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    • 5. 发明授权
    • Transparent photodetector
    • 透明光电探测器
    • US08604574B2
    • 2013-12-10
    • US13099827
    • 2011-05-03
    • Tymon Barwicz
    • Tymon Barwicz
    • H01L27/14H01L31/0232
    • G01J1/42
    • The transparent photodetector includes a substrate; a waveguide on the substrate; a displaceable structure that can be displaced with respect to the substrate, the displaceable structure in proximity to the waveguide; and a silicon nanowire array suspended with respect to the substrate and mechanically linked to the displaceable structure, the silicon nanowire array comprising a plurality of silicon nanowires having piezoresistance. In operation, a light source propagating through the waveguide results in an optical force on the displaceable structure which further results in a strain on the nanowires to cause a change in electrical resistance of the nanowires. The substrate may be a semiconductor on insulator substrate.
    • 透明光电检测器包括基板; 衬底上的波导; 可移位的结构,其可相对于衬底移位,靠近波导的位移结构; 以及相对于衬底悬挂并机械地连接到可位移结构的硅纳米线阵列,所述硅纳米线阵列包括具有压阻的多个硅纳米线。 在操作中,通过波导传播的光源导致可移动结构上的光学力,这进一步导致纳米线上的应变导致纳米线的电阻变化。 衬底可以是绝缘体上半导体衬底上的半导体。
    • 6. 发明授权
    • Flexible fiber to wafer interface
    • 柔性光纤到晶圆接口
    • US08545108B1
    • 2013-10-01
    • US13453027
    • 2012-04-23
    • Tymon BarwiczHidetoshi NumataYoichi Taira
    • Tymon BarwiczHidetoshi NumataYoichi Taira
    • G02B6/38
    • G02B6/305G02B6/3885G02B2006/12173G02B2006/12176G02B2006/1219
    • A fiber to wafer interface system includes an interface device comprising a flexible substrate portion, a flexible cladding portion arranged on the substrate portion, a flexible single-mode waveguide portion arranged on the cladding portion including a substantially optically transparent material, a connector portion engaging a first distal end of the flexible substrate portion, the connector portion operative to engage a portion of an optical fiber ferrule, a wafer portion comprising a single mode waveguide portion arranged on a portion of the wafer, an adhesive disposed between a portion of the single mode waveguide portion of the body portion and the single mode waveguide portion of the wafer portion, the adhesive securing the body portion to the wafer portion.
    • 光纤到晶片接口系统包括:接口装置,包括柔性基板部分,布置在基板部分上的柔性包层部分,布置在包括基本上光学透明材料的包层部分上的柔性单模波导部分, 柔性基板部分的第一远端,连接器部分可操作以接合光纤套圈的一部分,晶片部分包括布置在晶片的一部分上的单模波导部分,粘合剂设置在单模 主体部分的波导部分和晶片部分的单模波导部分,将本体部分固定到晶片部分上的粘合剂。
    • 8. 发明授权
    • Robust top-down silicon nanowire structure using a conformal nitride
    • 使用保形氮化物的坚固的自顶向下的硅纳米线结构
    • US08080456B2
    • 2011-12-20
    • US12469304
    • 2009-05-20
    • Tymon BarwiczLidija SekaricJeffrey W. Sleight
    • Tymon BarwiczLidija SekaricJeffrey W. Sleight
    • H01L21/336
    • H01L29/0665B82Y10/00H01L29/0673H01L29/42392H01L29/78696
    • In one exemplary embodiment, a method for fabricating a nanowire product comprising: providing a wafer having a buried oxide (BOX) upper layer in which a well is formed, the wafer further having a nanowire having ends resting on the BOX layer such that the nanowire forms a beam spanning said well; and forming a mask coating on an upper surface of the BOX layer leaving an uncoated window over a center part of said beam over said well and also forming a mask coating around beam intermediate ends between each end of a beam center part and a side wall of said well. In another exemplary embodiment, a nanowire product comprising: a wafer having a buried oxide (BOX) upper layer in which a well having side walls is formed; a nanowire having ends resting on the BOX layer so as to form a beam spanning said well and said side walls; and a hard mask coating on an upper surface of said BOX layer and around intermediate ends of said beam between each side wall of said well and ends of a center part of said beam leaving an uncoated window over a beam center part through which oxidation of said beam center part can take place.
    • 在一个示例性实施例中,一种用于制造纳米线产品的方法,包括:提供具有其中形成阱的掩埋氧化物(BOX)上层的晶片,所述晶片还具有具有搁置在BOX层上的端部的纳米线,使得纳米线 形成横跨所述井的梁; 并且在BOX层的上表面上形成掩模涂层,在所述孔的中心部分上留下未涂覆的窗口,并且还在梁的中心部分的两端和侧壁之间的梁中间端部 说得好 在另一个示例性实施例中,纳米线产品包括:具有掩埋氧化物(BOX)上层的晶片,其中形成具有侧壁的阱; 具有搁置在BOX层上的端部以形成横跨所述井和所述侧壁的梁的纳米线; 以及在所述BOX层的上表面上并且在所述孔的每个侧壁和所述梁的中心部分的端部之间的所述梁的中间端周围的硬掩模涂层,在光束中心部分上留下未涂覆的窗口,通过所述光束中心部分氧化所述 梁中心部分可以发生。
    • 9. 发明授权
    • Structures having lattice-mismatched single-crystalline semiconductor layers on the same lithographic level and methods of manufacturing the same
    • 具有相同光刻层上晶格失配的单晶半导体层的结构及其制造方法
    • US07994028B2
    • 2011-08-09
    • US12538759
    • 2009-08-10
    • Tymon BarwiczDevendra K. Sadana
    • Tymon BarwiczDevendra K. Sadana
    • H01L21/20H01L21/36
    • H01L21/84H01L21/02381H01L21/02543H01L21/02546H01L21/02551H01L27/1203H01L27/1207
    • A semiconductor substrate containing a single crystalline group IV semiconductor is provided. A single crystalline lattice mismatched group IV semiconductor alloy layer is epitaxially grown on a portion of the semiconductor layer, while another portion of the semiconductor layer is masked. The composition of the lattice mismatched group IV semiconductor alloy layer is tuned to substantially match the lattice constant of a single crystalline compound semiconductor layer, which is subsequently epitaxially grown on the single crystalline lattice mismatched group IV semiconductor alloy layer. Thus, a structure having both the group IV semiconductor layer and the single crystalline compound semiconductor layer is provided on the same semiconductor substrate. Group IV semiconductor devices, such as silicon devices, and compound semiconductor devices, such as GaAs devices having a laser emitting capability, may be formed on the on the same lithographic level of the semiconductor substrate.
    • 提供了含有单晶IV族半导体的半导体衬底。 在半导体层的一部分上外延生长单晶格不匹配的IV族半导体合金层,而半导体层的另一部分被掩蔽。 调整晶格失配的IV族半导体合金层的组成基本上与单晶化合物半导体层的晶格常数匹配,随后在单晶格子失配的IV族半导体合金层上外延生长。 因此,具有IV族半导体层和单晶化合物半导体层的结构设置在同一半导体衬底上。 诸如硅器件的IV族半导体器件和诸如具有激光发射能力的GaAs器件的化合物半导体器件可以形成在半导体衬底的相同的光刻层上。