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1. 发明申请

US20070063352A1 ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER 有权
标题翻译：用于替代互连层的BOND PAD路由器
公开(公告)号：US20070063352A1
公开(公告)日：2007-03-22
申请号：US11469960
申请日：2006-09-05
申请人： Vance Archer , Michael Ayukawa , Mark Bachman , Daniel Chesire , Seung Kang , Taeho Kook , Sailesh Merchant , Kurt Steiner
发明人： Vance Archer , Michael Ayukawa , Mark Bachman , Daniel Chesire , Seung Kang , Taeho Kook , Sailesh Merchant , Kurt Steiner
IPC分类号： H01L23/48
CPC分类号： H01L24/13 , H01L24/11 , H01L2224/0231 , H01L2224/0401 , H01L2224/05124 , H01L2224/05155 , H01L2224/05166 , H01L2224/05181 , H01L2224/05556 , H01L2224/05572 , H01L2224/05647 , H01L2224/05666 , H01L2224/13007 , H01L2224/13099 , H01L2224/131 , H01L2224/16 , H01L2924/0001 , H01L2924/00014 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01073 , H01L2924/01076 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/14 , H01L2224/05552 , H01L2924/013
摘要： The present invention provides a solder bump structure. In one aspect, the solder bump structure is utilized in a semiconductor device, such as an integrated circuit. The semiconductor device comprises active devices located over a semiconductor substrate, interconnect layers comprising copper formed over the active devices, and an outermost metallization layer positioned over the interconnect layers. The outermost metallization layer comprises aluminum and includes at least one bond pad and at least one interconnect runner each electrically connected to an interconnect layer. An under bump metallization layer (UBM) is located over the bond pad, and a solder bump is located over the UBM.
摘要翻译：本发明提供一种焊料凸块结构。在一个方面，焊料凸块结构用于诸如集成电路的半导体器件中。半导体器件包括位于半导体衬底之上的有源器件，包括形成在有源器件上的铜的互连层以及位于互连层上的最外层金属化层。最外面的金属化层包括铝，并且包括至少一个接合焊盘和至少一个互连转子，每一个电连接到互连层。凹凸金属化层（UBM）位于接合焊盘上方，焊料凸块位于UBM上方。

2. 发明申请

US20060066327A1 Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process 有权
标题翻译：在执行倒装芯片碰撞处理之前测试半导体晶片的方法和结构
公开(公告)号：US20060066327A1
公开(公告)日：2006-03-30
申请号：US10953291
申请日：2004-09-29
申请人： Mark Bachman , Daniel Chesire , Taeho Kook , Sailesh Merchant
发明人： Mark Bachman , Daniel Chesire , Taeho Kook , Sailesh Merchant
IPC分类号： G01R31/02
CPC分类号： H01L24/10 , H01L22/32 , H01L24/13 , H01L2224/0392 , H01L2224/05147 , H01L2224/05548 , H01L2224/05568 , H01L2224/05573 , H01L2224/0558 , H01L2224/056 , H01L2224/05624 , H01L2224/13 , H01L2224/13099 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/00 , H01L2924/00014
摘要： An interface assembly (20) and method for testing a semiconductor wafer prior to performing a flip chip bumping process are provided. The interface assembly includes a flip chip bonding pad (24) having a region (28) for performing the bumping process. A test pad (22) is integrally constructed with the bonding pad and includes a probe region (26) for performing wafer-level testing prior to performing the bumping process. The integral construction of the bonding and testing pads avoids, for example, an introduction of propagation delays to test signals passing therethrough, thereby improving the accuracy and reliability of wafer test results.
摘要翻译：提供了一种用于在执行倒装芯片碰撞处理之前测试半导体晶片的界面组件（20）和方法。接口组件包括具有用于执行碰撞处理的区域（28）的倒装芯片焊盘（24）。测试焊盘（22）与接合焊盘一体构成，并且包括用于在执行碰撞过程之前进行晶片级测试的探针区域（26）。焊接和测试焊盘的整体结构避免了例如引入传播延迟来测试通过其的信号，从而提高了晶片测试结果的准确性和可靠性。

