专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07201018B2 Generation and delivery system for high pressure ultra high purity product 失效
标题翻译：用于高压超高纯度产品的生成和输送系统
公开(公告)号：US07201018B2
公开(公告)日：2007-04-10
申请号：US10753315
申请日：2004-01-09
申请人： Vladimir Yliy Gershtein , Alexander Schwarz , Wayne Thomas McDermott , John Frederick Cirucci , John Christopher Ivankovits
发明人： Vladimir Yliy Gershtein , Alexander Schwarz , Wayne Thomas McDermott , John Frederick Cirucci , John Christopher Ivankovits
IPC分类号： F25J1/00 , F17C5/00 , F17C7/00
CPC分类号： F17C7/04 , C01B32/50 , F04B15/08 , F04B19/24 , F04D7/00 , F17C6/00 , F17C7/02 , F17C2221/013 , F17C2223/0153 , F17C2223/035 , F17C2223/036
摘要： The invention relates to a process and apparatus for delivering an ultra high purity fluid comprising at least one component to a point of use at a required pressure without mechanical pumping. In one embodiment, a high purity feed comprising at least one component in gaseous or liquid form is charged into a vessel and at least partially converted to a solid phase source. As the feed is converted to a solid phase source, additional feed may be added until the vessel is at least substantially filled with a solid phase source or slush. Once filled, the solid phase source or slush may be isochorically heated whereby the solid phase source is converted to a product at an elevated pressure.
摘要翻译：本发明涉及用于将包含至少一种组分的超高纯度流体在所需压力下输送到使用点而不进行机械泵送的方法和装置。在一个实施方案中，将包含至少一种气态或液态组分的高纯度原料装入容器中，并至少部分转化成固相源。当进料转化为固相源时，可以加入另外的进料，直到容器至少基本上用固相源或浆料填充。一旦填充，固相源或浆液可以被等压加热，从而固相源在升高的压力下转化成产物。

2. 发明授权

US08617352B2 Electrode assembly for the removal of surface oxides by electron attachment 有权
公开(公告)号：US08617352B2
公开(公告)日：2013-12-31
申请号：US12968607
申请日：2010-12-15
申请人： Chun Christine Dong , Wayne Thomas McDermott , Alexander Schwarz , Gregory Khosrov Arslanian , Richard E. Patrick , Gary A. Orbeck , Donald A. Seccombe, Jr.
发明人： Chun Christine Dong , Wayne Thomas McDermott , Alexander Schwarz , Gregory Khosrov Arslanian , Richard E. Patrick , Gary A. Orbeck , Donald A. Seccombe, Jr.
IPC分类号： C23F1/08
CPC分类号： H01J37/32431 , B23K1/008 , B23K1/206 , B23K35/268 , B23K35/38 , C23G5/00 , H01L21/31116 , H01L21/67069 , H01L2924/0002 , H01L2924/00
摘要： An apparatus and a method comprising same for removing metal oxides from a substrate surface are disclosed herein. In one particular embodiment, the apparatus comprises an electrode assembly that has a housing that is at least partially comprised of an insulating material and having an internal volume and at least one fluid inlet that is in fluid communication with the internal volume; a conductive base connected to the housing comprising a plurality of conductive tips that extend therefrom into a target area and a plurality of perforations that extend therethrough and are in fluid communication with the internal volume to allow for a passage of a gas mixture comprising a reducing gas.

