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1. 发明申请

WO1997011491A1 HEAT TRANSFER MODULE INCORPORATING LIQUID METAL SQUEEZED FROM A COMPLIANT BODY, AND SUB-ASSEMBLY OF SAME 审中-公开
标题翻译：从合规体中收集液体金属的热传递模块及其相同的组件
公开(公告)号：WO1997011491A1
公开(公告)日：1997-03-27
申请号：PCT/US1996015043
申请日：1996-09-20
申请人： UNISYS CORPORATION
发明人： UNISYS CORPORATION , LAYTON, Wilbur, Terry , NORELL, Ronald, Allen , ROECKER, James, Andrew
IPC分类号： H01L23/373
CPC分类号： H01L23/3733 , H01L23/3736 , H01L23/433 , H01L2924/0002 , H01L2924/00
摘要： A heat transfer module (Fig. 1) comprises: a heat generating unit (11) and a heat receiving unit (15) which are separated by a gap (space between 11 and 15); a compliant body (12), having microscopic voids therethrough, which is compressed into the gap; and a liquid metal alloy (12a and 12b in Figs. 2B and 2C) that is absorbed in the microscopic voids in the compliant body (12). Further, the heat transfer module also includes a seal ring (13) in the gap which surrounds the compliant body and which is spaced apart from the compliant body; and, the compliant body is intentionally compressed (Figs. 2B and 2C) so much that a portion of the liquid metal alloy is squeezed from the compliant body into the space between the compliant body and the seal ring. Squeezing liquid metal alloy from the compliant body lowers the thermal resistance (R>T
摘要翻译：传热模块（图1）包括：由间隙（11和15之间的间隔）隔开的发热单元（11）和热接收单元（15）; 柔性体（12），其具有通过其的微小空隙，其被压缩到所述间隙中; 以及吸收在柔性体（12）中的微小空隙中的液态金属合金（图2B和2C中的12a和12b）。此外，传热模块还包括在间隙中的密封环（13），该密封环围绕柔顺体并与柔顺体间隔开; 并且，柔性体被有意地压缩（图2B和2C），使得液体金属合金的一部分从柔性体被挤压到顺应性主体和密封环之间的空间中。从柔性体中挤压液态金属合金通过增加热量传递的面积来降低发热单元（11）和热量接收单元（15）之间的热阻（R> T <表1）通过柔性体的导热性。

2. 发明申请

WO1990003045A1 METHOD OF FORMING HOLES IN CERAMIC IC PACKAGES 审中-公开
标题翻译：陶瓷IC封装中形成孔的方法
公开(公告)号：WO1990003045A1
公开(公告)日：1990-03-22
申请号：PCT/US1989004003
申请日：1989-09-15
申请人： UNISYS CORPORATION , PACIFIC TREATMENT CORPORATION
发明人： UNISYS CORPORATION , PACIFIC TREATMENT CORPORATION , CURTIS, Robert, David , HORNER, James, William , NORELL, Ronald, Allen , ZABLOTNY, Gordon, Olivier
IPC分类号： H01L21/48
CPC分类号： H01L21/4807 , H05K1/0306 , H05K3/0017
摘要： A method of forming holes in the unfired ceramic layers of integrated circuit packages. Via holes (12 of Fig. 1) in a thin planar layer of unfired ceramic (10' of Fig. 1), which consists essentially of a mixture of an inorganic nonmetallic powder having a high melting temperature and a binder having a lower vaporizing temperature, are formed by the steps of: direting a laser beam (22a of Fig. 2), in a sequence, at certain locations on the layers (30a of Fig. 2) where the via holes are to be formed; controlling the power density in the directed laser beam to a low level at which the binder vaporizes at each of the locations while the power stays unsintered and unmelted (as per Fig. 3); and removing (by means of 25 and 26 of Fig. 2) from the directed laser beam during the above steps, both the vaporized binder and the unbound powder which remains where the binder vaporizes. Preferably, the vaporizing temperature of the binder and the melting temperature of the powder are selected such that they differ by at least 200 DEG C; the power density of the laser is controlled to be between 5kW/cm and 75kW/cm ; and the removing step is performed by impinging a gas jet at each location where the laser beam is directed and simultaneously vacuuming the location.
摘要翻译：一种在集成电路封装的未焙烧陶瓷层中形成孔的方法。通孔（图1中的12）位于未焙烧陶瓷（图1的10'）的薄平坦层中，其基本上由具有较高熔融温度的无机非金属粉末和具有较低蒸发温度通过以下步骤形成：在要形成通孔的层（图2的30a）上的某些位置处，依次导向激光束（图2的22a）; 将定向激光束中的功率密度控制在低水平，在此处，当粘合剂在每个位置蒸发时，功率保持未烧结和未熔化（如图3所示）; 并且在上述步骤中，通过定向激光束去除（借助于图2的25和26），蒸发的粘合剂和残留在粘合剂蒸发的未结合的粉末。优选地，选择粘合剂的蒸发温度和粉末的熔融温度使其相差至少200℃; 激光器的功率密度控制在5kW / cm 2和75kW / cm 2之间; 并且通过在激光束被引导的每个位置处冲击气体射流并且同时抽吸该位置来执行去除步骤。