3. 发明申请

US20050067709A1 Methods and system for reinforcing a bond pad 有权
标题翻译：用于加固粘结垫的方法和系统
公开(公告)号：US20050067709A1
公开(公告)日：2005-03-31
申请号：US10675260
申请日：2003-09-30
申请人： Mark Bachman , Daniel Chesire , Sailesh Merchant , John Osenbach , Kurt Steiner
发明人： Mark Bachman , Daniel Chesire , Sailesh Merchant , John Osenbach , Kurt Steiner
IPC分类号： H01L21/60 , H01L23/00 , H01L23/485 , H01L23/48
CPC分类号： H01L24/05 , H01L21/768 , H01L23/562 , H01L24/03 , H01L2224/02166 , H01L2224/0401 , H01L2224/04042 , H01L2224/05082 , H01L2224/05093 , H01L2224/05558 , H01L2224/05567 , H01L2224/05624 , H01L2224/05647 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/14 , H01L2224/05552
摘要： Disclosed herein is a reinforcing system and method for reinforcing a contact pad of an integrated circuit. Specifically exemplified is a system and method that comprises a reinforcing structure interposed between a top contact pad layer and an underlying metal layer.
摘要翻译：本文公开了一种用于加强集成电路的接触焊盘的增强系统和方法。具体示出的是包括插入在顶部接触垫层和下面的金属层之间的加强结构的系统和方法。

4. 发明申请

US20070069394A1 SOLDER BUMP STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURE THEREFORE 有权
标题翻译：片状半导体器件的焊接结构及其制造方法
公开(公告)号：US20070069394A1
公开(公告)日：2007-03-29
申请号：US11459249
申请日：2006-07-21
申请人： Mark Bachman , Donald Bitting , Sailesh Chittipeddi , Seung Kang , Sailesh Merchant
发明人： Mark Bachman , Donald Bitting , Sailesh Chittipeddi , Seung Kang , Sailesh Merchant
IPC分类号： H01L23/48
CPC分类号： H01L24/14 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/02125 , H01L2224/0401 , H01L2224/05006 , H01L2224/05022 , H01L2224/05093 , H01L2224/05096 , H01L2224/05556 , H01L2224/05568 , H01L2224/13007 , H01L2224/13023 , H01L2224/13099 , H01L2224/131 , H01L2224/13111 , H01L2224/13139 , H01L2224/13147 , H01L2924/0001 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/14 , H01L2924/00012 , H01L2224/05552
摘要： The invention provides, in one aspect, a semiconductor device that comprises an interconnect layer located over a semiconductor substrate. A passivation layer is located over the interconnect layer and having a solder bump support opening formed therein. Support pillars that comprise a conductive material are located within the solder bump support opening.
摘要翻译：本发明在一个方面提供一种半导体器件，其包括位于半导体衬底之上的互连层。钝化层位于互连层上并且具有形成在其中的焊料凸块支撑开口。包括导电材料的支撑柱位于焊料凸块支撑开口内。

5. 发明授权

US09641174B2 Use of micro-structured plate for controlling capacitance of mechanical capacitor switches 有权
公开(公告)号：US09641174B2
公开(公告)日：2017-05-02
申请号：US13444753
申请日：2012-04-11
申请人： Mark Bachman , Guann-Pyng Li , Yang Zhang , Ruisheng Chang , Minfeng Wang , Sungjun Kim
发明人： Mark Bachman , Guann-Pyng Li , Yang Zhang , Ruisheng Chang , Minfeng Wang , Sungjun Kim
IPC分类号： H01H51/22 , H03K17/975
CPC分类号： H03K17/975
摘要： Micro capacitive switches and methods of manufacturing micro capacitive switches at variable nominal capacitance value using micro-structures on the contact plates of the same dimension. In a preferred embodiment, a separately manufactured contact plate can be mounted to a movable magnet in order to be actuated to “on” and “off” state of the capacitive switch. Depending on the contact plate's surface condition, variable contact capacitance at “on” state can be precisely specified by geometrical properties of the micro-structures on the surface, such as the density, size and depth.

