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    • 1. 发明授权
    • Polyphenylene sulfide resin compositions and process for preparation of
same
    • 聚苯硫醚树脂组合物及其制备方法
    • US5684088A
    • 1997-11-04
    • US412592
    • 1995-03-29
    • Tsuyoshi MiyamoriYoshihisa YamamotoMasami KatoMasaji KomoriTetsuo Shimizu
    • Tsuyoshi MiyamoriYoshihisa YamamotoMasami KatoMasaji KomoriTetsuo Shimizu
    • C08L27/18C08L81/02C08G63/48C08L81/00
    • C08L81/02C08L27/18Y10S525/902
    • The present invention relates to a PPS resin composition comprising a matrix of the PPS which is filled with a PTFE powder baked at a temperature not less than a melting point thereof and having a number-average molecular weight of not less than 1.5 million or PTFE fine particles having an average particle size of 0.05 to 1 .mu.m and comprising a fibrillating core portion of a high molecular weight PTFE with a number-average molecular weight of not less than 1.5 million and a non-fibrillating shell portion of a low molecular weight PTFE so that a content thereof is 40 to 80% by weight in the composition, and also relates to a process for preparing said PPS resin composition, which is characterized in that melting and kneading are carried out at a temperature from a temperature of not less than a melting point of PPS to a temperature of not more lower than a melting point of a high molecular weight PTFE. The polyphenylene sulfide resin composition of the present invention presents sliding properties such as excellent friction and wear resistance which sliding materials mainly containing usual polytetrafluoroethylene have as well as properties of polyphenylene sulfide such as injection moldability and high mechanical properties.
    • 本发明涉及一种PPS树脂组合物,其包含PPS基体,其填充有在不低于其熔点的温度下焙烧的数均分子量不小于150万的PTFE粉末或PTFE细粉 平均粒径为0.05-1μm的颗粒,其包含数均分子量不小于150万的高分子量PTFE的原纤化核心部分和低分子量PTFE的非原纤化壳部分 使其含量在组合物中为40〜80重量%,并且还涉及制备所述PPS树脂组合物的方法,其特征在于熔融和捏合在不低于 PPS的熔点至不高于高分子量PTFE的熔点的温度。 本发明的聚苯硫醚树脂组合物具有优异的摩擦和耐磨性的滑动性能,主要含有通常的聚四氟乙烯的滑动材料以及聚苯硫醚的性能如注射成型性和高机械性能。
    • 3. 发明授权
    • Resin composition
    • 树脂组成
    • US06479578B2
    • 2002-11-12
    • US09797693
    • 2001-03-05
    • Takayuki ArakiMasahiro KumegawaTsuyoshi MiyamoriMasami KatoMasaji KomoriTaketo KatoTetsuo Shimizu
    • Takayuki ArakiMasahiro KumegawaTsuyoshi MiyamoriMasami KatoMasaji KomoriTaketo KatoTetsuo Shimizu
    • C08F800
    • C08L27/12C08K3/01C08K3/013C08L27/18C08L2205/02H05K1/034H05K1/0373C08L2666/04
    • A resin composition which gives a molded article having both of excellent mechanical properties and abrasion resistance with maintaining excellent thermal resistance, chemical resistance, surface characteristics (non-sticking property, low friction property), electric insulating property, etc. of a fluorine-containing polymer; a molded article obtained from the resin composition; and a method for producing the molded article are provided. The resin composition comprises: (A-1) a fluorine-containing ethylenic polymer prepared by copolymerizing at least one of fluorine-containing monomers having any one of hydroxyl, carboxyl, a carboxylate salt group, a carboxylate ester group or epoxy in an amount of 0.05 to 30% by mole on the basis of the total amount of monomers, and (B-1) an inorganic filler or a non-meltable organic filler, wherein said resin composition comprises 1 to 99.5% by weight of the component (A-1) and 0.5 to 99% by weight of the component (B-1).
    • 赋予具有优异的机械性能和耐磨性两者的保持优异的含氟的耐热性,耐化学性,表面特性(不粘附性,低摩擦性),电绝缘性等的成型体的树脂组合物 聚合物; 由树脂组合物得到的成型体; 并提供了制造模制品的方法。 树脂组合物包含:(A-1)通过使具有羟基,羧基,羧酸盐基,羧酸酯基或环氧基中的任一个的含氟单体的至少一种共聚合而制备的含氟乙烯性聚合物的量为 基于单体总量为0.05〜30摩尔%,和(B-1)无机填料或不可熔融有机填料,其中所述树脂组合物包含1-99.5重量%的组分(A- 1)和0.5〜99重量%的成分(B-1)。
    • 8. 发明授权
    • Fluorine-containing resin composition for parts of electronic and electrical equipment and same parts
    • 含氟树脂组合物用于电子和电气设备及相关零件的零件
    • US06245845B1
    • 2001-06-12
    • US09433371
    • 1999-11-03
    • Tsuyoshi MiyamoriMasaji KomoriTakuya Arase
    • Tsuyoshi MiyamoriMasaji KomoriTakuya Arase
    • C08K338
    • C08L27/12C08K7/08C08L71/00C08L81/02C08L2666/14C08L2666/04
    • To provide a fluorine-containing resin composition useful as a molding material for parts of electronic and electrical equipment which assures well-balanced enhancement of dielectric property, heat resistance, mold-processability (precise processability) and mechanical properties and the parts of electronic and electrical equipment. The fluorine-containing resin composition for parts of electronic and electrical equipment comprises 70 to 95% by weight of (I) fluorine-containing resin mixture comprising (a) a fluorine-containing resin containing polytetrafluoroethylene not to be fibrillated and (b) a thermoplastic resin other than the fluorine-containing resin and 5 to 30% by weight of (II) a metal compound whisker having a single bond strength of not less than 190 KJ/mol calculated from a dissociation energy of bond between a metal element and oxygen. The parts of electronic and electrical equipment which are obtained from the composition have a dielectric constant of not more than 3.5.
    • 提供用作电子和电气设备部件的成型材料的含氟树脂组合物,其确保介电性能,耐热性,模塑加工性(精加工性)和机械性能以及电子和电气部件的均衡增强 设备。 用于电子和电气设备部件的含氟树脂组合物包含70至95重量%的(I)含氟树脂混合物,其包含(a)含有不被原纤化的聚四氟乙烯的含氟树脂和(b)热塑性塑料 除了含氟树脂之外的树脂和5〜30重量%的由(II)金属元素和氧之间的键的解离能计算的单键强度不小于190KJ / mol的金属化合物晶须。 从组合物获得的电子和电气设备的部分具有不大于3.5的介电常数。