3. 发明公开

EP0965142A1 ANGLED BLADE METHOD OF CUTTING I/O COLUMNS 失效
标题翻译：方法切割后连接的使用BLADE坡地
公开(公告)号：EP0965142A1
公开(公告)日：1999-12-22
申请号：EP98904881.0
申请日：1998-02-04
申请人： UNISYS CORPORATION
发明人： NORELL, Ronald, Allen , ECONOMY, Kenneth, Walter
IPC分类号： H01L21 , H05K13
CPC分类号： H05K13/0473 , H01L21/4853 , H01L2224/1184 , Y10S83/942 , Y10T83/04 , Y10T83/8717
摘要： A method of cutting input/ouput columns (20b) on an electronic component (20a) includes the steps of: providing a shear plate (33) which has a thickness that is less than the length of the columns (20b) and which has respective holes (33a) for receiving all of the columns; inserting the columns (20b) into the holes (33a) until a portion of the columns extend past the shear plate; placing a blade (35), with a cutting edge (35a), at an acute angle against the shear plate (33) such that only the cutting edge (35a) of the blade touches the shear plate; and, sliding the cutting edge of the blade against shear plate and through the portion of the columns which extend past the shear plate, while keeping the blade at the acute angle. With this method, crater-like voids and burrs on the cut ends of the columns are eliminated.

4. 发明授权

EP0965142B1 ANGLED BLADE METHOD OF CUTTING I/O COLUMNS 失效
标题翻译：方法切割后连接的使用BLADE坡地
公开(公告)号：EP0965142B1
公开(公告)日：2003-05-02
申请号：EP98904881.4
申请日：1998-02-04
申请人： UNISYS CORPORATION
发明人： NORELL, Ronald, Allen , ECONOMY, Kenneth, Walter
IPC分类号： H01L21/48 , H05K3/34
CPC分类号： H05K13/0473 , H01L21/4853 , H01L2224/1184 , Y10S83/942 , Y10T83/04 , Y10T83/8717
摘要： A method of cutting input/ouput columns (20b) on an electronic component (20a) includes the steps of: providing a shear plate (33) which has a thickness that is less than the length of the columns (20b) and which has respective holes (33a) for receiving all of the columns; inserting the columns (20b) into the holes (33a) until a portion of the columns extend past the shear plate; placing a blade (35), with a cutting edge (35a), at an acute angle against the shear plate (33) such that only the cutting edge (35a) of the blade touches the shear plate; and, sliding the cutting edge of the blade against shear plate and through the portion of the columns which extend past the shear plate, while keeping the blade at the acute angle. With this method, crater-like voids and burrs on the cut ends of the columns are eliminated.

5. 发明授权

EP0390891B1 METHOD OF FORMING HOLES IN CERAMIC IC PACKAGES 失效
标题翻译：的生产方法在陶瓷集成电路封装孔形
公开(公告)号：EP0390891B1
公开(公告)日：1996-03-06
申请号：EP89910505.0
申请日：1989-09-15
申请人： UNISYS CORPORATION , PACIFIC TRINETICS CORPORATION
发明人： CURTIS, Robert, David , HORNER, James, William , NORELL, Ronald, Allen , ZABLOTNY, Gordon, Olivier
IPC分类号： H01L21/48
CPC分类号： H01L21/4807 , H05K1/0306 , H05K3/0017
摘要： A method of forming holes in the unfired ceramic layers of integrated circuit packages. Via holes (12 of Fig. 1) in a thin planar layer of unfired ceramic (10' of Fig. 1), which consists essentially of a mixture of an inorganic nonmetallic powder having a high melting temperature and a binder having a lower vaporizing temperature, are formed by the steps of: direting a laser beam (22a of Fig. 2), in a sequence, at certain locations on the layers (30a of Fig. 2) where the via holes are to be formed; controlling the power density in the directed laser beam to a low level at which the binder vaporizes at each of the locations while the power stays unsintered and unmelted (as per Fig. 3); and removing (by means of 25 and 26 of Fig. 2) from the directed laser beam during the above steps, both the vaporized binder and the unbound powder which remains where the binder vaporizes. Preferably, the vaporizing temperature of the binder and the melting temperature of the powder are selected such that they differ by at least 200 °C; the power density of the laser is controlled to be between 5kW/cm2 and 75kW/cm2; and the removing step is performed by impinging a gas jet at each location where the laser beam is directed and simultaneously vacuuming the location.

