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    • 2. 发明授权
    • Card guide with groove having a base portion and ramped portion which
restrains an electronic card
    • 具有凹槽的卡导向件具有基部和限制电子卡的倾斜部分
    • US5680296A
    • 1997-10-21
    • US551774
    • 1995-11-07
    • Vince HilemanKenneth KitlasClifford B. Willis
    • Vince HilemanKenneth KitlasClifford B. Willis
    • H05K7/14H05K5/00
    • H05K7/1405
    • A card guide that both restrains an installed electronic card and allows the card to be inserted into a computer chassis in a direction that is parallel to the motherboard of the computer. The card guide extends from a beam that is cantilevered from a frame of a computer chassis. The card guide has a groove that guides an edge of the electronic card so that the card is aligned with a connector of the motherboard. The card guide also has a ramp that guides the card into the groove in a direction parallel with the motherboard and perpendicular to the groove. The card is installed by initially pushing the electronic card along the ramp until the edge of the card snaps into the groove. The cantilevered beam is deflected by the installation force of the user to allow the card to move down the ramp. Once in the groove the electronic card is pushed in a direction perpendicular to the motherboard to plug the card into the motherboard connector. A corner of the installed electronic card is restrained from movement by a ramped portion of the groove. The electronic card is removed from the chassis by sliding the card corner along the ramped portion. The movement of the corner up the ramped portion deflects the beam so that the electronic card can be removed from the chassis in a direction parallel with the motherboard.
    • 卡片指南既限制已安装的电子卡片,并允许将卡片以与计算机主板平行的方向插入计算机机箱。 卡引导件从悬臂梁从计算机机架的框架延伸。 卡引导件具有引导电子卡片的边缘的凹槽,使得卡片与主板的连接器对准。 卡引导件还具有斜槽,该斜坡沿着与母板平行并垂直于凹槽的方向将卡引导到凹槽中。 通过沿着斜坡推动电子卡直到卡的边缘卡入槽中来安装卡。 悬臂梁被用户的安装力偏转,以允许卡沿斜坡向下移动。 一旦在凹槽中,电子卡被按与母板垂直的方向推动,将卡插入主板连接器。 所安装的电子卡的角落被槽的斜坡部分限制运动。 通过沿着斜坡部分滑动卡片角部,将电子卡从机箱中取出。 角部向上倾斜部分的运动使光束偏转,使得电子卡可以在与主板平行的方向上从底盘移除。
    • 4. 发明授权
    • Method to install SIMMs without causing discomfort to the user
    • 安装SIMM而不会给用户带来不适的方法
    • US5734551A
    • 1998-03-31
    • US556732
    • 1995-11-07
    • Vince HilemanKenneth Kitlas
    • Vince HilemanKenneth Kitlas
    • G06F1/18H05K7/14H05K7/20
    • G06F1/185G06F1/184G06F1/186H05K7/1408
    • A computer chassis cover that pushes an electronic card into a motherboard. The cover is pivotally connected to the chassis and can be rotated between an open position and a closed position. The cover encloses an electronic card that is plugged into a motherboard. When in the closed position, the inner surface of the cover is separated from the motherboard by a distance that is approximately equal to the distance between the motherboard and a top edge of the electronic card. When the cover is in the closed position the card is pushed into a fully mated position when the card is in a fully mated position. If the electronic card is higher than the fully mated position, the cover will engage and push the card into the motherboard. To install an electronic card, the card is initially partially plugged into a connector mounted to the motherboard. The cover is then rotated into the closed position to engage and push the electronic card further into the motherboard connector to the fully mated position. The cover has wide handle area that widely distributes the insertion force of the card. The distributed force reduces the end user discomfort when pushing the card into the motherboard.