3. 发明授权

US07282099B2 Dense phase processing fluids for microelectronic component manufacture 失效
标题翻译：用于微电子元件制造的密相加工液
公开(公告)号：US07282099B2
公开(公告)日：2007-10-16
申请号：US10253296
申请日：2002-09-24
申请人： Wayne Thomas McDermott , Richard Carl Ockovic , Alexander Schwarz
发明人： Wayne Thomas McDermott , Richard Carl Ockovic , Alexander Schwarz
IPC分类号： B08B3/00
CPC分类号： B08B7/0021 , Y10S438/906
摘要： Method for processing an article by contacting the article with a dense fluid. The article is introduced into a sealable processing chamber and the processing chamber is sealed. A dense fluid is prepared by introducing a subcritical fluid into a pressurization vessel and isolating the vessel, and then heating the subcritical fluid at essentially constant volume and essentially constant density to yield a dense fluid. At least a portion of the dense fluid is transferred from the pressurization vessel to the processing chamber, wherein the transfer of the dense fluid is driven by the difference between the pressure in the pressurization vessel and the pressure in the processing chamber, thereby pressurizing the processing chamber with transferred dense fluid. The article is contacted with the transferred dense fluid to yield a spent dense fluid and a treated article, and the spent dense fluid is separated from the treated article.
摘要翻译：通过使制品与致密流体接触来处理制品的方法。将物品引入可密封的处理室中，并且处理室被密封。通过将亚临界流体引入加压容器并分离容器，然后以基本上恒定的体积和基本上恒定的密度加热亚临界流体以产生致密的流体来制备致密流体。致密流体的至少一部分从加压容器转移到处理室，其中致密流体的转移由加压容器中的压力与处理室中的压力之间的差异驱动，由此加压处理室内转移致密流体。将物品与转移的致密流体接触以产生用过的致密流体和经处理的物品，并将废的致密流体与经处理的物品分离。

4. 发明授权

US08593778B2 Apparatus for removal of surface oxides via fluxless technique involving electron attachment and remote ion generation 有权
标题翻译：用于通过无电子技术去除表面氧化物的设备，涉及电子附着和远程离子生成
公开(公告)号：US08593778B2
公开(公告)日：2013-11-26
申请号：US13151883
申请日：2011-06-02
申请人： Chun Christine Dong , Wayne Thomas McDermott , Richard E. Patrick , Alexander Schwarz
发明人： Chun Christine Dong , Wayne Thomas McDermott , Richard E. Patrick , Alexander Schwarz
IPC分类号： H01T23/00
CPC分类号： C23G5/00 , B08B7/00 , B23K1/0016 , B23K1/008 , B23K1/012 , B23K1/206 , H05K3/3489 , H05K2203/095
摘要： The present invention provides a method and apparatus for the dry fluxing of at least one component and/or solder surface via electron attachment. In one embodiment, there is provided a method for removing oxides from the surface of a component comprising: providing a component on a substrate wherein the substrate is grounded or has a positive electrical potential to form a target assembly; passing a gas mixture comprising a reducing gas through an ion generator comprising a first and a second electrode; supplying an amount of voltage to at least one of the first and second electrodes sufficient to generate electrons wherein the electrons attach to at least a portion of the reducing gas and form a negatively charged reducing gas; and contacting the target assembly with the negatively charged reducing gas to reduce the oxides on the component.
摘要翻译：本发明提供了一种用于通过电子附件干燥熔化至少一种组分和/或焊料表面的方法和装置。在一个实施方案中，提供了从组分表面去除氧化物的方法，包括：在基底上提供组分，其中所述基底接地或具有正电位以形成靶组件; 使包含还原气体的气体混合物通过包括第一和第二电极的离子发生器; 向所述第一和第二电极中的至少一个电极供应足以产生电子的电压，其中所述电子附着到所述还原气体的至少一部分并形成带负电荷的还原气体; 并将目标组件与带负电荷的还原气体接触以减少部件上的氧化物。