6. 发明公开

EP0958603A1 VIBRATING TEMPLATE METHOD OF PLACING SOLDER BALLS ON THE I/O PADS OF AN INTEGRATED CIRCUIT PACKAGE 失效
标题翻译： ATTACHMENT焊球作者充满活力模板的IC壳体装置的连接区域的方法
公开(公告)号：EP0958603A1
公开(公告)日：1999-11-24
申请号：EP98904675.0
申请日：1998-01-22
申请人： UNISYS CORPORATION
发明人： ECONOMY, Kenneth, Walter , NORELL, Ronald, Allen , BUMANN, Richard, Leigh
IPC分类号： H01L23 , H01L21 , H05K3
CPC分类号： H05K3/3478 , H01L21/4853 , H01L2224/11822 , H05K2203/0292 , H05K2203/041 , H05K2203/082 , Y10T29/49144 , Y10T29/49146 , Y10T29/49149
摘要： Solder balls (51) are placed onto multiple I/O pads (13) of an integrated circuit package (10) by the steps of: (a) providing a template (44) with a channel which has multiple openings (44b) on a surface of the template that match the pattern of the I/O pads; (b) pouring a plurality of the solder balls onto the surface of the template; (c) vibrating the template and thereby seating a respective solder ball in each of the template openings; (d) turning the template over, after the vibrating step and while a vacuum is applied to the channel, to remove excess solder balls from the template; and (e) removing the vacuum from the channel when the solder balls on the turned over template are aligned to the I/O pads of the integrated circuit package. Due to the vibrating step, the solder balls settle in the template openings in a position where vacuum leaks past the solder balls become minimized; and that stops the solder balls from dropping out of the template openings when the template is turned over. Also, since the steps (a)-(d) place the solder balls on all of the I/O pads in parallel, the time in which those steps are performed is many time smaller than the time in which a pick and place machine can put the solder balls on all of the I/O pads sequentially.

7. 发明公开

EP0390891A1 METHOD OF FORMING HOLES IN CERAMIC IC PACKAGES 失效
标题翻译：的生产方法在陶瓷集成电路封装孔。
公开(公告)号：EP0390891A1
公开(公告)日：1990-10-10
申请号：EP89910505.0
申请日：1989-09-15
申请人： UNISYS CORPORATION , PACIFIC TRINETICS CORPORATION
发明人： CURTIS, Robert, David , HORNER, James, William , NORELL, Ronald, Allen , ZABLOTNY, Gordon, Olivier
IPC分类号： H05K3 , H01L21 , H01L23 , H05K1
CPC分类号： H01L21/4807 , H05K1/0306 , H05K3/0017
摘要： On a mis au point un procédé de formation de trous dans les couches céramiques non cuites de boîtiers de circuits intégrés (fig. 1, 2, 3). On forme des trous de passages (12, fig 1) dans une couche plane mince de céramique non cuite (10, fig 1), composée essentiellement d'un mélange de poudre non métallique inorganique ayant une température de fusion élevée ainsi que d'un liant ayant une température de vaporisation plus basse, dans les étapes consistant à orienter un faisceau laser (22a, fig 2), dans une séquence, à certains emplacements sur la couche (30a, fig 2) où les trous de passages sont à former, à commander la densité de puissance dans le faisceau laser orienté à un niveau bas auquel le liant s'évapore au niveau de chacun des emplacements tandis que la poudre reste non frittée et non fusionnée (fig 3), et à éliminer (25 et 26, fig 2) du faisceau laser orienté au cours des phases précitées, à la fois le liant évaporé et la poudre non liée demeurant là où le liant s'évapore. De préférence, la température d'évaporation du liant et la température de fusion de la poudre sont choisies de sorte qu'elles diffèrent d'au moins 200 °C. La densité de puissance du laser est commandée pour se situer entre 5kW/cm2 et 75kW/cm2. On procède à l'étape d'élimination par projection d'un jet de gaz à chaque emplacement où le rayon laser est dirigé et par mise sous vide simultanée dudit emplacement.

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