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1. 发明授权

US10879638B2 Socket connector for an electronic package 有权
公开(公告)号：US10879638B2
公开(公告)日：2020-12-29
申请号：US15941769
申请日：2018-03-30
申请人： TE CONNECTIVITY CORPORATION , TYCO ELECTRONICS JAPAN G.K.
发明人： Jeffery Walter Mason , Alex An , Takeshi Nakashima , Naoki Hashimoto , Shigeru Aihara
IPC分类号： H05K7/10 , H01R12/82 , G06F1/18 , H05K3/34 , H01R43/02 , H01R13/11 , H01R12/52 , H01R12/58 , H01R12/61 , H01R12/70 , H01R12/79 , H01R12/85 , H01R13/24 , H05K1/02 , H05K1/11 , H05K1/18 , H01R13/05 , H01R12/71 , H01L23/40
CPC分类号： H01R12/82 , G06F1/184 , H01R12/52 , H01R12/585 , H01R12/61 , H01R12/7005 , H01R12/7076 , H01R12/79 , H01R12/85 , H01R13/057 , H01R13/11 , H01R13/111 , H01R13/2442 , H01R43/0256 , H05K1/0203 , H05K1/0243 , H05K1/115 , H05K1/181 , H05K3/3436 , H05K7/1084 , H01L23/4006 , H01L2023/405 , H01L2023/4031 , H01L2023/4062 , H01L2023/4081 , H01L2023/4087 , H01R12/716 , H01R13/2464 , H05K2201/044 , H05K2201/066 , H05K2201/10325 , H05K2201/10393 , H05K2201/10704 , H05K2201/10719 , H05K2201/10734
摘要： A socket connector includes a socket assembly having a socket frame, a socket substrate coupled to the socket frame and socket contacts terminated to the socket substrate. The socket substrate has first and second upper mating areas including first and second socket substrate conductors for mating with an electronic package and an electrical component, respectively. The socket contacts define an interface with the electronic package. The socket assembly is configured to electrically connect the electronic package with both a host circuit board and the electrical component.

2. 发明申请

US20190150311A1 SOCKET CONNECTOR FOR AN ELECTRONIC PACKAGE 审中-公开
公开(公告)号：US20190150311A1
公开(公告)日：2019-05-16
申请号：US15941769
申请日：2018-03-30
申请人： TE CONNECTIVITY CORPORATION , TYCO ELECTRONICS JAPAN G.K.
发明人： Jeffery Walter Mason , Alex An , Takeshi Nakashima , Naoki Hashimoto , Shigeru Aihara
IPC分类号： H05K7/10 , G06F1/18 , H01R13/24 , H05K3/34 , H01R12/52 , H01R43/02 , H01R13/11
摘要： A socket connector includes a socket assembly having a socket frame, a socket substrate coupled to the socket frame and socket contacts terminated to the socket substrate. The socket substrate has first and second upper mating areas including first and second socket substrate conductors for mating with an electronic package and an electrical component, respectively. The socket contacts define an interface with the electronic package. The socket assembly is configured to electrically connect the electronic package with both a host circuit board and the electrical component.

3. 发明申请

US20190148859A1 SOCKET CONNECTOR ASSEMBLY FOR AN ELECTRONIC PACKAGE 审中-公开
公开(公告)号：US20190148859A1
公开(公告)日：2019-05-16
申请号：US15941615
申请日：2018-03-30
申请人： TE CONNECTIVITY CORPORATION , TYCO ELECTRONICS JAPAN G.K.
发明人： Jeffery Walter Mason , Takeshi Nakashima , Naoki Hashimoto
IPC分类号： H01R12/82 , H01R12/70 , H01R12/58 , H01R13/24 , H05K1/11 , H05K1/18 , H05K1/02
摘要： A socket connector includes a socket assembly having a socket substrate and socket contacts. The socket substrate has first and second upper mating areas and a first lower mating area. The socket substrate has first and second socket substrate conductors at the first and second upper mating areas, respectively, and third socket substrate conductors at the first lower mating area electrically connected to corresponding first socket substrate conductors. The first socket substrate conductors are electrically connected to an electronic package, the second socket substrate conductors are electrically connected to an electrical component and the third socket substrate conductors are electrically connected to a host circuit board. The socket assembly is configured to electrically connect the electronic package with both the host circuit board and the electrical component. The socket contacts have a terminating end terminated to corresponding first socket substrate conductors and a mating end mated to package contacts.

