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1. 发明授权

US08289118B2 Stacked inductor 有权
标题翻译：堆叠电感
公开(公告)号：US08289118B2
公开(公告)日：2012-10-16
申请号：US12963462
申请日：2010-12-08
申请人： Tzuyin Chiu , Xiangming Xu , Miao Cai
发明人： Tzuyin Chiu , Xiangming Xu , Miao Cai
IPC分类号： H01F21/02 , H01F5/00 , H01F27/28
CPC分类号： H01F17/0013
摘要： A stacked inductor with combined metal layers is represented in this invention. The stacked inductor includes: a top layer metal coil, and at least two lower layer metal coils, the metal coils being aligned with each other; adjacent metal coils being connected at the corresponding ends through a via; wherein, each of the lower layer metal coils is consisted of plural layers of metal lines which are interconnected. With the same chip area, the stacked inductor of the present invention can achieve higher inductance and Q factor because of the mutual inductance generated from the plural layers of metal lines and the reduced parasitic resistance.
摘要翻译：具有组合金属层的堆叠电感器在本发明中被表示。堆叠电感器包括：顶层金属线圈和至少两个下层金属线圈，金属线圈彼此对准; 相邻的金属线圈通过通孔在相应的端部连接; 其中，每个下层金属线圈由互连的多层金属线构成。由于相同的芯片面积，由于由多层金属线产生的互感和降低的寄生电阻，本发明的层叠电感器可以实现更高的电感和Q因数。

2. 发明申请

US20110133879A1 STACKED INDUCTOR 有权
标题翻译：堆叠电感器
公开(公告)号：US20110133879A1
公开(公告)日：2011-06-09
申请号：US12963462
申请日：2010-12-08
申请人： Tzuyin CHIU , Xiangming Xu , Miao Cai
发明人： Tzuyin CHIU , Xiangming Xu , Miao Cai
IPC分类号： H01F5/00
CPC分类号： H01F17/0013
摘要： A stacked inductor with combined metal layers is represented in this invention. The stacked inductor includes: a top layer metal coil, and at least two lower layer metal coils, the metal coils being aligned with each other; adjacent metal coils being connected at the corresponding ends through a via; wherein, each of the lower layer metal coils is consisted of plural layers of metal lines which are interconnected. With the same chip area, the stacked inductor of the present invention can achieve higher inductance and Q factor because of the mutual inductance generated from the plural layers of metal lines and the reduced parasitic resistance.
摘要翻译：具有组合金属层的堆叠电感器在本发明中被表示。堆叠电感器包括：顶层金属线圈和至少两个下层金属线圈，金属线圈彼此对准; 相邻的金属线圈通过通孔在相应的端部连接; 其中，每个下层金属线圈由互连的多层金属线构成。由于相同的芯片面积，由于由多层金属线产生的互感和降低的寄生电阻，本发明的层叠电感器可以实现更高的电感和Q因数。

3. 发明申请

US20110133875A1 Stack inductor with different metal thickness and metal width 有权
标题翻译：堆叠电感器具有不同的金属厚度和金属宽度
公开(公告)号：US20110133875A1
公开(公告)日：2011-06-09
申请号：US12958080
申请日：2010-12-01
申请人： Tzuyin CHIU , Xiangming Xu , Miao Cai
发明人： Tzuyin CHIU , Xiangming Xu , Miao Cai
IPC分类号： H01F5/00
CPC分类号： H01L23/5227 , H01F17/0013 , H01F2017/0073 , H01L2924/0002 , H01L2924/00
摘要： A stacked inductor with different metal thickness and metal width is represented in this invention, this structure comprise: top and bottom metal trace, which is aligned with each other. The thickness and width of top and bottom metal trace are different. The top and bottom metal trace are connected at the end of metal trace with via holes. The inductance is increased with the use of the mutual inductance between top and bottom metal layers, and the parasitic resistor is reduced by means of different top and bottom metal width. This stacked inductor possesses larger inductance than single layer spiral inductor with relatively higher Q factor.
摘要翻译：在本发明中表示具有不同金属厚度和金属宽度的堆叠电感器，该结构包括彼此对准的顶部和底部金属迹线。顶部和底部金属痕迹的厚度和宽度不同。顶部和底部金属迹线在金属痕迹的末端连接有通孔。通过使用顶部和底部金属层之间的互感，电感增加，并且通过不同的顶部和底部金属宽度减小寄生电阻。该层叠电感器具有比具有相对较高Q因子的单层螺旋电感器更大的电感。

4. 发明授权

US08441333B2 Stack inductor with different metal thickness and metal width 有权
标题翻译：堆叠电感器具有不同的金属厚度和金属宽度
公开(公告)号：US08441333B2
公开(公告)日：2013-05-14
申请号：US12958080
申请日：2010-12-01
申请人： Tzuyin Chiu , Xiangming Xu , Miao Cai
发明人： Tzuyin Chiu , Xiangming Xu , Miao Cai
IPC分类号： H01F5/00 , H01F27/28
CPC分类号： H01L23/5227 , H01F17/0013 , H01F2017/0073 , H01L2924/0002 , H01L2924/00
摘要： A stacked inductor with different metal thickness and metal width. The stacked inductor comprises top and bottom metal traces which are aligned with each other. The thickness and width of the top and bottom metal traces are different. The top and bottom metal traces are connected at the end of metal trace with via holes. The inductance is increased with the use of the mutual inductance between top and bottom metal layers The parasitic resistor is reduced due to the difference of the top and bottom metal widths.
摘要翻译：具有不同金属厚度和金属宽度的堆叠电感器。堆叠的电感器包括彼此对准的顶部和底部金属迹线。顶部和底部金属轨迹的厚度和宽度是不同的。顶部和底部金属轨迹在金属轨迹末端与通孔相连。使用顶部和底部金属层之间的互感，电感增加。由于顶部和底部金属宽度的差异，寄生电阻减小。

