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1. 发明申请

US20130140620A1 Flash Memory and Manufacturing Method Thereof 审中-公开
标题翻译：闪存及其制造方法
公开(公告)号：US20130140620A1
公开(公告)日：2013-06-06
申请号：US13398853
申请日：2012-02-17
申请人： Tzung-Han Lee , Chung-Lin Huang , Ron Fu Chu , Dah-Wei Liu
发明人： Tzung-Han Lee , Chung-Lin Huang , Ron Fu Chu , Dah-Wei Liu
IPC分类号： H01L29/78 , H01L21/28
CPC分类号： H01L27/11524
摘要： The present invention discloses a flash memory. The flash memory includes a substrate and a memory string, a plurality of landing pads, a plurality of common source lines, a plurality of bit line contacts and at least a bit line, which are disposed on the substrate in sequence. The memory string includes a plurality of storage transistors. The landing pads are disposed between each of the storage transistors. The common source lines and the bit line contact are electrically connected to the landing pads alternatively. The common line is disposed on the common line contacts and is electrically connected thereto. The present invention further provides a manufacturing method of making the same.
摘要翻译：本发明公开了一种闪速存储器。闪速存储器包括依次设置在基板上的基板和存储器串，多个着陆焊盘，多个公共源极线，多个位线触点和至少一个位线。该存储器串包括多个存储晶体管。着陆焊盘设置在每个存储晶体管之间。公共源线和位线接触件可替换地电连接到着陆焊盘。公共线设置在公共线路触点上并与其电连接。本发明还提供制造该方法的制造方法。

2. 发明授权

US08604620B2 Semiconductor structure having lateral through silicon via 有权
标题翻译：具有横向硅通孔的半导体结构
公开(公告)号：US08604620B2
公开(公告)日：2013-12-10
申请号：US13342201
申请日：2012-01-03
申请人： Tzung-Han Lee , Chung-Lin Huang , Ron Fu Chu , Dah-Wei Liu
发明人： Tzung-Han Lee , Chung-Lin Huang , Ron Fu Chu , Dah-Wei Liu
IPC分类号： H01L29/40
CPC分类号： H01L21/76898 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/94 , H01L25/0657 , H01L2224/02371 , H01L2224/05548 , H01L2224/05624 , H01L2224/05639 , H01L2224/05647 , H01L2224/05666 , H01L2224/0568 , H01L2224/05681 , H01L2224/08145 , H01L2224/08148 , H01L2224/94 , H01L2225/06551 , H01L2225/06565 , H01L2224/03
摘要： The present invention provides a semiconductor structure having a lateral TSV and a manufacturing method thereof. The semiconductor structure includes a chip having an active side, a back side disposed opposite to the active side, and a lateral side disposed between the active side and the back side. The chip further includes a contact pad, a lateral TSV and a patterned conductive layer. The contact pad is disposed on the active side. The lateral TSV is disposed on the lateral side. The patterned conductive layer is disposed on the active side and is electrically connected to the lateral TSV and the contact pad.
摘要翻译：本发明提供一种具有横向TSV的半导体结构及其制造方法。半导体结构包括具有有源侧的芯片，与有源侧相对设置的背面以及设置在主动侧和后侧之间的侧面。芯片还包括接触焊盘，横向TSV和图案化导电层。接触垫设置在活动侧。横向TSV设置在侧面。图案化导电层设置在有源侧上并且电连接到侧向TSV和接触焊盘。

