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1. 发明申请

WO2014205085A1 ITERATIVE REACTIVE DISTILLATION OF DYNAMIC ESTER MIXTURES 审中-公开
标题翻译：动态反应混合物的迭代反应蒸馏
公开(公告)号：WO2014205085A1
公开(公告)日：2014-12-24
申请号：PCT/US2014/042954
申请日：2014-06-18
申请人： UNIVERSITY OF HOUSTON SYSTEM , MILJANIC, Ognjen , JI, Qing
发明人： MILJANIC, Ognjen , JI, Qing
IPC分类号： B01D3/00
CPC分类号： B01D3/34 , B01D3/009 , B01J2219/00599 , B01J2219/0072 , B01J2219/00759 , C07C67/02 , C40B40/04 , C40B50/04 , Y02P20/127 , C07C69/14 , C07C69/24 , C07C69/78
摘要： An iterative method of performing a reactive distillation of dynamic ester libraries containing n x m (m≤n) components, to reduce such mixtures to n pure ester species. The distillation occurs under anhydrous conditions, using metal alkoxide catalysts. Vacuum distillation of the mixture then isolates the most volatile ester at the expense of other (2n-2) compounds. The volatile ester is removed, and the process repeated with progressively less volatile ester species, yielding high purities and greater than 70% yields.
摘要翻译：对含有nxm（m≤n）组分的动态酯文库进行反应蒸馏以将这种混合物还原成纯的酯类的迭代方法。蒸馏在无水条件下使用金属醇盐催化剂进行。混合物的真空蒸馏然后以其他（2n-2）化合物为代价分离最易挥发的酯。除去挥发性酯，并且该方法用逐渐变少的挥发性酯物质重复，产生高纯度和大于70％产率。

2. 发明申请

WO2016153905A1 CYCLOBENZOINS 审中-公开
公开(公告)号：WO2016153905A1
公开(公告)日：2016-09-29
申请号：PCT/US2016/022799
申请日：2016-03-17
申请人： UNIVERSITY OF HOUSTON SYSTEM
发明人： MILJANIC, Ognjen , JI, Qing
IPC分类号： C07D277/62
CPC分类号： C07C45/45 , C07C15/50 , C07C45/44 , C07C47/544 , C07C49/215 , C07C49/245 , C07C49/727 , C07C2601/06 , C07C2603/38
摘要： One-step cyanide-catalyzed benzoin condensations for synthesizing shape persistent cyclobenzoin macrocycles. Selected dialdehydes, and cyanide salts are reacted in aqueous solvents to form such cyclobenzoin macrocycles.
摘要翻译：一步氰化催化的苯偶姻缩合，用于合成形状持久性环苯并胍大环化合物。选择的二醛和氰化物盐在含水溶剂中反应形成这样的环苯并胍大环化合物。

3. 发明申请

WO2007050611A1 LOW EXOTHERMIC THERMOSETTING RESIN COMPOSITIONS USEFUL AS UNDERFILL SEALANTS AND HAVING REWORKABILITY 审中-公开
标题翻译：低含量热固性树脂组合物有效用作密封剂，具有良好的耐候性
公开(公告)号：WO2007050611A1
公开(公告)日：2007-05-03
申请号：PCT/US2006/041484
申请日：2006-10-24
申请人： HENKEL CORPORATION , JI, Qing , CHAN, Chew, B. , YUN, Hwang, K. , ZHAO, Renzhe , SHI, Weitong
发明人： JI, Qing , CHAN, Chew, B. , YUN, Hwang, K. , ZHAO, Renzhe , SHI, Weitong
IPC分类号： C08L63/00 , C08K3/00 , C08G59/00
CPC分类号： C08G59/68 , C08G59/226 , C08K3/36 , C08K5/1515 , C08L63/00 , C08L2205/02 , H01L21/563 , H01L23/293 , H01L24/29 , H01L24/83 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83192 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H05K3/284 , H05K3/305 , H05K2201/0209 , H05K2201/10734 , H05K2201/10977 , H05K2203/176 , Y02P70/613 , Y10T428/31511 , Y10T428/31515 , H01L2924/00 , H01L2924/3512
摘要： This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages ("CSPs"), ball grid arrays ("BGAs"), land grid arrays ("LGAs") and the like, each of which having a semiconductor chip, such as large scale integration ("LSI"), on a carrier substrate. Similarly, the compositions are useful for mouting onto circuit board semiconductor chips themselves. Reaction products of the compositions of this invention are controllably reworkable when subjected to appropriate conditions. And significantly, unlike many commercial rapid curing underfill sealants ("snap cure underfills"), the inventive compositions possess an exotherm under 300 J/g or demonstrate package stability at 55°C for 7 days, and therefore do not require special packaging to be transported by air courier, or special approval from international transportion authorities, such as the U.S. Department of Transportation, to permit such air transport. The inventive compositions possess an exotherm under 300 J/g and/or demonstrate package stability at 55°C for 7 days and therefore do not require special packaging to be transported by air courier, or special approval from intenational transportation authorities, such as the U.S. Department of Transportation, to permit such air transport.
摘要翻译：本发明涉及用于安装到诸如芯片尺寸或芯片尺寸封装（“CSP”），球栅阵列（“BGAs”），焊盘网阵列（“LGAs”）和电路板半导体器件类似，其中每一个在载体基板上具有诸如大规模集成（“LSI”）的半导体芯片。类似地，组合物可用于将其自身悬挂到电路板半导体芯片上。当经受适当条件时，本发明组合物的反应产物是可控制的可再加工的。并且显着地，与许多商业快速固化底部填充密封剂（“快速固化底部填充剂”）不同，本发明组合物具有300J / g以下的放热或在55℃下显示包装稳定性7天，因此不需要特殊包装由航空快递运送，或者由美国运输部等国际运输部门特别批准，允许这样的航空运输。本发明的组合物具有300J / g以下的放热和/或在55℃下显示包装稳定性7天，因此不需要特殊包装通过空运快递运输，或者由国际运输当局如美国的特别批准运输部，允许这样的航空运输。

