. In response to a determination that the power loss in the layer exceeds a preset range, the electronic device indicates the locations of the power source areas and the ground trace areas of a layer in the PCB layout file which need to be redesigned.
    • 电子设备读取要从存储装置制造的印刷电路板(PCB)的布局文件,获得在一个或多个层中的每一个中的电源区域和地面迹线区域上分布的铜包层的长度信息和截面面积信息 通过分析布局文件来制造PCB,并且根据长度信息,截面面积信息,铜包层的电阻值和电源模块的预设参数来计算一个或多个层中的每一个中的功率损耗 以及位于PCB上的集成电路(IC)负载。 响应于层中的功率损耗超过预设范围的确定,电子设备指示需要重新设计的PCB布局文件中的层的电源区域和地面迹线区域的位置。