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1. 发明授权

US07214100B1 Cable assembly 失效
标题翻译：电缆组件
公开(公告)号：US07214100B1
公开(公告)日：2007-05-08
申请号：US11273302
申请日：2005-11-14
申请人： Vic Hong Chia , Martha G. Peterson , Robert W. Skoog , Terrel L. Morris
发明人： Vic Hong Chia , Martha G. Peterson , Robert W. Skoog , Terrel L. Morris
IPC分类号： H01R25/00
CPC分类号： H05K7/1492
摘要： A cable assembly comprising a hollow sleeve, an electrical conductor within the hollow sleeve, and first and second connectors on opposing ends of the electrical conductor that are fastened to opposing ends of the sleeve. The first connector is adapted to blind-mate to a corresponding connector in a cabinet backplane and the second connector is adapted to couple to an electronic device to be installed in the cabinet. Power is provided from the backplane to the electronic device via the electrical conductor. The hollow sleeve is disposed within a tunnel supported by the cabinet. The hollow sleeve has a length greater than that of the tunnel such that the first connector protrudes from a first opening of the tunnel and the second connector protrudes from a second opening of the tunnel.
摘要翻译：一种电缆组件，包括中空套管，中空套管内的电导体，以及紧固到套筒的相对端部的电导体的相对端上的第一和第二连接器。第一连接器适于与机柜背板中的相应连接器盲配，并且第二连接器适于耦合到要安装在机柜中的电子设备。电源通过电导体从背板提供给电子设备。中空套筒设置在由机柜支撑的隧道内。所述中空套筒的长度大于所述隧道的长度，使得所述第一连接器从所述隧道的第一开口突出，并且所述第二连接器从所述隧道的第二开口突出。

2. 发明申请

US20120020022A1 PRINTED CIRCUIT BOARD COOLING ASSEMBLY 有权
标题翻译：印刷电路板冷却总成
公开(公告)号：US20120020022A1
公开(公告)日：2012-01-26
申请号：US13258521
申请日：2009-04-29
申请人： Eric C. Peterson , Brandon Rubenstein , Vic Hong Chia
发明人： Eric C. Peterson , Brandon Rubenstein , Vic Hong Chia
IPC分类号： H05K7/20 , H05K3/30
CPC分类号： G06F1/20 , H01L23/4093 , H01L23/427 , H01L23/473 , H01L2924/0002 , Y10T29/4913 , H01L2924/00
摘要： A cooling apparatus for a printed circuit board assembly is disclosed. The cooling apparatus comprises a main printed circuit (PC) board 202. The main PC board 202 has a plurality of connectors 210 mounted, in a parallel row, onto the top side of the main PC board 202. A first liquid cooling manifold 204 is positioned along one end of the parallel row of connectors 210 and a second liquid cooling manifold 206 is positioned along the other end of the parallel row of connectors 210. A plurality of heat sink devices 208, each having an elongated shape, run parallel to, and on each side of, the plurality of connectors 210. The plurality of heat sink devices 208 are coupled to the first and second liquid cooling manifolds.
摘要翻译：公开了一种用于印刷电路板组件的冷却装置。冷却装置包括主印刷电路板（PC）板202.主PC板202具有多个连接器210，并排安装在主PC板202的上侧。第一液体冷却歧管204是沿着平行的连接器列210的一端定位，并且第二液体冷却歧管206沿着平行排的连接器210的另一端定位。多个散热装置208各自具有细长形状，并且在多个连接器210的每一侧上。多个散热装置208联接到第一和第二液体冷却歧管。

3. 发明申请

US20190357383A1 CONFIGURABLE LINE CARD FLAPPER 审中-公开
公开(公告)号：US20190357383A1
公开(公告)日：2019-11-21
申请号：US15983305
申请日：2018-05-18
申请人： Mandy Hin Lam , Vic Hong Chia , M. Baris Dogruoz
发明人： Mandy Hin Lam , Vic Hong Chia , M. Baris Dogruoz
IPC分类号： H05K7/20
摘要： According to one aspect, an apparatus includes a first component, a plurality of line card slots, a fan array, and a sensor arrangement. The first component has a first opening defined therein and a second opening defined therein. The first component includes a first configurable line card flapper is arranged to at least partially cover the first opening and a second configurable line card flapper is arranged to at least partially cover the second opening. The plurality of line card slots includes a first line card slot associated with the first opening and a second line card slot associated with the second opening. The fan array includes a plurality of fans. The sensor arrangement includes at least one sensor arranged to monitor at least one condition. The first and second configurable line card flappers are arranged to be configured using information obtained from the sensor arrangement.

4. 发明授权

US08599557B2 Printed circuit board cooling assembly 有权
标题翻译：印刷电路板冷却组件
公开(公告)号：US08599557B2
公开(公告)日：2013-12-03
申请号：US13258521
申请日：2009-04-29
申请人： Eric C. Peterson , Brandon Rubenstein , Vic Hong Chia
发明人： Eric C. Peterson , Brandon Rubenstein , Vic Hong Chia
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , H01L23/4093 , H01L23/427 , H01L23/473 , H01L2924/0002 , Y10T29/4913 , H01L2924/00
摘要： A cooling apparatus for a printed circuit board assembly is disclosed. The cooling apparatus comprises a main printed circuit (PC) board 202. The main PC board 202 has a plurality of connectors 210 mounted, in a parallel row, onto the top side of the main PC board 202. A first liquid cooling manifold 204 is positioned along one end of the parallel row of connectors 210 and a second liquid cooling manifold 206 is positioned along the other end of the parallel row of connectors 210. A plurality of heat sink devices 208, each having an elongated shape, run parallel to, and on each side of, the plurality of connectors 210. The plurality of heat sink devices 208 are coupled to the first and second liquid cooling manifolds.
摘要翻译：公开了一种用于印刷电路板组件的冷却装置。冷却装置包括主印刷电路板（PC）板202.主PC板202具有多个连接器210，并排安装在主PC板202的上侧。第一液体冷却歧管204是沿着平行的连接器列210的一端定位，并且第二液体冷却歧管206沿着平行排的连接器210的另一端定位。多个散热装置208各自具有细长形状，并且在多个连接器210的每一侧上。多个散热装置208联接到第一和第二液体冷却歧管。

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