6. 发明授权

US09443821B2 Pb-free solder bumps with improved mechanical properties 有权
标题翻译：无铅焊料凸块具有改善的机械性能
公开(公告)号：US09443821B2
公开(公告)日：2016-09-13
申请号：US14294932
申请日：2014-06-03
申请人： Mark Bachman , John W. Osenbach
发明人： Mark Bachman , John W. Osenbach
IPC分类号： H01L21/44 , H01L23/00
CPC分类号： H01L24/81 , H01L24/11 , H01L24/13 , H01L2224/05155 , H01L2224/05572 , H01L2224/05573 , H01L2224/0558 , H01L2224/056 , H01L2224/13099 , H01L2224/131 , H01L2224/81193 , H01L2224/81801 , H01L2924/0001 , H01L2924/01006 , H01L2924/01012 , H01L2924/01019 , H01L2924/01021 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/351 , H01L2924/00 , H01L2924/00014
摘要： A method of forming an electronic device, comprising providing a semiconductor substrate having a first contact and an undoped electroplated lead-free solder bump formed on the first contact. The method also comprises providing a device package substrate having a second contact and a doped lead-free solder layer on the second contact comprising a fourth row transition metal dopant. The method further comprises melting the solder bump and the solder layer while the solder layer and the solder bump are in contact, thereby forming a doped solder bump consisting essentially of Sn, one or both of Ag and Cu, and the fourth row transition metal dopant.
摘要翻译：一种形成电子器件的方法，包括提供形成在第一触点上的具有第一接触和未掺杂电镀的无铅焊料凸块的半导体衬底。该方法还包括提供具有第二接触的器件封装衬底和在包括第四行过渡金属掺杂剂的第二接触上的掺杂的无铅焊料层。该方法还包括在焊料层和焊料凸块接触的同时熔化焊料凸块和焊料层，由此形成基本上由Sn组成的掺杂焊料凸块，其中Ag和Cu中的一个或两个，以及第四行过渡金属掺杂剂。

7. 发明申请

US20140125458A1 MEMS Sensor Enabled RFID System and Method for Operating the Same 审中-公开
标题翻译：使用MEMS传感器的RFID系统及其操作方法
公开(公告)号：US20140125458A1
公开(公告)日：2014-05-08
申请号：US14064027
申请日：2013-10-25
申请人： Mark Bachman , Yang Zhang , Scott McLaughlin
发明人： Mark Bachman , Yang Zhang , Scott McLaughlin
IPC分类号： G06K19/07
CPC分类号： G06K19/0702 , G06K19/0717 , G06K19/07749
摘要： A method for providing environmental monitoring of an item with an electronic system includes the steps of operating the electronic system in a deep-sleep mode at a minimal level of power consumption by disabling operation of nonessential portions of the electronic system; activating the electronic system at a monitoring rate to sense an environmental parameter to which the item is subjected; sensing a value of the environmental parameter to which the item is subjected; comparing the sensed environmental parameter with the value of the environmental parameter just previously sensed to derive a rate of change of the environmental parameter; adjusting the monitoring rate to track the rate of change of the environmental parameter; storing the value of the sensed environmental parameter; and returning the electronic system to the deep-sleep mode.
摘要翻译：一种用电子系统对物品进行环境监测的方法包括以下步骤：通过禁止电子系统的非必要部分的操作，以最小的功耗级别以深度睡眠模式操作电子系统; 以监测速率激活电子系统以感测物品遭受的环境参数; 感测物品受到的环境参数的值; 将感测到的环境参数与刚刚感测到的环境参数的值进行比较以导出环境参数的变化率; 调整监测率跟踪环境参数变化率; 存储感测到的环境参数的值; 并将电子系统返回到深度睡眠模式。