4. 发明授权

US09437988B2 Electrical connector 有权
标题翻译：电连接器
公开(公告)号：US09437988B2
公开(公告)日：2016-09-06
申请号：US14517179
申请日：2014-10-17
申请人： Tyco Electronics Corporation , Tyco Electronics Japan G.K.
发明人： James L. McGrath , Takeshi Nakashima , Izumi Hasegawa , Isao Igarashi
IPC分类号： H01R24/60 , H01R107/00
CPC分类号： H01R24/60 , H01R2107/00
摘要： An electrical connector is provided with a first ground contact and a second ground contact. The first ground contact includes a first ground coupling portion and a pair of first ground contact portions extending substantially orthogonal from the first ground coupling portion. The pair of first ground contact portions includes a first upper ground contact portion stepped from a first lower ground contact portion. The second ground contact includes a second ground coupling portion and a pair of second ground contact portions extending substantially orthogonal from the second ground coupling portion. The pair of second ground contact portions includes a second upper ground contact portion stepped from a second lower ground contact portion. The second ground contact is positioned with the first ground contact such that their respective upper or lower ground contact portions are adjacent to each other.
摘要翻译：电连接器设置有第一接地触头和第二接地触点。第一接地触头包括第一接地耦合部分和从第一接地耦合部分基本上垂直延伸的一对第一接地接触部分。一对第一接地部分包括从第一下接地接触部分阶梯形的第一上接地接触部分。第二接地触点包括第二接地耦合部分和从第二接地耦合部分基本正交延伸的一对第二接地接触部分。一对第二接地部分包括从第二下接地接触部分阶梯形的第二上接地接触部分。第二接地触点与第一接地触头定位成使得它们各自的上接地部分或下接地部分彼此相邻。

5. 发明授权

US09065214B2 Electrical connector having a ground contact with a solder portion and a pair of grounding contact portions 有权
标题翻译：具有与焊接部分接地的电连接器和一对接地接触部分
公开(公告)号：US09065214B2
公开(公告)日：2015-06-23
申请号：US14081249
申请日：2013-11-15
申请人： Tyco Electronics Japan G.K.
发明人： Takeshi Nakashima , Isao Igarashi , Izumi Hasegawa
IPC分类号： H01R13/648 , H01R13/6585 , H01R24/00
CPC分类号： H01R13/6585 , H01R12/727 , H01R13/6461 , H01R23/005
摘要： An electrical connector including a housing having a mating connector receiving passageway. A pair of first differential signal contacts have solder portions and first contact portions positioned in the mating connector receiving passageway. A first ground contact faces the pair of first differential signal contacts. The first ground contact has a solder portion and a pair of first grounding contact portions spaced apart from each other by a gap and positioned in the mating connector receiving passageway. The pair of first grounding contact portions face the first contact portions of the pair of first differential signal contacts.
摘要翻译：一种电连接器，包括具有配合连接器接收通道的壳体。一对第一差分信号触点具有焊接部分和位于配合连接器接收通道中的第一接触部分。第一接地触点面对该对第一差分信号触点。第一接地触头具有焊接部分和一对第一接地接触部分，该第一接地接触部分通过间隙彼此间隔开并定位在配合连接器接收通道中。一对第一接地接触部分面对该对第一差分信号触点的第一接触部分。

6. 发明申请

US20150079843A1 Electrical Connector 有权
标题翻译：电气连接器
公开(公告)号：US20150079843A1
公开(公告)日：2015-03-19
申请号：US14081249
申请日：2013-11-15
申请人： Tyco Electronics Japan G.K.
发明人： Takeshi Nakashima , Isao Igarashi , Izumi Hasegawa
IPC分类号： H01R13/6585
CPC分类号： H01R13/6585 , H01R12/727 , H01R13/6461 , H01R23/005
摘要： An electrical connector including a housing having a mating connector receiving passageway. A pair of first differential signal contacts have solder portions and first contact portions positioned in the mating connector receiving passageway. A first ground contact faces the pair of first differential signal contacts. The first ground contact has a solder portion and a pair of first grounding contact portions spaced apart from each other by a gap and positioned in the mating connector receiving passageway. The pair of first grounding contact portions face the first contact portions of the pair of first differential signal contacts.
摘要翻译：一种电连接器，包括具有配合连接器接收通道的壳体。一对第一差分信号触点具有焊接部分和位于配合连接器接收通道中的第一接触部分。第一接地触点面对该对第一差分信号触点。第一接地触头具有焊接部分和一对第一接地接触部分，该第一接地接触部分通过间隙彼此间隔开并定位在配合连接器接收通道中。一对第一接地接触部分面对该对第一差分信号触点的第一接触部分。

7. 发明申请

US20190148860A1 SOCKET CONNECTOR FOR AN ELECTRONIC PACKAGE 审中-公开
公开(公告)号：US20190148860A1
公开(公告)日：2019-05-16
申请号：US15941744
申请日：2018-03-30
申请人： TE CONNECTIVITY CORPORATION , TYCO ELECTRONICS JAPAN G.K.
发明人： Jeffery Walter Mason , Takeshi Nakashima , Naoki Hashimoto , Shigeru Aihara
IPC分类号： H01R12/82 , H01R12/70 , H01R13/11 , H01R13/05 , H01R13/24 , H05K1/18
CPC分类号： H01R12/79 , G06F1/184 , H01L23/4006 , H01L2023/4031 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H01L2023/4087 , H01R12/52 , H01R12/585 , H01R12/61 , H01R12/7005 , H01R12/7076 , H01R12/716 , H01R12/82 , H01R12/85 , H01R13/057 , H01R13/11 , H01R13/111 , H01R13/2442 , H01R13/2464 , H01R43/0256 , H05K1/0203 , H05K1/0243 , H05K1/115 , H05K1/181 , H05K3/3436 , H05K7/1084 , H05K2201/044 , H05K2201/066 , H05K2201/10325 , H05K2201/10393 , H05K2201/10704 , H05K2201/10719 , H05K2201/10734
摘要： A socket connector includes a socket substrate having first socket substrate conductors and second socket substrate conductors, receptacle contacts electrically coupled to corresponding first socket substrate conductors and socket contacts electrically coupled to corresponding second socket substrate conductors. The receptacle contacts have receptacles receiving pin contacts of an electronic package and the socket contacts have terminating ends and mating ends with deflectable spring beams terminated to package contacts of the electronic package. At least one of the first socket substrate conductors and the second socket substrate conductors are configured to electrically connect the electronic package with the host circuit board.

