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1. 发明申请

US20030096196A1 Process for curing of a resist which has been applied to a large substrate, and device for carrying out of the process 审中-公开
标题翻译：已经施加到大基材上的抗蚀剂的固化方法以及用于实施该方法的装置
公开(公告)号：US20030096196A1
公开(公告)日：2003-05-22
申请号：US10300796
申请日：2002-11-21
申请人： USHIODENKI KABUSHIKI KAISHA
发明人： Yoshiki Mimura , Kazumoto Tochihara
IPC分类号： G03C005/00
CPC分类号： H01L21/67115 , G03F7/40 , H01L21/67109
摘要： A process for curing of a resist in which the consumption of the device is not increased and a device for carrying out the process is achieved following manner. The workpiece stage is divided into several stages which are smaller than the size of the workpiece. The areas formed by division are each controlled to different constant temperatures. First, the part of the workpiece to which a resist has been applied and which has been developed is seated on a stage of the workpiece stage by a workpiece transport means. The resist-applied part of the workpiece is irradiated with UV radiation from a light irradiation part while it is being heated. Then, the workpiece is moved by the workpiece transport means such that the workpiece which was located on the above described stage is transported onto another stage and the other part of the workpiece is transported onto the stage named first. UV radiation is emitted from the light irradiation part. Likewise, the workpiece is irradiated with UV radiation while the workpiece is moved intermittently by the workpiece transport means. In this way the resist is cured.
摘要翻译：实现了不增加设备消耗的抗蚀剂的固化过程和用于实施该过程的设备。工件台分为几个小于工件尺寸的阶段。由分区形成的区域各自被控制到不同的恒定温度。首先，已经施加了抗蚀剂并已经被显影的工件的部分通过工件传送装置安置在工件台的台上。工件的抗蚀剂涂敷部分在加热时用来自光照射部分的紫外线照射。然后，工件由工件传送装置移动，使得位于上述台上的工件被输送到另一台上，而另一部分工件被运送到第一台上。从光照射部发射紫外线。同样地，当工件被工件传送装置间歇地移动时，用UV辐射照射工件。以这种方式，抗蚀剂被固化。

2. 发明申请

US20030053039A1 Device for exposure of a peripheral area of a wafer 失效
标题翻译：用于曝光晶片周边区域的装置
公开(公告)号：US20030053039A1
公开(公告)日：2003-03-20
申请号：US10243911
申请日：2002-09-16
申请人： Ushiodenki Kabushiki Kaisha
发明人： Yoshinori Nagai , Kazumoto Tochihara
IPC分类号： G03B027/42
CPC分类号： G03F7/2028
摘要： A device for exposing a peripheral area of a wafer, in which the area which is located within the wafer (and which need not be exposed) is prevented from being exposed regardless of the orientation the wafer which bears a notch in its periphery. The device includes an exposure light irradiation part, a wafer edge determination part, and a notch determination part are arranged integrally with each other. The wafer edge determination part moves such that it follows the edge of the wafer. The peripheral area of the edge of the wafer is exposed by exposure light emitted by the exposure light irradiation part. When the exposure sequence begins irradiation with exposure light is not immediately done, even if the means for wafer edge determination has determined the wafer edge. Instead, the wafer is rotated by a given amount and then exposure is begun. When the area irradiated with exposure light reaches the notch starting position, wafer edge determination is stopped until the end position of the notch is reached.
摘要翻译：用于暴露晶片外围区域的装置，其中位于晶片内部（并且不需要暴露）的区域被防止露出，而不考虑其周边带有凹口的晶片的取向。该装置包括曝光光照射部分，晶片边缘确定部分和切口确定部分彼此一体地布置。晶片边缘确定部分移动使得其沿着晶片的边缘移动。通过由曝光光照射部分发射的曝光来曝光晶片边缘的外围区域。当暴露序列开始照射时，曝光光不会立即完成，即使用于晶片边缘确定的装置已经确定了晶片边缘。相反，晶片旋转一定量，然后开始曝光。当用曝光光照射的区域到达切口开始位置时，晶片边缘确定停止，直到达到切口的结束位置。

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