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    • 3. 发明授权
    • Method for fabricating semiconductor device with high quality crystalline silicon film
    • 制造具有高质量晶体硅膜的半导体器件的方法
    • US06337259B1
    • 2002-01-08
    • US09579440
    • 2000-05-26
    • Tohru UedaYasumori FukushimaYoshinori Higami
    • Tohru UedaYasumori FukushimaYoshinori Higami
    • H01L21322
    • H01L29/66757H01L21/3226H01L29/78675
    • An amorphous silicon film is deposited on a quartz substrate, and a metal of Ni is introduced into the amorphous silicon film so that the amorphous silicon film is crystallized. Phosphorus is ion-implanted with an oxide pattern used as a mask. A heating process is performed in a nitrogen atmosphere, by which Ni is gettered. A heating process is performed in an O2 atmosphere, by which Ni is gettered into the oxide. Like this, by performing the first gettering in a non-oxidative atmosphere, the Ni concentration can be reduced to such a level that oxidation does not cause any increase of irregularities or occurrence of pinholes. Thus, in a second gettering, enough oxidation can be effected without minding any increase of irregularities and occurrence of pinholes, so that the Ni concentration can be reduced to an extremely low level. Also, a high-quality crystalline silicon film free from surface irregularities and pinholes can be obtained.
    • 将非晶硅膜沉积在石英衬底上,将Ni的金属引入到非晶硅膜中,使得非晶硅膜结晶化。 用作为掩模的氧化物图案离子注入磷。 在氮气气氛中进行加热处理,Ni被吸收。 在O2气氛中进行加热处理,通过该加热处理将Ni吸收到氧化物中。 像这样,通过在非氧化性气氛中进行第一吸气,可以将Ni浓度降低到氧化不引起不规则性增加或针孔发生的程度。 因此,在第二吸气中,可以实现足够的氧化,而不会引起不规则性的增加和针孔的发生,使得Ni浓度可以降低到非常低的水平。 此外,可以获得没有表面凹凸和针孔的高品质结晶硅膜。
    • 8. 发明授权
    • Active matrix substrate and display device
    • 有源矩阵基板和显示装置
    • US06927809B2
    • 2005-08-09
    • US10694506
    • 2003-10-27
    • Masahito GotohTohru UedaYoshinori Higami
    • Masahito GotohTohru UedaYoshinori Higami
    • G02F1/1335G02F1/133G02F1/1362G02F1/1368G09F9/30H01L27/12H01L27/13H01L29/786G02F1/136
    • G02F1/136209G02F1/136213G02F1/136227G02F2201/40H01L27/1255H01L29/78633
    • The active matrix substrate of the invention includes: a storage capacitor formed on a board; a first insulating layer formed on the storage capacitor; a semiconductor layer formed above the storage capacitor via the first insulating layer: a gate insulating layer formed on the semiconductor layer; a gate electrode layer including a gate electrode formed above the semiconductor layer via the gate insulating layer; a second insulating layer covering the gate electrode layer and the semiconductor layer; a first light-shielding layer formed above the semiconductor layer via the second insulating layer to cover at least a channel region of the semiconductor layer; a third insulating layer formed on the first light-shielding layer; a source electrode layer including source and drain electrodes formed on the third insulating layer; a fourth insulating layer formed on the source electrode layer; and a pixel electrode formed on the fourth insulating layer and electrically connected to the drain electrode. The first light-shielding layer is conductive and has a drain-side light-shielding portion electrically connected to one of a pair of electrodes of the storage capacitor and also to the drain electrode.