3. 发明申请

US20130113110A1 Semiconductor Structure Having Lateral Through Silicon Via And Manufacturing Method Thereof 有权
标题翻译：具有横向通过硅的半导体结构及其制造方法
公开(公告)号：US20130113110A1
公开(公告)日：2013-05-09
申请号：US13342201
申请日：2012-01-03
申请人： Tzung-Han Lee , Chung-Lin Huang , Ron Fu Chu , Dah-Wei Liu
发明人： Tzung-Han Lee , Chung-Lin Huang , Ron Fu Chu , Dah-Wei Liu
IPC分类号： H01L23/48 , H01L21/78
CPC分类号： H01L21/76898 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/94 , H01L25/0657 , H01L2224/02371 , H01L2224/05548 , H01L2224/05624 , H01L2224/05639 , H01L2224/05647 , H01L2224/05666 , H01L2224/0568 , H01L2224/05681 , H01L2224/08145 , H01L2224/08148 , H01L2224/94 , H01L2225/06551 , H01L2225/06565 , H01L2224/03
摘要： The present invention provides a semiconductor structure having a lateral TSV and a manufacturing method thereof. The semiconductor structure includes a chip having an active side, a back side disposed opposite to the active side, and a lateral side disposed between the active side and the back side. The chip further includes a contact pad, a lateral TSV and a patterned conductive layer. The contact pad is disposed on the active side. The lateral TSV is disposed on the lateral side. The patterned conductive layer is disposed on the active side and is electrically connected to the lateral TSV and the contact pad.
摘要翻译：本发明提供一种具有横向TSV的半导体结构及其制造方法。半导体结构包括具有有源侧的芯片，与有源侧相对设置的背面以及设置在主动侧和后侧之间的侧面。芯片还包括接触焊盘，横向TSV和图案化导电层。接触垫设置在活动侧。横向TSV设置在侧面。图案化导电层设置在有源侧上并且电连接到侧向TSV和接触焊盘。

4. 发明申请

US20130062676A1 FLASH MEMORY STRUCTURE 审中-公开
标题翻译：闪存存储器结构
公开(公告)号：US20130062676A1
公开(公告)日：2013-03-14
申请号：US13239364
申请日：2011-09-21
申请人： Tzung-Han Lee , Chung-Lin Huang , Ron Fu Chu , Dah-Wei Liu
发明人： Tzung-Han Lee , Chung-Lin Huang , Ron Fu Chu , Dah-Wei Liu
IPC分类号： H01L29/788
CPC分类号： H01L27/11521 , H01L29/40114
摘要： A flash memory structure includes a semiconductor substrate, a gate dielectric layer on the semiconductor substrate, a floating gate on the gate dielectric layer, a capacitor dielectric layer conformally covering the floating gate, wherein the capacitor dielectric layer forms a top surface and four sidewall surfaces; and an isolated conductive cap layer covering the top surface and the four sidewall surfaces.
摘要翻译：闪速存储器结构包括半导体衬底，半导体衬底上的栅极电介质层，栅极介电层上的浮置栅极，保形地覆盖浮置栅极的电容器电介质层，其中电容器介电层形成顶表面和四个侧壁表面 ; 以及覆盖顶表面和四个侧壁表面的隔离的导电盖层。

5. 发明申请

US20130146954A1 Method Of Memory Array And Structure Form 审中-公开
标题翻译：存储器阵列和结构形式的方法
公开(公告)号：US20130146954A1
公开(公告)日：2013-06-13
申请号：US13429448
申请日：2012-03-26
申请人： Tzung-Han Lee , Chung-Lin Huang , Ron Fu Chu
发明人： Tzung-Han Lee , Chung-Lin Huang , Ron Fu Chu
IPC分类号： H01L27/088 , H01L21/336
CPC分类号： H01L27/0207 , H01L27/10876 , H01L27/10885
摘要： The present invention provides a memory array including a substrate, an isolation region, a plurality of active regions, a plurality of buried bit lines, a plurality of word lines, a plurality of drain regions and a plurality of capacitors. The isolation region and the active regions are disposed in the substrate and the active regions are encompassed and isolated by the isolation region. The buried bit lines are disposed in the substrate and extend in the second direction. The word lines are disposed in the substrate extend in the first direction. The drain regions are disposed in the active region not covered by the word lines. The capacitors are disposed on the substrate and electrically connected to the drain regions.
摘要翻译：本发明提供了一种存储器阵列，其包括衬底，隔离区，多个有源区，多个掩埋位线，多个字线，多个漏极区和多个电容。隔离区域和有源区域设置在衬底中，并且有源区域被隔离区域包围和隔离。掩埋位线设置在基板中并沿第二方向延伸。字线设置在基板中沿第一方向延伸。漏极区域设置在未被字线覆盖的有源区域中。电容器设置在基板上并电连接到漏极区域。