5. 发明授权

US08119016B2 Removal of surface oxides by electron attachment for wafer bumping applications 有权
标题翻译：通过电子附着去除晶片碰撞应用中的表面氧化物
公开(公告)号：US08119016B2
公开(公告)日：2012-02-21
申请号：US12042055
申请日：2008-03-04
申请人： Chun Christine Dong , Wayne Thomas McDermott , Alexander Schwarz , Gregory Khosrov Arslanian , Richard E. Patrick
发明人： Chun Christine Dong , Wayne Thomas McDermott , Alexander Schwarz , Gregory Khosrov Arslanian , Richard E. Patrick
IPC分类号： B23K1/20
CPC分类号： H01J37/32431 , B23K1/008 , B23K1/206 , B23K35/268 , B23K35/38 , C23G5/00 , H01L21/31116 , H01L21/67069 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a method for removing metal oxides from a substrate surface. In one particular embodiment, the method comprises: providing a substrate, a first, and a second electrode that reside within a target area; passing a gas mixture comprising a reducing gas through the target area; supplying an amount of energy to the first and/or the second electrode to generate electrons within the target area wherein at least a portion of the electrons attach to a portion of the reducing gas and form a negatively charged reducing gas; and contacting the substrate with the negatively charged reducing gas to reduce the metal oxides on the surface of the substrate.
摘要翻译：本发明涉及从衬底表面去除金属氧化物的方法。在一个特定实施例中，该方法包括：提供驻留在目标区域内的衬底，第一和第二电极; 将包含还原气体的气体混合物通过所述目标区域; 向第一和/或第二电极提供一定量的能量以在目标区域内产生电子，其中至少一部分电子附着到一部分还原气体并形成带负电荷的还原气体; 并使基板与带负电荷的还原气体接触以减少基板表面上的金属氧化物。

6. 发明授权

US07883602B2 Electrode assembly for the removal of surface oxides by electron attachment 有权
标题翻译：用于通过电子附着去除表面氧化物的电极组件
公开(公告)号：US07883602B2
公开(公告)日：2011-02-08
申请号：US12188667
申请日：2008-08-08
申请人： Chun Christine Dong , Wayne Thomas McDermott , Alexander Schwarz , Gregory Khosrov Arslanian , Richard E. Patrick , Gary A. Orbeck , Donald A. Seccombe, Jr.
发明人： Chun Christine Dong , Wayne Thomas McDermott , Alexander Schwarz , Gregory Khosrov Arslanian , Richard E. Patrick , Gary A. Orbeck , Donald A. Seccombe, Jr.
IPC分类号： C23F1/08 , H01J37/32
CPC分类号： H01J37/32431 , B23K1/008 , B23K1/206 , B23K35/268 , B23K35/38 , C23G5/00 , H01L21/31116 , H01L21/67069 , H01L2924/0002 , H01L2924/00
摘要： An apparatus and a method comprising same for removing metal oxides from a substrate surface are disclosed herein. In one particular embodiment, the apparatus comprises an electrode assembly that has a housing that is at least partially comprised of an insulating material and having an internal volume and at least one fluid inlet that is in fluid communication with the internal volume; a conductive base connected to the housing comprising a plurality of conductive tips that extend therefrom into a target area and a plurality of perforations that extend therethrough and are in fluid communication with the internal volume to allow for a passage of a gas mixture comprising a reducing gas.
摘要翻译：本文公开了一种用于从衬底表面去除金属氧化物的装置和方法。在一个特定实施例中，该装置包括电极组件，该电极组件至少部分地由绝缘材料构成并具有内部容积和与内部容积流体连通的至少一个流体入口的壳体; 连接到壳体的导电基座包括从其延伸到目标区域中的多个导电尖端和穿过其延伸并与内部体积流体连通的多个穿孔，以允许包含还原气体的气体混合物通过。