8. 发明申请

US20160111833A1 Electrical Connector 有权
标题翻译：电气连接器
公开(公告)号：US20160111833A1
公开(公告)日：2016-04-21
申请号：US14517179
申请日：2014-10-17
申请人： Tyco Electronics Corporation , Tyco Electronics Japan G.K.
发明人： James L. McGrath , Takeshi Nakashima , Izumi Hasegawa , Isao Igarashi
IPC分类号： H01R24/60
CPC分类号： H01R24/60 , H01R2107/00
摘要： An electrical connector is provided with a first ground contact and a second ground contact. The first ground contact includes a first ground coupling portion and a pair of first ground contact portions extending substantially orthogonal from the first ground coupling portion. The pair of first ground contact portions includes a first upper ground contact portion stepped from a first lower ground contact portion. The second ground contact includes a second ground coupling portion and a pair of second ground contact portions extending substantially orthogonal from the second ground coupling portion. The pair of second ground contact portions includes a second upper ground contact portion stepped from a second lower ground contact portion. The second ground contact is positioned with the first ground contact such that their respective upper or lower ground contact portions are adjacent to each other.
摘要翻译：电连接器设置有第一接地触头和第二接地触点。第一接地触头包括第一接地耦合部分和从第一接地耦合部分基本上垂直延伸的一对第一接地接触部分。一对第一接地部分包括从第一下接地接触部分阶梯形的第一上接地接触部分。第二接地触点包括第二接地耦合部分和从第二接地耦合部分基本正交延伸的一对第二接地接触部分。一对第二接地部分包括从第二下接地接触部分阶梯形的第二上接地接触部分。第二接地触点与第一接地触头定位成使得它们各自的上接地部分或下接地部分彼此相邻。

9. 发明授权

US10348015B2 Socket connector for an electronic package 有权
公开(公告)号：US10348015B2
公开(公告)日：2019-07-09
申请号：US15941744
申请日：2018-03-30
申请人： TE CONNECTIVITY CORPORATION , TYCO ELECTRONICS JAPAN G.K.
发明人： Jeffery Walter Mason , Takeshi Nakashima , Naoki Hashimoto , Shigeru Aihara
IPC分类号： H01R12/82 , H01R13/11 , H01R13/05 , H01R13/24 , H05K1/18 , H01R12/70 , H01L23/40
摘要： A socket connector includes a socket substrate having first socket substrate conductors and second socket substrate conductors, receptacle contacts electrically coupled to corresponding first socket substrate conductors and socket contacts electrically coupled to corresponding second socket substrate conductors. The receptacle contacts have receptacles receiving pin contacts of an electronic package and the socket contacts have terminating ends and mating ends with deflectable spring beams terminated to package contacts of the electronic package. At least one of the first socket substrate conductors and the second socket substrate conductors are configured to electrically connect the electronic package with the host circuit board.

10. 发明授权

US10741951B2 Socket connector assembly for an electronic package 有权
公开(公告)号：US10741951B2
公开(公告)日：2020-08-11
申请号：US15941615
申请日：2018-03-30
申请人： TE CONNECTIVITY CORPORATION , TYCO ELECTRONICS JAPAN G.K.
发明人： Jeffery Walter Mason , Takeshi Nakashima , Naoki Hashimoto
IPC分类号： H01R12/00 , H01R12/82 , H05K7/10 , G06F1/18 , H05K3/34 , H01R43/02 , H01R13/11 , H01R12/52 , H01R12/58 , H01R12/61 , H01R12/70 , H01R12/79 , H01R12/85 , H01R13/24 , H05K1/02 , H05K1/11 , H05K1/18 , H01R13/05 , H01R12/71 , H01L23/40
摘要： A socket connector includes a socket assembly having a socket substrate and socket contacts. The socket substrate has first and second upper mating areas and a first lower mating area. The socket substrate has first and second socket substrate conductors at the first and second upper mating areas, respectively, and third socket substrate conductors at the first lower mating area electrically connected to corresponding first socket substrate conductors. The first socket substrate conductors are electrically connected to an electronic package, the second socket substrate conductors are electrically connected to an electrical component and the third socket substrate conductors are electrically connected to a host circuit board. The socket assembly is configured to electrically connect the electronic package with both the host circuit board and the electrical component. The socket contacts have a terminating end terminated to corresponding first socket substrate conductors and a mating end mated to package contacts.

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