    • 将电子卡推入主板的电脑机箱盖。 盖子枢转地连接到底盘并且可以在打开位置和关闭位置之间旋转。 封面包含插入主板的电子卡。 当处于关闭位置时,盖子的内表面与主板分离大约等于母板与电子卡片顶边之间距离的距离。 当盖处于关闭位置时,当卡处于完全配合位置时,卡被推入完全配合的位置。 如果电子卡高于完全匹配的位置,则盖子将卡入卡并将其推入主板。 要安装电子卡,卡片最初部分插入到安装在主板上的连接器中。 然后将盖旋转到关闭位置,以将电子卡进一步接合并进一步推入母板连接器中至完全配合的位置。 盖子具有宽的手柄区域,广泛地分配卡片的插入力。 当将卡推入主板时,分布式力会降低终端用户的不适感。
    • 5. 发明授权
    • Computer system cooling configuration
    • 电脑系统冷却配置
    • US06272007B1
    • 2001-08-07
    • US09340962
    • 1999-06-28
    • Kenneth KitlasAnita PatelSatyanarayana NishtalaAlan Lee WinickAlan LamWiniie C. LeungKenneth A. LownMohammed Tantoush
    • Kenneth KitlasAnita PatelSatyanarayana NishtalaAlan Lee WinickAlan LamWiniie C. LeungKenneth A. LownMohammed Tantoush
    • G06F116
    • G06F1/185G06F1/181G06F1/184G06F1/186G06F1/20
    • A computer system housing where a vertical printed circuit board, e.g., a riser card, is inserted into a socket on a computer system motherboard. Some internal space within the housing may allow optimization of system memory capacity through packing of additional memory modules on the riser card. The additional memory may be mounted on the riser card and may reside in the vertical space created between the riser card and the directly-mounted memory on the motherboard. The computer system housing further includes a chassis that may be partitioned into two separate sub-chassis for proper positioning of one or more cooling fans as well as to accommodate changes in computer system configurations with minimized retooling of the chassis. The cooling fans may be mounted at such locations on the chassis that allow optimization of air circulation and, hence, cooling within the housing. However, extra cooling fan(s) for the additional memory on the riser card may not be necessary in view of the creation of dedicated cooling channels within the housing by an efficient placement of the cooling fans. The optimization of fan placement within the housing results in efficient cooling of various system components and allows for increase in system component packing density without a similar increase in the number of cooling fans.
    • 一种将垂直印刷电路板(例如转接卡)插入计算机系统主板上的插座的计算机系统外壳。 外壳内的一些内部空间可以通过在转接卡上包装附加的存储器模块来优化系统存储器容量。 附加存储器可以安装在转接卡上,并且可以位于在转接卡和主板上直接安装的存储器之间产生的垂直空间中。 计算机系统壳体还包括可以被划分成两个单独的子机架以用于一个或多个冷却风扇的适当定位的底盘,以及通过最小化底盘重新装配来适应计算机系统配置的变化。 冷却风扇可以安装在底盘上的这样的位置,从而优化空气循环,从而优化壳体内的冷却。 然而,考虑到通过冷却风扇的有效放置在壳体内创建专用冷却通道,可能不需要用于转接卡上的附加存储器的额外的冷却风扇。 在壳体内优化风扇放置结果可以有效地冷却各种系统组件,并且可以增加系统组件的封装密度,而不会有类似的冷却风扇数量的增加。
    • 10. 发明授权
    • Computer system motherboard stiffener
    • 电脑系统主板加强筋
    • US06362968B1
    • 2002-03-26
    • US09340961
    • 1999-06-28
    • Robert J. LajaraHassan SiahpoloRonald BarnesKenneth Kitlas
    • Robert J. LajaraHassan SiahpoloRonald BarnesKenneth Kitlas
    • H05K714
    • G06F1/184H05K1/0271H05K1/18H05K7/1461H05K2201/044H05K2201/2009H05K2201/2018
    • A stiffener for a printed circuit board where the stiffener is placed between the printed circuit board and a wall of the metal chassis in a computer system housing. The loaded printed circuit board may first be mounted on the stiffener, which, in turn, may then be mounted on the appropriate wall of the chassis along with the circuit board. Alternately, the stiffener may first be mounted on the appropriate chassis wall, and the circuit board may then be mounted on the stiffener. Additional circuit components may then be added onto the circuit board. The lies between the circuit board and the wall of the chassis on which the circuit board is being mounted. The back plane support provided by the stiffener may reduce damage to the conducting paths of the printed circuit board due to pressures exerted during component mounting, manufacture, transportation, etc. Additionally, a circuit board carrying densely populated electronic components may be easily mounted on or removed from the chassis without damage. Adequate board-to-chassis grounding may also be accomplished through the sheet metal stiffener frame. Horizontal and vertical struts in the stiffener frame may provide additional stiffness and rigidity in the vicinity of the high density connectors on the circuit board. Besides increased stability, unusually tight tolerances on the flatness of the circuit board surface near high density connectors may be achieved with the support provided by the stiffener.
    • 用于印刷电路板的加强件,其中加强件位于印刷电路板和计算机系统外壳中金属底盘的壁之间。 装载的印刷电路板可以首先安装在加强件上,然后可以将其与电路板一起安装在底盘的适当壁上。 或者,加强件可以首先安装在适当的底盘壁上,然后将电路板安装在加强件上。 然后可以将附加的电路部件添加到电路板上。 电路板和电路板正在安装的底盘的墙壁之间。 由加强件提供的背板支撑件可能由于在部件安装,制造,运输等过程中施加的压力而降低对印刷电路板的导电路径的损坏。此外,携带密集的电子部件的电路板可以容易地安装在 从机箱中取出而不损坏。 还可以通过金属板加强筋框架来实现足够的板对底盘接地。 加强框架中的水平和垂直支柱可以在电路板上的高密度连接器附近提供额外的刚度和刚性。 除了增加的稳定性之外,通过加强件提供的支撑可以实现在高密度连接器附近的电路板表面的平坦度上的非常紧密的公差。