5. 发明申请

US20110133878A1 Stacked differential inductor 审中-公开
标题翻译：叠层差动电感
公开(公告)号：US20110133878A1
公开(公告)日：2011-06-09
申请号：US12960166
申请日：2010-12-03
申请人： Tzuyin CHIU , Xiangming Xu , Miao Cai
发明人： Tzuyin CHIU , Xiangming Xu , Miao Cai
IPC分类号： H01F5/00
CPC分类号： H01L23/5227 , H01F17/0013 , H01L2924/0002 , H01L2924/00
摘要： A structure of stack differential inductor is represented in this invention; this structure includes top and bottom metal traces, which are aligned with each other and symmetric. Starting from one port and after half turn, the top metal trace is connected to bottom metal trace through via holes. Meanwhile, after another half turn, the bottom trace is connected to top trace through via holes. The inductance is increased by means of this method. With the same chip area, this stack differential inductor possesses larger inductance and higher Q factor because of the larger mutual inductance between top and bottom metal than conventional differential inductor.
摘要翻译：在本发明中表示了堆叠差分电感器的结构; 该结构包括彼此对准并对称的顶部和底部金属迹线。从一个端口开始，半匝之后，顶部金属轨迹通过通孔连接到底部金属迹线。另一半转后，底部轨迹通过通孔连接到顶部轨迹。通过这种方法增加电感。具有相同的芯片面积，该叠层差分电感器具有较大的电感和更高的Q因子，因为顶部和底部金属之间的互感比传统的差分电感器更大。

6. 发明申请

US20110133877A1 Stacked inductor with multi paths for current compensation 审中-公开
标题翻译：具有多路径用于电流补偿的堆叠电感器
公开(公告)号：US20110133877A1
公开(公告)日：2011-06-09
申请号：US12960133
申请日：2010-12-03
申请人： Tzuyin CHIU , Xiangming Xu , Miao Cai
发明人： Tzuyin CHIU , Xiangming Xu , Miao Cai
IPC分类号： H01F5/00
CPC分类号： H01L23/5227 , H01F17/0013 , H01F2017/0053 , H01L2924/0002 , H01L2924/00
摘要： A multi-path stacked inductor for current compensation is represented in this invention. This structure includes top and bottom metal trace, which are aligned with each other. Each metal trace consists of multi paths. The inner path in top metal flips over to the outer path in the bottom metal, while the outer path in top metal flips over to the inner path in the bottom metal. These paths join together at the end of the metal trace with via holes. Skin effect and current crowding effect are reduced by means of this method. This stacked inductor possesses larger inductance than single layer spiral inductor, with relatively higher Q factor.
摘要翻译：用于电流补偿的多路径堆叠电感器在本发明中被表示。该结构包括彼此对准的顶部和底部金属迹线。每个金属轨迹由多条路径组成。顶部金属中的内部路径翻转到底部金属的外部路径，而顶部金属中的外部路径翻转到底部金属中的内部路径。这些路径在金属轨迹的末端通过孔连接在一起。通过这种方法减少了皮肤效应和电流拥挤效应。该层叠电感器具有比单层螺旋电感器更大的电感，具有相对较高的Q因子。

7. 发明授权

US08534136B2 Pin soldering for printed circuit board failure testing 有权
标题翻译：针焊接印刷电路板故障测试
公开(公告)号：US08534136B2
公开(公告)日：2013-09-17
申请号：US12751061
申请日：2010-03-31
申请人： Dongji Xie , Miao Cai , Boyi Wu
发明人： Dongji Xie , Miao Cai , Boyi Wu
IPC分类号： G01N3/08
CPC分类号： G01N3/08 , G01N2203/0226 , G01N2203/0286
摘要： Systems and methods for performing pin-pull testing of a printed circuit board (PCB) are presented. The pin-pull testing generally involves the use of a standard tensile tester that is useful for performing other tests aside from pin-pull testing. In this regard, a non-specific pin may be used in conjunction with the tensile tester without the need to purchase or manufacture pins specially adapted for use with a specially designed tensile tester. Additionally, the pin-pull testing may include application of heat to the pin by way of an external heat supply such that the need of a heater integrated into the testing device to heat a pin during the testing may be eliminated. As such, a common heating element (e.g., a standard soldering iron) may be employed by applying heat to a pin directly with the external heat supply. Additionally, a dying process is presented that may be performed on a PCB prior to the pin-pull test that allows for evaluation of the presence of cracks in the PCB adjacent to a contact pad prior to the execution of the pin-pull test.
摘要翻译：提出了一种用于执行印刷电路板（PCB）引脚测试的系统和方法。引脚测试通常涉及使用标准拉伸试验机，除了引脚拉力测试外，它还可用于执行其他试验。在这方面，非特定销可以与拉力试验机一起使用，而不需要购买或制造专门用于特殊设计的拉伸试验机的销。此外，引脚测试可以包括通过外部热源向引脚施加热量，使得可以消除在测试期间集成到测试装置中以加热引脚的加热器的需要。因此，可以通过与外部热源直接对销进行加热来采用普通的加热元件（例如，标准烙铁）。另外，提供了可以在引脚测试之前在PCB上执行的垂死过程，其允许在执行引脚测试之前评估邻近接触焊盘的PCB中存在的裂纹。

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