4. 发明申请

WO2011020031A1 FAST PULSED NEUTRON GENERATOR 审中-公开
标题翻译：快速中压发电机
公开(公告)号：WO2011020031A1
公开(公告)日：2011-02-17
申请号：PCT/US2010/045488
申请日：2010-08-13
申请人： THE REGENTS OF THE UNIVERSITY OF CALIFORNIA , KWAN, Joe, W. , JI, Qing , LEUNG, Ka-Ngo
发明人： KWAN, Joe, W. , JI, Qing , LEUNG, Ka-Ngo
IPC分类号： A61N5/06
CPC分类号： H05H3/06
摘要： An apparatus and method for fast pulsing of a neutron generator is described in which a series of electrodes are used to first extract deuterium or tritium ions from a plasma contained within an ion source, and then either accelerate or stop the flow of ions to the source, depending upon the voltage potential applied to the downstream electrodes In one embodiment, the extraction/gating system comprises 3 electrodes, a first extraction electrode which is maintained at the same positive potential as the ion sources, a second electrode maintained at a lower potential to extract ions from the source, and a third electrode which depending on the operational mode is maintained either at the same potential as the second electrode (for beam passage) or at a potential higher than that of the first electrode (for beam blockage)
摘要翻译：描述了用于中子发生器的快速脉冲的装置和方法，其中使用一系列电极首先从离子源中包含的等离子体中提取氘离子或氚离子，然后加速或停止离子流到源取决于施加到下游电极的电压电势在一个实施例中，提取/门控系统包括3个电极，第一引出电极，其保持在与离子源相同的正电位，第二电极维持在较低电位从源极提取离子，并且取决于操作模式的第三电极保持与第二电极（用于光束通过）相同的电位或比第一电极的电位高（用于光束阻塞）

5. 发明申请

WO2003107427A1 INTERLAYER DIELECTRIC AND PRE-APPLIED DIE ATTACH ADHESIVE MATERIALS 审中-公开
标题翻译：中间层电介质和预应力电缆附着材料
公开(公告)号：WO2003107427A1
公开(公告)日：2003-12-24
申请号：PCT/US2003/019052
申请日：2003-06-17
申请人： HENKEL LOCTITE CORPORATION , SANTOS, Benedicto, Delos , HUNEKE, James, T. , LIU, Puwei , YANG, Kang , JI, Qing
发明人： SANTOS, Benedicto, Delos , HUNEKE, James, T. , LIU, Puwei , YANG, Kang , JI, Qing
IPC分类号： H01L29/02
CPC分类号： H01L24/85 , C08L79/08 , C08L79/085 , C09J5/06 , C09J2479/00 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L25/50 , H01L2224/274 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83192 , H01L2224/83856 , H01L2224/8388 , H01L2224/85 , H01L2225/06506 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01057 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , Y10T428/12562 , Y10T428/12569 , Y10T428/24917 , Y10T428/31663 , H01L2224/78 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45099
摘要： The present invention relates to interlayer dielectric materials and pre-applied die attach adhesives, more specifically pre-applied die attach adhesives (such as wafer and other substrate-applied die attach adhesives), methods of applying the interlayer dielectric materials onto substrates to prepare low K dielectric semiconductor chips, methods of applying the pre-applied die attach adhesives onto wafer and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.
摘要翻译：本发明涉及层间绝缘材料和预应用芯片附着粘合剂，更具体地说是预先施加的芯片附着粘合剂（例如晶片和其它基板施加的芯片附着粘合剂），将层间介电材料施加到基板上以制备低 K电介质半导体芯片，将预先施加的芯片附着粘合剂施加到晶片和其它基板表面上的方法，以及用于连接微电子电路准备的组件。

