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1. 发明申请

WO2004069030A8 MEDICAL AND SURGICAL DEVICES WITH AN INTEGRATED SENSOR 审中-公开
标题翻译：具有集成传感器的医疗和手术装置
公开(公告)号：WO2004069030A8
公开(公告)日：2005-06-23
申请号：PCT/US2004002547
申请日：2004-01-30
申请人： VERIMETRA INC , MIGLIUOLO MICHELE , SUH WILLIAM D , PISANO ALBERT P , LIEPMANN DORIAN , LEBOUITZ KYLE , ROGERS JENNIFER , SCHLESINGER MORDECHAY , REBELLO KEITH
发明人： MIGLIUOLO MICHELE , SUH WILLIAM D , PISANO ALBERT P , LIEPMANN DORIAN , LEBOUITZ KYLE , ROGERS JENNIFER , SCHLESINGER MORDECHAY , REBELLO KEITH
IPC分类号： A61B20060101 , A61B5/02 , A61B5/027 , A61B5/028 , A61B8/12
CPC分类号： A61B8/12 , A61B1/0011 , A61B5/027 , A61B5/028 , A61B5/14546 , A61B8/4488
摘要： A medical or surgical instrument (30), such as a catheter, micro-catheter, guide-wire, cannula, blade, and forceps, comprising one or more sensors (82) to allow measurement of parameters around or within the instrument, and methods for making and using the same, are disclosed. Also disclosed are methods and apparatuses for measuring fluid characteristics, such as blood characteristics, including, for example, velocity, flow direction, and pressure in a vascular system.
摘要翻译：包括一个或多个允许测量仪器周围或内部的参数的传感器（82）的医疗或外科器械（30），例如导管，微导管，导丝，套管，刀片和镊子，以及方法用于制作和使用它们，被公开。还公开了用于测量诸如血液特性，包括例如血管系统中的速度，流动方向和压力的流体特性的方法和装置。

2. 发明申请

WO2004069030A2 MEDICAL AND SURGICAL DEVICES WITH AN INTEGRATED SENSOR 审中-公开
标题翻译：具有集成传感器的医疗和手术装置
公开(公告)号：WO2004069030A2
公开(公告)日：2004-08-19
申请号：PCT/US2004002547
申请日：2004-01-30
申请人： VERIMETRA INC , MIGLIUOLO MICHELE , SUH WILLIAM D , PISANO ALBERT P , LIEPMANN DORIAN , LEBOUITZ KYLE , ROGERS JENNIFER , SCHLESINGER MORDECHAY
发明人： MIGLIUOLO MICHELE , SUH WILLIAM D , PISANO ALBERT P , LIEPMANN DORIAN , LEBOUITZ KYLE , ROGERS JENNIFER , SCHLESINGER MORDECHAY
IPC分类号： A61B20060101 , A61B5/02 , A61B5/027 , A61B5/028 , A61B8/12 , A61B
CPC分类号： A61B8/12 , A61B1/0011 , A61B5/027 , A61B5/028 , A61B5/14546 , A61B8/4488
摘要： Medical or surgical instrument, such as a catheter, micro-catheter, guide-wire, cannula, blade, and forceps, comprising one or more sensors to allow measurement of parameters around or within the instrument, and methods for making and using the same, are disclosed. Also disclosed are methods and apparatuses for measuring fluid characteristics, such as blood characteristics, including, for example, velocity, flow direction, and pressure in a vascular system.
摘要翻译：包括用于测量仪器周围或内部的参数的一个或多个传感器的医疗或外科器械，例如导管，微导管，导丝，套管，刀片和镊子，以及用于制造和使用该仪器的方法，被披露。还公开了用于测量诸如血液特性，包括例如血管系统中的速度，流动方向和压力的流体特性的方法和装置。

3. 发明专利

AT372732T 未知
公开(公告)号：AT372732T
公开(公告)日：2007-09-15
申请号：AT01954861
申请日：2001-07-23
申请人： VERIMETRA INC
发明人： LEBOUITZ KYLE , MIGLIUOLO MICHELE
IPC分类号： A61B17/32 , B26B11/00 , A61B17/00 , A61B17/04 , A61B17/34 , A61B18/14 , A61B19/00
摘要： A cutting instrument including a metal blade has a recess formed therein and a semiconductor substrate affixed to the blade in the recess. The semiconductor substrate includes at least one sensor formed thereon. The sensor formed on the semiconductor substrate may comprise at least one or an array of a strain sensors, pressure sensors, nerve sensors, temperature sensors, density sensors, accelerometers, and gyroscopes. The cutting instrument may also further include a handle wherein the blade is affixed to the handle and the semiconductor substrate is electrically coupled to the handle. The handle may then be coupled, either physically or by wireless transmission, to a computer that is adapted to display information to a person using the cutting instrument based on signals generated by one or more of the sensors formed on the semiconductor substrate. The computer or handle may also be adapted to store data based on the signals generated by one or more of the sensors. A method of making said cutting instrument includes the steps of at least one sensor being formed on a semiconductor wafer and a layer of photoresist being applied on a top side of the semiconductor wafer according to a pattern that matches the defined shape of the semiconductor substrate. The portion of the semiconductor wafer not covered by the photoresist is removed and thereafter the photoresist is removed from the semiconductor wafer, thereby leaving the semiconductor substrate having a defined shape and at least one sensor formed thereon. The semiconductor substrate having a defined shape and at least one sensor formed thereon is then affixed to a metal blade in a recess formed in said blade.

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