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1. 发明公开

EP2423572A2 Light module 有权转让
标题翻译： Lichtmodul
公开(公告)号：EP2423572A2
公开(公告)日：2012-02-29
申请号：EP11177056.6
申请日：2011-08-10
申请人： Tyco Electronics Corporation
发明人： Pelton, Bruce A. , Leijnse, Olaf , van der Krogt, Jasper , Mostoller, Mathew Edward , Rix, Robert David , Derks, Erik
IPC分类号： F21V19/00 , F21V29/00 , F21V14/04 , F21V14/06 , F21V17/12 , F21V17/06 , F21V17/14 , F21V17/02 , F21K99/00 , F21Y101/02
CPC分类号： F21V29/70 , F21K9/00 , F21S2/005 , F21S8/02 , F21V14/04 , F21V14/06 , F21V15/01 , F21V17/02 , F21V19/0035 , F21V19/04 , F21V23/06 , F21Y2115/10 , H01R33/18
摘要： A light module (210) includes a light engine (214) that has an LED package (216) having power terminals (220). A base ring assembly (230) holds the light engine (214). The base ring assembly (230) has a base ring (240) configured to be mounted to a supporting structure. The base ring (240) has a securing feature (245). The base ring assembly (230) has a contact holder (242) that holds power contacts. The power contacts are spring biased against the power terminals (220) to create a separable power connection with the power terminals (220). A top cover assembly (232) is coupled to the base ring (240). The top cover assembly (232) has a collar (260) surrounding the base ring (240). The top cover assembly (232) has a securing feature that engages the securing feature of the base ring (240) to couple the collar (260) to the base ring (240). The collar (260) has a cavity (266) and an optical component (234) is received in the cavity (266). The optical component (234) is positioned to receive light from the LED package (216) and the optical component (234) is configured to emit the light generated by the LED package (216).
摘要翻译：光模块（210）包括具有具有电源端子（220）的LED封装（216）的光引擎（214）。基座组件（230）保持光引擎（214）。底环组件（230）具有构造成安装到支撑结构的基环（240）。基座（240）具有固定特征（245）。基座组件（230）具有保持电源触点的触点支架（242）。电源触头被弹簧偏置抵靠电源端子（220）以与电源端子（220）形成可分离的电源连接。顶盖组件（232）联接到基座环（240）。顶盖组件（232）具有围绕基环（240）的轴环（260）。顶盖组件（232）具有固定特征，其接合基环（240）的固定特征，以将套环（260）联接到基座环（240）。套环（260）具有空腔（266），并且光学部件（234）被容纳在空腔（266）中。光学部件（234）定位成接收来自LED封装（216）的光，并且光学部件（234）被配置为发射由LED封装（216）产生的光。

2. 发明公开

EP2392903A3 Temperature measurement system for a light emitting diode (led) assembly 有权转让
标题翻译：用于发光二极管的阵列的温度测量系统（LED）
公开(公告)号：EP2392903A3
公开(公告)日：2014-01-22
申请号：EP11168532.7
申请日：2011-06-01
申请人： Tyco Electronics Corporation
发明人： Jackson, Stephen M. , Rix, Robert David , Pelton, Bruce A. , Ahmed, Mohammad S. , Weber, Ronald Martin , Mostoller, Matthew Edward
IPC分类号： G01K7/42 , G01K13/00
CPC分类号： G01K7/42 , G01K13/00
摘要： A temperature measurement system (100) is provided for a light emitting diode (LED) assembly (10) that includes an LED (14) having two semiconductors joined together at an LED junction. The system (100) includes a temperature sensor (102) operatively connected to the LED assembly (10) at a remote location that is remote from the LED junction. The temperature sensor (102) is configured to measure a temperature of the LED assembly (10) at the remote location. A temperature calculation module (106) is operatively connected to the temperature sensor (102) for receiving the measured temperature at the remote location from the temperature sensor (102). The temperature calculation module (106) is configured to determine a junction temperature at the LED junction based on the measured temperature at the remote location.

3. 发明公开

EP2392903A2 Temperature Measurement System For A Light Emitting Diode (LED) Assembly 有权转让
标题翻译：温度控制系统（Dioden（LED））
公开(公告)号：EP2392903A2
公开(公告)日：2011-12-07
申请号：EP11168532.7
申请日：2011-06-01
申请人： Tyco Electronics Corporation
发明人： Jackson, Stephen M. , Rix, Robert David , Pelton, Bruce A. , Ahmed, Mohammad S. , Weber, Ronald Martin , Mostoller, Matthew Edward
IPC分类号： G01K7/42 , G01K13/00
CPC分类号： G01K7/42 , G01K13/00
摘要： A temperature measurement system (100) is provided for a light emitting diode (LED) assembly (10) that includes an LED (14) having two semiconductors joined together at an LED junction. The system (100) includes a temperature sensor (102) operatively connected to the LED assembly (10) at a remote location that is remote from the LED junction. The temperature sensor (102) is configured to measure a temperature of the LED assembly (10) at the remote location. A temperature calculation module (106) is operatively connected to the temperature sensor (102) for receiving the measured temperature at the remote location from the temperature sensor (102). The temperature calculation module (106) is configured to determine a junction temperature at the LED junction based on the measured temperature at the remote location.
摘要翻译：提供了一种用于发光二极管（LED）组件（10）的温度测量系统（100），该组件包括在LED连接处连接在一起的两个半导体的LED（14）。该系统（100）包括温度传感器（102），该温度传感器在远离LED连接点的远程位置处可操作地连接到LED组件（10）。温度传感器（102）被配置为测量在远程位置处的LED组件（10）的温度。温度计算模块（106）可操作地连接到温度传感器（102），用于接收来自温度传感器（102）的远程位置的测量温度。温度计算模块（106）被配置为基于远程位置处的测量温度来确定LED结处的结温。