6. 发明申请

WO2009117476A2 METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE OR CIRCUIT ASSEMBLY USING A FLUXING UNDERFILL COMPOSITION APPLIED TO SOLDER CONTACT POINTS IN A DIP PROCESS 审中-公开
标题翻译：使用适用于DIP工艺中的焊接接触点的焊接成分组合的半导体封装或电路组件的制造方法
公开(公告)号：WO2009117476A2
公开(公告)日：2009-09-24
申请号：PCT/US2009/037491
申请日：2009-03-18
申请人： HENKEL CORPORATION , CHAN, Chew, B. , JI, Qing , CURRIE, Mark , POOLE, Neil , KELLY, Geraldine
发明人： CHAN, Chew, B. , JI, Qing , CURRIE, Mark , POOLE, Neil , KELLY, Geraldine
IPC分类号： H01L23/48 , H01L21/60 , H01L23/02
CPC分类号： H01L21/563 , H01L24/28 , H01L2224/13111 , H01L2224/13116 , H01L2224/16 , H01L2224/29111 , H01L2224/2919 , H01L2224/73203 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/0133 , H01L2924/0135 , H01L2924/014 , H01L2924/15787 , H01L2924/01028 , H01L2924/01083 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2924/01031 , H01L2924/0665
摘要： The present invention relates to a method of fabricating a semiconductor package or circuit assembly using an fluxing underfill composition applied to solder contact points in a dip process.
摘要翻译：本发明涉及一种制造半导体封装或电路组件的方法，所述半导体封装或电路组件使用在浸渍工艺中应用于焊接接触点的助熔底漆组合物。

7. 发明申请

WO2008156443A1 BENZOXAZINE CONTAINING COMPOSITIONS OF MATTER AND CURABLE COMPOSITIONS MADE THEREWITH 审中-公开
标题翻译：含有物质和可固化组合物的苯并噻嗪组合物
公开(公告)号：WO2008156443A1
公开(公告)日：2008-12-24
申请号：PCT/US2007/014176
申请日：2007-06-18
申请人： HENKEL CORPORATION , LIU, Puwei , TODD, Michael, G. , JI, Qing , NGUYEN, My, N.
发明人： LIU, Puwei , TODD, Michael, G. , JI, Qing , NGUYEN, My, N.
IPC分类号： C07D265/16 , C07D413/12 , C08J5/12 , H01L23/28
CPC分类号： C07D265/16 , H01L21/563 , H01L23/293 , H01L2924/0002 , H01L2924/00
摘要： A composition of matter in liquid form at a temperature of 50°C or less comprising a monofunctional benzoxazine compound embraced by the structure where R is a member selected from C 1-40 alkyl, C 2-40 alkenyl, each of which being optionally substituted or interupted by one or more O, N, S, C=O, COO, and NHC=O, and C 6-20 aryl, m is 0-4, and R 1 -R 5 are independently selected from C 1-40 alkyl, C 2-40 alkenyl, each of which is being optionally substituted or interupted by one ore more O, N, S, C=O, COOH, and NHC=O, and C 6-20 aryl, and at least one of R 1 -R 5 are present, is provided.
摘要翻译：在50℃或更低的温度下呈液态形式的物质组合物，包括单官能苯并恶嗪化合物，其包括其中R为选自C 1-4烷基，C 2-40烯基，其各自为任选取代或插入的结构通过一个或多个O，N，S，C = O，COO和NHC = O，和C 6-20芳基，m是0-4，并且R 1 -R 5独立地选自C 1-4烷基，C 2-40烯基，其中每一个被任选地被一个或多个O，N，S，C = O，COOH和NHC = O取代或插入，并且C6-20芳基和R1-R5中的至少一个存在。

8. 发明申请

WO2008027119A1 EPOXY-BASED COMPOSITIONS HAVING IMPROVED IMPACT RESISTANCE 审中-公开
标题翻译：具有改善抗冲击性能的环氧基组合物
公开(公告)号：WO2008027119A1
公开(公告)日：2008-03-06
申请号：PCT/US2007/016204
申请日：2007-07-17
申请人： HENKEL CORPORATION , JI, Qing , HUANG, Qiaohong , ZHAO, Renzhe , TODD, Michael
发明人： JI, Qing , HUANG, Qiaohong , ZHAO, Renzhe , TODD, Michael
IPC分类号： C08L63/00 , C08L83/06 , C08L25/10
CPC分类号： C08L63/00 , C08L2666/22 , C09J163/00 , H01L2224/16225 , H01L2224/73204 , H01L2924/15311 , Y10T428/31511
摘要： This invention relates to epoxy-based compositions useful as adhesives and sealants, and more particularly to underfill sealant compositions with improved impact resistance.
摘要翻译：本发明涉及可用作粘合剂和密封剂的环氧基组合物，更具体地说，涉及具有改善耐冲击性的底部填充密封剂组合物。

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