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    • 5. 发明授权
    • Method of making through-hole vias in a substrate
    • 在基板上制作通孔的方法
    • US07814652B2
    • 2010-10-19
    • US12180169
    • 2008-07-25
    • Colby BellewBoyce E. CollinsKelvin Liu
    • Colby BellewBoyce E. CollinsKelvin Liu
    • H01R43/00
    • G01N29/223B06B1/0292G01N29/02G01N29/022G01N29/222G01N2291/014G01N2291/0255G01N2291/0256G01N2291/02818G01N2291/0423G01N2291/0427G01N2291/106Y10T29/49126Y10T29/49128Y10T29/4913Y10T29/49169Y10T29/53052
    • A sensor assembly for sensors such as microfabricated resonant sensors is disclosed. The disclosed assembly provides improved performance of the sensors by providing a thermally insensitive environment and short pathways for signals to travel to processing components. Further, the assembly provide modular construction for the sensors and housing modules, thereby allowing replacement of the sensors at a lower cost. The assembly includes a sensor module including a sensor formed on a conductive substrate with a cavity formed on one surface. The substrate has conductive vias extending from the cavity to a second surface of the substrate. A housing assembly accommodates the sensor and includes a rigid housing, preferably made from a ceramic. An electronic component, such as an amplifier, is mounted on the rigid housing. The electronic component electrically engages the vias substantially at the second surface of the substrate. The electronic component receive signals from the sensor through the vias. The signals are then processed through an amplifier and a digital signal processor using a modified periodogram.
    • 公开了一种用于诸如微结构谐振传感器的传感器的传感器组件。 所公开的组件通过提供热不敏感的环境和用于信号行进到处理部件的短路径来提供传感器的改进的性能。 此外,组件为传感器和壳体模块提供模块化结构,从而以更低的成本实现更换传感器。 该组件包括传感器模块,该传感器模块包括形成在一个表面上形成有空腔的导电基底上的传感器。 衬底具有从腔体延伸到衬底的第二表面的导电通孔。 壳体组件容纳传感器并且包括优选由陶瓷制成的刚性壳体。 诸如放大器的电子部件安装在刚性壳体上。 电子部件基本上在基板的第二表面上电接合通孔。 电子部件通过通孔从传感器接收信号。 然后通过放大器和使用改进的周期图的数字信号处理器处理信号。
    • 6. 发明申请
    • SUBSTRATES HAVING THROUGH-HOLE VIAS AND METHOD OF MAKING SAME
    • 具有贯通孔VIAS的基板及其制造方法
    • US20090074951A1
    • 2009-03-19
    • US12180169
    • 2008-07-25
    • Colby BellewBoyce E. CollinsKelvin Liu
    • Colby BellewBoyce E. CollinsKelvin Liu
    • B05D5/12
    • G01N29/223B06B1/0292G01N29/02G01N29/022G01N29/222G01N2291/014G01N2291/0255G01N2291/0256G01N2291/02818G01N2291/0423G01N2291/0427G01N2291/106Y10T29/49126Y10T29/49128Y10T29/4913Y10T29/49169Y10T29/53052
    • A sensor assembly for sensors such as microfabricated resonant sensors is disclosed. The disclosed assembly provides improved performance of the sensors by providing a thermally insensitive environment and short pathways for signals to travel to processing components. Further, the assembly provide modular construction for the sensors and housing modules, thereby allowing replacement of the sensors at a lower cost. The assembly includes a sensor module including a sensor formed on a conductive substrate with a cavity formed on one surface. The substrate has conductive vias extending from the cavity to a second surface of the substrate. A housing assembly accommodates the sensor and includes a rigid housing, preferably made from a ceramic. An electronic component, such as an amplifier, is mounted on the rigid housing. The electronic component electrically engages the vias substantially at the second surface of the substrate. The electronic component receive signals from the sensor through the vias. The signals are then processed through an amplifier and a digital signal processor using a modified periodogram.
    • 公开了一种用于诸如微结构谐振传感器的传感器的传感器组件。 所公开的组件通过提供热不敏感的环境和用于信号行进到处理部件的短路径来提供传感器的改进的性能。 此外,组件为传感器和壳体模块提供模块化结构,从而以更低的成本实现更换传感器。 该组件包括传感器模块,该传感器模块包括形成在一个表面上形成有空腔的导电基底上的传感器。 衬底具有从腔体延伸到衬底的第二表面的导电通孔。 壳体组件容纳传感器并且包括优选由陶瓷制成的刚性壳体。 诸如放大器的电子部件安装在刚性壳体上。 电子部件基本上在基板的第二表面上电接合通孔。 电子部件通过通孔从传感器接收信号。 然后通过放大器和使用改进的周期图的数字信号处理器处理信号。