7. 发明授权

US07977598B2 Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment and remote ion generation 有权
标题翻译：通过涉及电子附着和远程离子生成的无通量技术去除表面氧化物的装置和方法
公开(公告)号：US07977598B2
公开(公告)日：2011-07-12
申请号：US10819277
申请日：2004-04-07
申请人： Chun Christine Dong , Wayne Thomas McDermott , Richard E. Patrick , Alexander Schwarz
发明人： Chun Christine Dong , Wayne Thomas McDermott , Richard E. Patrick , Alexander Schwarz
IPC分类号： B23K1/00
CPC分类号： C23G5/00 , B08B7/00 , B23K1/0016 , B23K1/008 , B23K1/012 , B23K1/206 , H05K3/3489 , H05K2203/095
摘要： The present invention provides a method and apparatus for the dry fluxing of at least one component and/or solder surface via electron attachment. In one embodiment, there is provided a method for removing oxides from the surface of a component comprising: providing a component on a substrate wherein the substrate is grounded or has a positive electrical potential to form a target assembly; passing a gas mixture comprising a reducing gas through an ion generator comprising a first and a second electrode; supplying an amount of voltage to at least one of the first and second electrodes sufficient to generate electrons wherein the electrons attach to at least a portion of the reducing gas and form a negatively charged reducing gas; and contacting the target assembly with the negatively charged reducing gas to reduce the oxides on the component.
摘要翻译：本发明提供了一种用于通过电子附件干燥熔化至少一种组分和/或焊料表面的方法和装置。在一个实施方案中，提供了从组分表面去除氧化物的方法，包括：在基底上提供组分，其中所述基底接地或具有正电位以形成靶组件; 使包含还原气体的气体混合物通过包括第一和第二电极的离子发生器; 向所述第一和第二电极中的至少一个电极供应足以产生电子的电压，其中所述电子附着到所述还原气体的至少一部分并形成带负电荷的还原气体; 并将目标组件与带负电荷的还原气体接触以减少部件上的氧化物。

8. 发明申请

US20110094679A1 ELECTRODE ASSEMBLY FOR THE REMOVAL OF SURFACE OXIDES BY ELECTRON ATTACHMENT 有权
标题翻译：电极组件用于通过电子附件去除表面氧化物
公开(公告)号：US20110094679A1
公开(公告)日：2011-04-28
申请号：US12968607
申请日：2010-12-15
申请人： Chun Christine Dong , Wayne Thomas McDermott , Alexander Schwarz , Gregory Khosrov Arslanian , Richard E. Patrick , Gary A. Orbeck , Donald A. Seccombe, JR.
发明人： Chun Christine Dong , Wayne Thomas McDermott , Alexander Schwarz , Gregory Khosrov Arslanian , Richard E. Patrick , Gary A. Orbeck , Donald A. Seccombe, JR.
IPC分类号： C23F1/08
CPC分类号： H01J37/32431 , B23K1/008 , B23K1/206 , B23K35/268 , B23K35/38 , C23G5/00 , H01L21/31116 , H01L21/67069 , H01L2924/0002 , H01L2924/00
摘要： An apparatus and a method comprising same for removing metal oxides from a substrate surface are disclosed herein. In one particular embodiment, the apparatus comprises an electrode assembly that has a housing that is at least partially comprised of an insulating material and having an internal volume and at least one fluid inlet that is in fluid communication with the internal volume; a conductive base connected to the housing comprising a plurality of conductive tips that extend therefrom into a target area and a plurality of perforations that extend therethrough and are in fluid communication with the internal volume to allow for a passage of a gas mixture comprising a reducing gas.
摘要翻译：本文公开了一种用于从衬底表面去除金属氧化物的装置和方法。在一个特定实施例中，该装置包括电极组件，该电极组件至少部分地由绝缘材料构成并具有内部容积和与内部容积流体连通的至少一个流体入口的壳体; 连接到壳体的导电基座包括从其延伸到目标区域中的多个导电尖端和穿过其延伸并与内部体积流体连通的多个穿孔，以允许包含还原气体的气体混合物通过。

