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    • 1. 发明申请
    • ACTIVE PACKAGE FOR INTEGRATED CIRCUIT
    • 集成电路的有源封装
    • WO0139252A9
    • 2002-09-26
    • PCT/US0032198
    • 2000-11-22
    • UNIV ILLINOISNEBRIGIC DRAGAN DANILOJEVTITCH MILAN MARCELHUANG CHOW-CHIKERR KENDALL WILLIAM
    • NEBRIGIC DRAGAN DANILOJEVTITCH MILAN MARCELHUANG CHOW-CHIKERR KENDALL WILLIAM
    • H01L23/12H01L23/50H01L23/64H01L23/66H01L23/58
    • H01L23/647H01L23/50H01L23/642H01L23/645H01L2224/16
    • An active package for an integrated circuit may include an integrated circuit and an active component that is part of the circuit topology for the integrated circuit. The active component forms at least a portion of the housing for the integrated circuit. The integrated circuit may be housed in a shell formed by one or more discrete components. The active package may be formed in the same geometry and dimensions as a standard passive integrated circuit package, or may be formed in a shape to fit inside a standard or specially made battery package, or for another special application. A smart component may include a discrete component or a semiconductor-based resistor, capacitor or inductor, and a separate integrated circuit housed in the same housing as the discrete component or a semiconductor-based resistor, capacitor or inductor. The integrated circuit may control at least one electrical parameter of the discrete component or a semiconductor-based resistor, capacitor or inductor. In one embodiment, the integrated circuit may maintain the resistance, resistivity, capacitance, inductance, etc. of the component inside a narrow range in order to create a high-precision component regardless of changes in environmental changes such as temperature, pressure, humidity, etc.
    • 用于集成电路的有源封装可以包括集成电路和作为集成电路的电路拓扑的一部分的有源部件。 有源部件形成用于集成电路的壳体的至少一部分。 集成电路可以容纳在由一个或多个分立组件形成的外壳中。 有源封装可以与标准无源集成电路封装形成为相同的几何形状和尺寸,或者可以形成为适合标准或专门制造的电池封装内的形状,或者用于其他特殊应用。 智能组件可以包括分立组件或基于半导体的电阻器,电容器或电感器以及与分立组件或基于半导体的电阻器,电容器或电感器一起容纳在同一壳体中的单独的集成电路。 集成电路可以控制分立组件或基于半导体的电阻器,电容器或电感器的至少一个电参数。 在一个实施例中,集成电路可以将部件的电阻,电阻率,电容,电感等保持在窄范围内,以便创建高精度部件,而不管环境变化如温度,压力,湿度等的变化。 等等
    • 2. 发明申请
    • ACTIVE PACKAGE FOR INTEGRATED CIRCUIT
    • 集成电路的主动封装
    • WO0139252A2
    • 2001-05-31
    • PCT/US0032198
    • 2000-11-22
    • PROCTER & GAMBLENEBRIGIC DRAGAN DANILOJEVTITCH MILAN MARCELHUANG CHOW CHIKERR KENDALL WILLIAM
    • NEBRIGIC DRAGAN DANILOJEVTITCH MILAN MARCELHUANG CHOW-CHIKERR KENDALL WILLIAM
    • H01L23/12H01L23/50H01L23/64H01L
    • H01L23/647H01L23/50H01L23/642H01L23/645H01L2224/16
    • An active package for an integrated circuit may include an integrated circuit and an active component that is part of the circuit topology for the integrated circuit. The active component forms at least a portion of the housing for the integrated circuit. The integrated circuit may be housed in a shell formed by one or more discrete components. The active package may be formed in the same geometry and dimensions as a standard passive integrated circuit package, or may be formed in a shape to fit inside a standard or specially made battery package, or for another special application. A smart component may include a discrete component or a semiconductor-based resistor, capacitor or inductor, and a separate integrated circuit housed in the same housing as the discrete component or a semiconductor-based resistor, capacitor or inductor. The integrated circuit may control at least one electrical parameter of the discrete component or a semiconductor-based resistor, capacitor or inductor. In one embodiment, the integrated circuit may maintain the resistance, resistivity, capacitance, inductance, etc. of the component inside a narrow range in order to create a high-precision component regardless of changes in environmental changes such as temperature, pressure, humidity, etc.
    • 用于集成电路的有源封装可以包括集成电路和作为用于集成电路的电路拓扑的一部分的有源部件。 有源部件形成用于集成电路的壳体的至少一部分。 集成电路可以容纳在由一个或多个分立组件形成的外壳中。 有源封装可以形成为与标准无源集成电路封装相同的几何形状和尺寸,或者可以形成为适合于标准或特别制造的电池封装内的形状,或者用于另一特殊应用。 智能部件可以包括分立部件或基于半导体的电阻器,电容器或电感器,以及容纳在与分立部件或基于半导体的电阻器,电容器或电感器相同的壳体中的单独的集成电路。 集成电路可以控制分立元件或基于半导体的电阻器,电容器或电感器的至少一个电参数。 在一个实施例中,集成电路可以将组件的电阻,电阻率,电容,电感等保持在窄范围内,以便产生高精度分量,而不管环境变化如温度,压力,湿度, 等等
    • 7. 发明专利
    • ACTIVE PACKAGE FOR INTEGRATED CIRCUIT
    • CA2392273A1
    • 2001-05-31
    • CA2392273
    • 2000-11-22
    • UNIV ILLINOIS
    • JEVTITCH MILAN MARCELNEBRIGIC DRAGAN DANILOHUANG CHOW-CHIKERR KENDALL WILLIAM
    • H01L23/12H01L23/50H01L23/64H01L23/66H01L23/58
    • An active package for an integrated circuit may include an integrated circui t and an active component that is part of the circuit topology for the integrated circuit. The active component forms at least a portion of the housing for the integrated circuit. The integrated circuit may be housed in a shell formed by one or more discrete components. The active package may be formed in the same geometry and dimensions as a standard passive integrated circuit package, or may be formed in a shape to fit inside a standard or specially made battery package, or for another special application. A smart component may include a discrete component or a semiconductor-based resistor , capacitor or inductor, and a separate integrated circuit housed in the same housing as the discrete component or a semiconductor-based resistor, capacit or or inductor. The integrated circuit may control at least one electrical parameter of the discrete component or a semiconductor-based resistor, capacitor or inductor. In one embodiment, the integrated circuit may maintai n the resistance, resistivity, capacitance, inductance, etc. of the component inside a narrow range in order to create a high-precision component regardle ss of changes in environmental changes such as temperature, pressure, humidity, etc.