6. 发明授权

US08298892B1 Fabricating method of insulator 有权
标题翻译：绝缘子的制造方法
公开(公告)号：US08298892B1
公开(公告)日：2012-10-30
申请号：US13241295
申请日：2011-09-23
申请人： Tzung-Han Lee , Chung-Lin Huang , Ron Fu Chu
发明人： Tzung-Han Lee , Chung-Lin Huang , Ron Fu Chu
IPC分类号： H01L21/336
CPC分类号： H01L27/105 , H01L21/76224 , H01L29/4236
摘要： A fabricating method of an insulator for replacing a gate structure in a substrate by the insulator. The fabricating method includes the step of providing a substrate including a first buried gate structure. The first buried structure includes a first trench embedded in the substrate and a first gate filling in the first trench. The first trench has a first depth. Then, the first gate of the first buried structure is removed. Later, the substrate under the first trench is etched to elongate the depth of the first trench from the first depth to a third depth. Finally, an insulating material fills in the first trench with the third depth to form an insulator of the present invention.
摘要翻译：一种绝缘体的制造方法，用于通过绝缘体代替衬底中的栅极结构。制造方法包括提供包括第一掩埋栅极结构的衬底的步骤。第一掩埋结构包括嵌入衬底中的第一沟槽和填充在第一沟槽中的第一栅极。第一个沟槽有第一个深度。然后，去除第一掩埋结构的第一栅极。之后，蚀刻第一沟槽下面的衬底，以将第一沟槽的深度从第一深度延伸到第三深度。最后，绝缘材料填充具有第三深度的第一沟槽以形成本发明的绝缘体。

7. 发明申请

US20130119448A1 MEMORY LAYOUT STRUCTURE AND MEMORY STRUCTURE 有权
标题翻译：存储器布局结构和存储器结构
公开(公告)号：US20130119448A1
公开(公告)日：2013-05-16
申请号：US13343668
申请日：2012-01-04
申请人： Tzung-Han Lee , Chung-Lin Huang , Ron Fu Chu
发明人： Tzung-Han Lee , Chung-Lin Huang , Ron Fu Chu
IPC分类号： H01L27/108
CPC分类号： H01L27/10823 , H01L27/10855 , H01L27/10876 , H01L27/10891 , H01L28/90
摘要： A memory array layout includes an active region array having a plurality of active regions, wherein the active regions are arranged alternatively along a second direction and parts of the side of the adjacent active regions are overlapped along a second direction; a plurality of first doped region, wherein each first doped region is disposed in a middle region; a plurality of second doped region, wherein each second doped region is disposed in a distal end region respectively; a plurality of recessed gate structures; a plurality of word lines electrically connected to each recessed gate structure respectively; a plurality of digit lines electrically connected to the first doped region respectively; and a plurality of capacitors electrically connected to each second doped region respectively.
摘要翻译：存储器阵列布局包括具有多个有源区域的有源区域阵列，其中有源区域沿着第二方向交替布置，并且相邻有源区域的一部分侧沿第二方向重叠; 多个第一掺杂区域，其中每个第一掺杂区域设置在中间区域中; 多个第二掺杂区域，其中每个第二掺杂区域分别设置在远端区域中; 多个凹入栅结构; 分别电连接到每个凹入栅结构的多个字线; 分别电连接到第一掺杂区的多个数字线; 以及分别与每个第二掺杂区域电连接的多个电容器。

8. 发明申请

US20130052786A1 FABRICATING METHOD OF DRAM STRUCTURE 有权
标题翻译： DRAM结构的制作方法
公开(公告)号：US20130052786A1
公开(公告)日：2013-02-28
申请号：US13297276
申请日：2011-11-16
申请人： Tzung-Han Lee , Chung-Lin Huang , Ron Fu Chu
发明人： Tzung-Han Lee , Chung-Lin Huang , Ron Fu Chu
IPC分类号： H01L21/02
CPC分类号： H01L27/10894 , H01L27/10855 , H01L27/10876 , H01L27/10888 , H01L29/66545
摘要： A fabricating method of a DRAM structure includes providing a substrate comprising a memory array region and a peripheral region. A buried gate transistor is disposed within the memory array region, and a planar gate transistor is disposed within the peripheral region. Furthermore, an interlayer dielectric layer covers the memory array region, the buried gate transistor and the planar gate transistor. Then, a capping layer of the planar gate transistor and part of the interlayer dielectric layer are removed simultaneously so that a first contact hole, a second contact hole and a third contact hole are formed in the interlayer dielectric layer. A drain doping region of the buried gate transistor is exposed through the first contact hole, a doping region of the planar gate transistor is exposed through the second contact hole, and a gate electrode of the planar gate transistor is exposed through the third contact hole.
摘要翻译： DRAM结构的制造方法包括提供包括存储器阵列区域和外围区域的衬底。掩埋栅极晶体管设置在存储器阵列区域内，并且平面栅极晶体管设置在周边区域内。此外，层间电介质层覆盖存储器阵列区域，掩埋栅极晶体管和平面栅极晶体管。然后，同时去除平面栅晶体管的覆盖层和层间电介质层的一部分，使得在层间电介质层中形成第一接触孔，第二接触孔和第三接触孔。埋入栅极晶体管的漏极掺杂区域通过第一接触孔露出，平面栅极晶体管的掺杂区域通过第二接触孔露出，平面栅极晶体管的栅电极通过第三接触孔露出。