9. 发明授权

US06383257B1 Reclamation and separation of perfluorocarbons using condensation 失效
标题翻译：采用冷凝法回收和分离全氟化碳
公开(公告)号：US06383257B1
公开(公告)日：2002-05-07
申请号：US09542995
申请日：2000-04-04
申请人： Wayne Thomas McDermott , Richard Carl Ockovic , Alexander Schwarz , Rakesh Agrawal
发明人： Wayne Thomas McDermott , Richard Carl Ockovic , Alexander Schwarz , Rakesh Agrawal
IPC分类号： B01D5322
CPC分类号： B01D53/229 , B01D53/002 , B01D53/04 , B01D53/053 , B01D53/14 , B01D2256/24 , B01D2258/0216 , B01D2259/40001 , Y02C20/10 , Y02C20/30
摘要： An apparatus and process for separating perfluorocarbon compounds from a gas mixture passes an incoming stream of a gas into a cold trap, the gas stream including a plurality of perfluorocarbon compounds. The gas mixture is cooled within the cold trap to a temperature below −100° C. to produce a condensate that is enriched in at least one perfluorocarbon compound and a non-condensed stream from which the condensate was separated. The condensate is withdrawn from the cold trap. The condensate may be withdrawn by warming the cold trap to vaporize the condensate and thereafter flowing the vaporized condensate into a storage vessel. The non-condensed stream may be vented to the atmosphere, re-circulated into the cold trap or flowed through subsequent separation processes to extract additional perfluorocarbon compounds.
摘要翻译：用于从气体混合物中分离全氟化碳化合物的装置和方法将气体的进入流通入冷阱，该气流包括多个全氟化碳化合物。将气体混合物在冷阱内冷却至低于-100℃的温度，以产生富含至少一种全氟化碳化合物的冷凝物和从其中分离出冷凝物的非冷凝物流。冷凝水从冷阱中取出。可以通过加热冷阱来蒸发冷凝物，然后将蒸发的冷凝物流入储存容器中，从而将冷凝物抽出。非冷凝流可以排放到大气中，再循环到冷阱中或者通过随后的分离过程流出以提取另外的全氟化碳化合物。

10. 发明申请

US20110229377A1 Apparatus for Removal of Surface Oxides via Fluxless Technique Involving Electron Attachment and Remote Ion Generation 有权
标题翻译：用于通过无电极技术去除表面氧化物的装置，涉及电子附件和远程离子生成
公开(公告)号：US20110229377A1
公开(公告)日：2011-09-22
申请号：US13151883
申请日：2011-06-02
申请人： Chun Christine Dong , Wayne Thomas McDermott , Richard E. Patrick , Alexander Schwarz
发明人： Chun Christine Dong , Wayne Thomas McDermott , Richard E. Patrick , Alexander Schwarz
IPC分类号： B01J19/08
CPC分类号： C23G5/00 , B08B7/00 , B23K1/0016 , B23K1/008 , B23K1/012 , B23K1/206 , H05K3/3489 , H05K2203/095
摘要： The present invention provides a method and apparatus for the dry fluxing of at least one component and/or solder surface via electron attachment. In one embodiment, there is provided a method for removing oxides from the surface of a component comprising: providing a component on a substrate wherein the substrate is grounded or has a positive electrical potential to form a target assembly; passing a gas mixture comprising a reducing gas through an ion generator comprising a first and a second electrode; supplying an amount of voltage to at least one of the first and second electrodes sufficient to generate electrons wherein the electrons attach to at least a portion of the reducing gas and form a negatively charged reducing gas; and contacting the target assembly with the negatively charged reducing gas to reduce the oxides on the component.
摘要翻译：本发明提供了一种用于通过电子附件干燥熔化至少一种组分和/或焊料表面的方法和装置。在一个实施方案中，提供了从组分表面去除氧化物的方法，包括：在基底上提供组分，其中所述基底接地或具有正电位以形成靶组件; 使包含还原气体的气体混合物通过包括第一和第二电极的离子发生器; 向所述第一和第二电极中的至少一个电极供应足以产生电子的电压，其中所述电子附着到所述还原气体的至少一部分并形成带负电荷的还原气体; 并将目标组件与带负电荷的还原气体接触以减少部件上的氧化物。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式