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    • 2. 发明授权
    • Fine terminal, its manufacturing method, and contact sheet
    • 精细终端,其制造方法和接触片
    • US07344382B2
    • 2008-03-18
    • US10553748
    • 2004-12-09
    • Tsuyoshi Haga
    • Tsuyoshi Haga
    • H01R12/00
    • H01M2/204H01M2/30
    • A micro terminal for inspection or installation with high connection reliability is provided at lower cost. A micro terminal according to the present invention has electrical conduction between the micro terminal and an electrode of an electronic device or an inspection device and includes a columnar contactor in contact with the electrode. The contactor has a spring structure which is elastically deformed when pressed against the electrode. The contactor includes a protrusion protruding outwardly at its end in contact with the electrode and the shape of the protrusion has a part of a sphere or a part of a paraboloid of revolution.
    • 以较低的成本提供了具有高连接可靠性的检查或安装微型终端。 根据本发明的微型端子在微型端子与电子器件或检查装置的电极之间具有导电性,并且包括与电极接触的柱状接触器。 接触器具有弹簧结构,当按压电极时弹性变形。 接触器包括在其与电极接触的端部向外突出的突起,并且突起的形状具有球体的一部分或旋转抛物面的一部分。
    • 4. 发明申请
    • Method for manufacturing metal microstructure
    • 制造金属微观结构的方法
    • US20060276044A1
    • 2006-12-07
    • US11503303
    • 2006-08-14
    • Jun YoritaYoshihiro HirataTsuyoshi Haga
    • Jun YoritaYoshihiro HirataTsuyoshi Haga
    • G03C5/00H01L21/302
    • B81C99/0085B81C2201/032C25D1/003H01L21/4821H05K3/202H05K3/205
    • A method of manufacturing a metal microstructure (1) by using a resin mold (13). In order to provide a method in which a mild manufacturing condition which causes less damage to the resin mold (13) can be set and the high-precision metal microstructure (1) can be mass-produced by uniform electroforming, the method of manufacturing the metal microstructure (1) according to the present invention includes the steps of: fixing on a conductive substrate (11) the resin mold (13) having a vacant portion penetrating in the direction of thickness, by interposing a photosensitive polymer (12) having a chemical composition changed by an electron beam, ultraviolet radiation or visible radiation so as to form a layered structure (2) having the resin mold (13); exposing the layered structure (2) having the resin mold (13) to an electron beam, ultraviolet radiation or visible radiation; removing an exposed photosensitive polymer (12c) existing at the vacant portion of the resin mold (13); and filling with a metal (14) the vacant portion of the layered structure (2) having the resin mold (13) by electroforming.
    • 一种通过使用树脂模具(13)制造金属微结构(1)的方法。 为了提供可以设定对树脂模具(13)造成较小损害的温和制造条件并且可以通过均匀电铸来大量生产高精度金属微结构(1)的方法,制造 根据本发明的金属微结构(1)包括以下步骤:通过插入具有一个或多个金属微结构(1)的光敏聚合物(12)将具有穿过厚度方向的空白部分的树脂模具(13)固定在导电基板(11)上, 化学成分由电子束,紫外线辐射或可见光辐射而变化,形成具有树脂模具(13)的层状结构(2)。 将具有树脂模具(13)的层状结构(2)暴露于电子束,紫外线或可见光; 去除存在于树脂模具(13)的空缺部分的曝光的光敏聚合物(12c); 并通过电铸将金属(14)填充到具有树脂模具(13)的层状结构(2)的空位部分上。
    • 8. 发明授权
    • Contact probe
    • 接触探头
    • US07190179B2
    • 2007-03-13
    • US10472571
    • 2002-04-10
    • Tsuyoshi HagaKazunori Okada
    • Tsuyoshi HagaKazunori Okada
    • G01R31/02
    • G01R1/07314C22C19/03C22C19/07C25D1/10G01R1/06716
    • A contact probe is fabricated by forming a resin mold with a cavity on a substrate having conductivity, and filling the cavity with metal through electroforming. The metal includes a cobalt-tungsten alloy. Alternatively, a cobalt-molybdenum alloy may be used instead of the cobalt-tungsten alloy. Alternatively, a contact probe can be made from nickel, cobalt or copper, and have a coat film of cobalt-tungsten alloy or cobalt-molybdenum alloy formed thereon to increase the abrasion resistance. A nickel-molybdenum alloy can be used instead of the cobalt-tungsten alloy or cobalt-molybdenum alloy.
    • 通过在具有导电性的基板上形成具有空腔的树脂模具并通过电铸将金属填充到空腔中来制造接触探针。 金属包括钴 - 钨合金。 或者,可以使用钴 - 钼合金代替钴 - 钨合金。 或者,接触探针可以由镍,钴或铜制成,并且具有形成在其上的钴 - 钨合金或钴 - 钼合金的涂膜以增加耐磨性。 可以使用镍 - 钼合金代替钴 - 钨合金或钴 - 钼合金。
    • 9. 发明授权
    • Method for manufacturing metal microstructure
    • 制造金属微观结构的方法
    • US07105281B2
    • 2006-09-12
    • US10492918
    • 2002-10-25
    • Jun YoritaYoshihiro HirataTsuyoshi Haga
    • Jun YoritaYoshihiro HirataTsuyoshi Haga
    • G03F7/039
    • B81C99/0085B81C2201/032C25D1/003H01L21/4821H05K3/202H05K3/205
    • A method of manufacturing a metal microstructure by using a resin mold. In order to provide a method in which a mild manufacturing condition which causes less damage to the resin mold can be set and the high-precision metal microstructure can be mass-produced by uniform electroforming, the method of manufacturing the metal microstructure according to the present invention includes the steps of: fixing on a conductive substrate the resin mold having a vacant portion penetrating in the direction of thickness, by interposing a photosensitive polymer having a chemical composition changed by an electron beam, ultraviolet radiation or visible radiation so as to form a layered structure having the resin mold; exposing the layered structure having the resin mold to an electron beam, ultraviolet radiation or visible radiation; removing an exposed photosensitive polymer existing at the vacant portion of the resin mold; and filling with a metal the vacant portion of the layered structure having the resin mold by electroforming.
    • 通过使用树脂模具制造金属微结构的方法。 为了提供一种可以设定对树脂模具造成较小损害的温和制造条件并且通过均匀电铸可以大量生产高精度金属微结构的方法,根据本发明的金属组织的制造方法 本发明包括以下步骤:通过插入具有由电子束,紫外线或可见光辐照的化学组成改变的光敏聚合物,将具有穿透厚度方向的空白部分的树脂模具固定在导电基板上,以形成 具有树脂模具的层状结构; 将具有树脂模具的层状结构暴露于电子束,紫外线辐射或可见光辐射; 去除存在于树脂模具的空缺部分的曝光的光敏聚合物; 并通过电铸将金属填充到具有树脂模具的层状结构的空
      间部分。