4. 发明授权

EP2423572B1 Light module 有权转让
标题翻译：光模块
公开(公告)号：EP2423572B1
公开(公告)日：2015-08-05
申请号：EP11177056.6
申请日：2011-08-10
申请人： Tyco Electronics Corporation , Tyco Electronics Nederland B.V.
发明人： Pelton, Bruce A. , Leijnse, Olaf , van der Krogt, Jasper , Mostoller, Mathew Edward , Rix, Robert David , Derks, Erik
IPC分类号： F21V19/00 , F21V29/00 , F21V14/04 , F21V14/06 , F21V17/12 , F21V17/06 , F21V17/14 , F21V17/02 , F21K99/00 , F21Y101/02
CPC分类号： F21V29/70 , F21K9/00 , F21S2/005 , F21S8/02 , F21V14/04 , F21V14/06 , F21V15/01 , F21V17/02 , F21V19/0035 , F21V19/04 , F21V23/06 , F21Y2115/10 , H01R33/18
摘要： A light module (210) includes a light engine (214) that has an LED package (216) having power terminals (220). A base ring assembly (230) holds the light engine (214). The base ring assembly (230) has a base ring (240) configured to be mounted to a supporting structure. The base ring (240) has a securing feature (245). The base ring assembly (230) has a contact holder (242) that holds power contacts. The power contacts are spring biased against the power terminals (220) to create a separable power connection with the power terminals (220). A top cover assembly (232) is coupled to the base ring (240). The top cover assembly (232) has a collar (260) surrounding the base ring (240). The top cover assembly (232) has a securing feature that engages the securing feature of the base ring (240) to couple the collar (260) to the base ring (240). The collar (260) has a cavity (266) and an optical component (234) is received in the cavity (266). The optical component (234) is positioned to receive light from the LED package (216) and the optical component (234) is configured to emit the light generated by the LED package (216).

5. 发明公开

EP2423572A3 Light module 有权转让
标题翻译：光模块
公开(公告)号：EP2423572A3
公开(公告)日：2013-02-13
申请号：EP11177056.6
申请日：2011-08-10
申请人： Tyco Electronics Corporation
发明人： Pelton, Bruce A. , Leijnse, Olaf , van der Krogt, Jasper , Mostoller, Mathew Edward , Rix, Robert David , Derks, Erik
IPC分类号： F21V19/00 , F21V29/00 , F21V14/04 , F21V14/06 , F21V17/12 , F21V17/06 , F21V17/14 , F21V17/02 , F21K99/00 , F21Y101/02
CPC分类号： F21V29/70 , F21K9/00 , F21S2/005 , F21S8/02 , F21V14/04 , F21V14/06 , F21V15/01 , F21V17/02 , F21V19/0035 , F21V19/04 , F21V23/06 , F21Y2115/10 , H01R33/18
摘要： A light module (210) includes a light engine (214) that has an LED package (216) having power terminals (220). A base ring assembly (230) holds the light engine (214). The base ring assembly (230) has a base ring (240) configured to be mounted to a supporting structure. The base ring (240) has a securing feature (245). The base ring assembly (230) has a contact holder (242) that holds power contacts. The power contacts are spring biased against the power terminals (220) to create a separable power connection with the power terminals (220). A top cover assembly (232) is coupled to the base ring (240). The top cover assembly (232) has a collar (260) surrounding the base ring (240). The top cover assembly (232) has a securing feature that engages the securing feature of the base ring (240) to couple the collar (260) to the base ring (240). The collar (260) has a cavity (266) and an optical component (234) is received in the cavity (266). The optical component (234) is positioned to receive light from the LED package (216) and the optical component (234) is configured to emit the light generated by the LED package (216).
摘要翻译：发光模块（210）包括具有LED封装（216）的光引擎（214），所述LED封装具有电源端子（220）。底座环组件（230）保持光引擎（214）。底座环组件（230）具有构造成安装到支撑结构的底座环（240）。基环（240）具有固定特征（245）。底座环组件（230）具有保持电力触头的触头座（242）。电力触头相对于电力端子（220）弹簧偏置以形成与电力端子（220）的可分离电力连接。顶盖组件（232）联接到基环（240）。顶盖组件（232）具有围绕基环（240）的套环（260）。顶盖组件（232）具有固定特征，该固定特征与基环（240）的固定特征接合以将轴环（260）联接到基环（240）。套环（260）具有空腔（266）并且光学部件（234）容纳在空腔（266）中。光学部件（234）被定位成接收来自LED封装（216）的光，并且光学部件（234）被配置为发射由LED封装（216）产生的光。

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