    • 本发明的有源矩阵基板包括:形成在板上的存储电容器; 形成在所述存储电容器上的第一绝缘层; 半导体层,其经由所述第一绝缘层形成在所述存储电容器的上方;形成在所述半导体层上的栅极绝缘层; 栅极电极层,包括经由所述栅极绝缘层形成在所述半导体层上方的栅电极; 覆盖所述栅电极层和所述半导体层的第二绝缘层; 第一遮光层,其经由所述第二绝缘层形成在所述半导体层上方以覆盖所述半导体层的至少沟道区域; 形成在所述第一遮光层上的第三绝缘层; 源电极层,包括形成在所述第三绝缘层上的源极和漏极; 形成在所述源电极层上的第四绝缘层; 以及形成在第四绝缘层上并与漏电极电连接的像素电极。 第一遮光层是导电的,并且具有电连接到存储电容器的一对电极中的一个以及漏极电极的漏极侧遮光部分。
    • 9. 发明授权
    • Active matrix display device having high intensity and high precision and manufacturing method thereof
    • 具有高强度和高精度的有源矩阵显示装置及其制造方法
    • US06639245B2
    • 2003-10-28
    • US10120981
    • 2002-04-11
    • Masahito GotohTohru Ueda
    • Masahito GotohTohru Ueda
    • H01L29786
    • H01L27/12G02F1/13454H01L21/0242H01L21/02532H01L21/02672H01L27/1277
    • An a-Si film 12 is formed on the whole surface of a quartz substrate 11, and a protection film 13 is formed in a region to be used as a display unit on the a-Si film 12. Subsequently, after a catalyst metal is selectively introduced into the whole surface of a region to be used as a peripheral drive circuit on the a-Si film 12, crystal growth is allowed by heating the a-Si film 12 to form a CG silicon film 14 and a p-Si film 15. Then, the catalyst metal in the CG silicon film 14 and the p-Si film 15 is removed by gettering. The concentration of the catalyst metal in the CG silicon film 14 is in the range of 1×1013 atoms/cm13 or higher and lower than 1×1015 atoms/cm3. The concentration of the catalyst metal in the p-Si film for a display unit 15 is made lower than the concentration of the catalyst metal in the CG silicon film 14b for a peripheral drive circuit. Thereby, a semiconductor device having a driver monolithic type liquid crystal display device with high intensity, high precision and uniform characteristics can be achieved.
    • 在石英衬底11的整个表面上形成a-Si膜12,并且在a-Si膜12上用作显示单元的区域中形成保护膜13.接着,在催化剂金属为 选择性地引入到用作a-Si膜12上的外围驱动电路的区域的整个表面上,通过加热a-Si膜12以形成CG硅膜14和p-Si膜,允许晶体生长 然后,通过吸气除去CG硅膜14和p-Si膜15中的催化剂金属。 CG硅膜14中的催化剂金属的浓度在1×10 13原子/ cm 3以上且低于1×10 15原子/ cm 3的范围内。 使用于显示单元15的p-Si膜中的催化剂金属的浓度低于用于外围驱动电路的CG硅膜14b中的催化剂金属的浓度。 因此,可以实现具有高强度,高精度和均匀特性的驱动器单片型液晶显示装置的半导体器件。
    • 10. 发明授权
    • Quantum thin line producing method and semiconductor device
    • 量子细线生产方法和半导体器件
    • US06346436B1
    • 2002-02-12
    • US09493627
    • 2000-01-28
    • Yasumori FukushimaTohru UedaKunio Kamimura
    • Yasumori FukushimaTohru UedaKunio Kamimura
    • H01L2100
    • B82Y20/00B82Y10/00H01L21/02381H01L21/02532H01L21/02603H01L21/0262H01L21/02639H01L29/66439H01L33/06H01L33/08H01S5/341Y10S438/962
    • A nanometer-size quantum thin line is formed on a semiconductor substrate of a Si substrate or the like by means of the general film forming technique, lithographic technique and etching technique. By opportunely using the conventional film forming technique, photolithographic technique and etching technique, a second oxide film that extends in the perpendicular direction is formed on an Si substrate. Then, by removing the second oxide film that extends in the perpendicular direction, a second nitride film located below the film and a first oxide film located below the film by etching, a groove for exposing the Si substrate is formed. Then, a Si thin line is made to epitaxially grow on the exposed portion of the Si substrate. The quantum thin line is thus formed without using any special fine processing technique. The width of the groove can be accurately controlled in nanometers by controlling the film thickness of the second oxide film that is formed by oxidizing the surface of the second nitride film.
    • 通过一般的成膜技术,光刻技术和蚀刻技术,在Si衬底等的半导体衬底上形成纳米尺寸量子细线。 通过适当地使用传统的成膜技术,光刻技术和蚀刻技术,在Si衬底上形成沿垂直方向延伸的第二氧化膜。 然后,通过除去沿垂直方向延伸的第二氧化物膜,通过蚀刻位于膜下方的第二氮化物膜和位于膜下方的第一氧化物膜,形成用于暴露Si衬底的沟槽。 然后,使Si细线在Si衬底的暴露部分上外延生长。 因此在不使用任何特殊的精细加工技术的情况下形成量子细线。 通过控制通过氧化第二氮化物膜的表面而形成的第二氧化膜的膜厚,能够以纳米的形式精确地控制槽的宽度。