9. 发明授权

US08873280B2 Spin transfer torque random access memory 有权
标题翻译：旋转转矩随机存取存储器
公开(公告)号：US08873280B2
公开(公告)日：2014-10-28
申请号：US13282771
申请日：2011-10-27
申请人： Tzung Han Lee , Chung-Lin Huang , Ron Fu Chu
发明人： Tzung Han Lee , Chung-Lin Huang , Ron Fu Chu
IPC分类号： G11C11/00
CPC分类号： H01L27/228 , G11C11/161 , G11C11/1659 , H01L43/08
摘要： A spin transfer torque random access memory includes a substance unit, a source line unit, an insulation unit, a transistor unit, a MTJ unit, and a bit line unit. The substance unit includes a substance layer. The source line unit includes a plurality of source lines formed inside the substance layer. The transistor unit includes a plurality of transistors respectively disposed on the source lines. Each transistor includes a source region formed on each corresponding source line, a drain region formed above the source region, a channel region formed between the source region and the drain region, and a surrounding gate region surrounding the source region, the drain region, and the channel region. The MTJ unit includes a plurality of MTJ structures respectively disposed on the transistors. The bit line unit includes at least one bit line disposed on the MTJ unit.
摘要翻译：自旋传递转矩随机存取存储器包括物质单元，源极线单元，绝缘单元，晶体管单元，MTJ单元和位线单元。物质单元包括物质层。源极线单元包括形成在物质层内部的多个源极线。晶体管单元包括分别设置在源极线上的多个晶体管。每个晶体管包括形成在每个对应源极线上的源极区域，形成在源极区域上方的漏极区域，形成在源极区域和漏极区域之间的沟道区域，以及围绕源极区域，漏极区域和通道区域。 MTJ单元包括分别设置在晶体管上的多个MTJ结构。位线单元包括设置在MTJ单元上的至少一个位线。

10. 发明授权

US08703575B2 Method of forming isolation area and structure thereof 有权
标题翻译：形成隔离区及其结构的方法
公开(公告)号：US08703575B2
公开(公告)日：2014-04-22
申请号：US13421996
申请日：2012-03-16
申请人： Tzung-Han Lee , Chung-Lin Huang , Ron Fu Chu
发明人： Tzung-Han Lee , Chung-Lin Huang , Ron Fu Chu
IPC分类号： H01L21/76 , H01L21/00
CPC分类号： H01L21/76224
摘要： The instant disclosure relates to a method of forming an isolation area. The method includes the steps of: providing a substrate having a first type of ion dopants, where the substrate has a plurality of trenches formed on the cell areas and the isolation area between the cell areas of the substrate, with the side walls of the trenches having an oxidation layer formed thereon and the trenches are filled with a metallic structure; removing the metallic structure from the trenches of the isolation area; implanting a second type of ions into the substrate under the trenches of the isolation area; and filling all the trenches with an insulating structure, where the trenches of the isolation area are filled up fully by the insulating structure to form a non-metallic isolation area.
摘要翻译：本公开涉及形成隔离区域的方法。该方法包括以下步骤：提供具有第一类型的离子掺杂剂的衬底，其中衬底具有形成在单元区域上的多个沟槽和衬底的单元区域之间的隔离区域与沟槽的侧壁其上形成有氧化层，并且沟槽填充有金属结构; 从隔离区的沟槽移除金属结构; 在隔离区的沟槽下方将第二类型的离子注入到衬底中; 并用绝缘结构填充所有沟槽，其中隔离区域的沟槽由绝缘结构完全填充以形成非金属隔离区域。

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