8. 发明申请

US20110223545A1 USE OF PHOTOSENSITIZED EPON EPOXY RESIN 1002F FOR MEMS AND BIOMEMS APPLICATIONS 有权
标题翻译：光敏环氧树脂1002F用于MEMS和生物物质的应用
公开(公告)号：US20110223545A1
公开(公告)日：2011-09-15
申请号：US12670349
申请日：2008-07-25
申请人： Jeng-Hao Pai , Yuli Wang , Christopher E. Sims , Mark Bachman
发明人： Jeng-Hao Pai , Yuli Wang , Christopher E. Sims , Mark Bachman
IPC分类号： G03F7/20
CPC分类号： G03F7/40 , B01L3/502707 , G03F1/50 , G03F7/0037 , G03F7/038 , G03F7/095
摘要： Systems and methods directed to the use 1002F to build microdevices and biomedical devices. Through the addition of a photosensitizing agent, Epon epoxy resin 1002F can be linked in the presence of UV light, making it useful as a photoresist or as a micropatternable structural material. One embodiment comprises combining 1002F monomer resin with a solvent and a photoinitiator, placing the monomer solution on a surface, exposing the monomer solution to UV light through a mask to initiate linking, and stripping the unlinked polymer away. In another embodiment, 3-D structures are built using two or more layers of sensitized monomer films, each having different sensitivity to light, and the use of a mask containing opaque and semi-opaque regions.
摘要翻译：针对使用1002F构建微型设备和生物医学设备的系统和方法。通过添加光敏剂，Epon环氧树脂1002F可以在UV光的存在下连接，使其可用作光致抗蚀剂或作为微图案化的结构材料。一个实施方案包括将1002F单体树脂与溶剂和光引发剂组合，将单体溶液置于表面上，通过掩模将单体溶液暴露于UV光以引发连接，并将未连接的聚合物剥离。在另一个实施方案中，使用两层或更多层敏化单体膜来构建3-D结构，每层具有不同的光敏感性，以及使用含有不透明区域和半不透明区域的掩模。

9. 发明申请

US20110163850A1 MEMS Sensor Enabled RFID System and Method for Operating the Same 有权
标题翻译：使用MEMS传感器的RFID系统及其操作方法
公开(公告)号：US20110163850A1
公开(公告)日：2011-07-07
申请号：US12984451
申请日：2011-01-04
申请人： Mark Bachman , Yang Zhang , Scott McLaughlin
发明人： Mark Bachman , Yang Zhang , Scott McLaughlin
IPC分类号： G06K7/01
CPC分类号： G06K19/0702 , G06K19/0717 , G06K19/07749
摘要： An apparatus provides environmental monitoring of an item and includes an RFID tag, and a passive switch for sensing an environmental parameter to which the item is subjected, and coupled to the RFID tag so that a measurement of the sensed environmental parameter can be stored, the RFID tag for providing remote readout of the sensed environmental parameter. A method provides environmental monitoring of an item and includes the steps of sensing an environmental parameter to which the item is subjected with activation of a passive switch, storing a measurement of the sensed environmental parameter upon the event of activation of the passive switch, and providing remote readout of the measurement of the sensed environmental parameter with an RFID tag.
摘要翻译：一种装置提供物品的环境监测，并且包括RFID标签和用于感测物品受到的环境参数的无源开关，并耦合到RFID标签，以便可以存储感测的环境参数的测量值， RFID标签用于提供所感测的环境参数的远程读出。一种方法提供对物品的环境监测，并且包括以下步骤：通过激活无源开关来感测物品遭受的环境参数，在被动开关的激活事件存储感测到的环境参数的测量值，并且提供使用RFID标签远程读出感测到的环境参数的测量值。

10. 发明申请

US20080170727A1 ACOUSTIC SUBSTRATE 审中-公开
标题翻译：声学基底
公开(公告)号：US20080170727A1
公开(公告)日：2008-07-17
申请号：US11956756
申请日：2007-12-14
申请人： Mark Bachman , Guann-Pyng Li
发明人： Mark Bachman , Guann-Pyng Li
IPC分类号： H04R7/00 , H04R31/00
CPC分类号： H04R19/005 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2924/01079 , H01L2924/10253 , H01L2924/1461 , H01L2924/19041 , H01L2924/00014 , H01L2924/00
摘要： A micromachined microphone or speaker embedded within, or positioned on top of, a substrate suitable for carrying microelectronic chips and components. The acoustic element converts sound energy into electrical energy which is then amplified by electronic components positioned on the surface of the substrate. Alternatively, the acoustic element may be driven by electronics to produce sound. The substrate can be used in standard microelectronic packaging applications.
摘要翻译：嵌入在适于承载微电子芯片和部件的基板内或位于其上的微机械麦克风或扬声器。声学元件将声能转换成电能，然后由位于基板表面上的电子部件放大。或者，声学元件可以由电子器件驱动以产生声音。该基板可用于标准微电子封装应用。

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