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    • 6. 发明申请
    • MAGNETIC RECORDING MEDIUM MANUFACTURING DEVICE
    • 磁记录介质制造设备
    • US20110186225A1
    • 2011-08-04
    • US13055329
    • 2009-07-21
    • Tsutomu NishihashiTadashi MoritaKazuhiro WatanabeKenji SatoTakuya UzumakiTsutomu Tanaka
    • Tsutomu NishihashiTadashi MoritaKazuhiro WatanabeKenji SatoTakuya UzumakiTsutomu Tanaka
    • H01L21/3065
    • G11B5/855
    • A magnetic recording medium is manufactured without the disappearance of the surface of a substrate that comprises a magnetic recording layer by ion milling and without being influenced by the atmosphere. A magnetic recording medium manufacturing device manufactures a magnetic recording medium by implanting an ion beam into a substrate that comprises a magnetic recording layer and removing by ashing the surface of the substrate that comprises the magnetic recording layer after the ion beam is implanted. The magnetic recording medium manufacturing device comprising an ion implantation chamber for implanting the ion beam into the substrate that comprises the magnetic recording layer coated with a resist film or a metal mask, and an ashing chamber for removing, by ashing, with plasma, the resist film or the metal mask of the substrate that comprises the magnetic recording layer coated with the resist film or the metal mask. The ion implantation chamber and the ashing chamber are coupled in a vacuum state. The magnetic recording medium manufactured device is provided with a substrate carrier for carrying the substrate into which the ion beam is implanted from the ion implantation chamber to the ashing chamber.
    • 通过离子研磨而不受大气的影响,制造磁记录介质,而不会消失包括磁记录层的基板的表面。 磁记录介质制造装置通过将离子束注入到包含磁记录层的基板中,并且在离子束被植入之后通过灰化包括磁记录层的基板的表面去除而制造磁记录介质。 该磁记录介质制造装置包括用于将离子束注入基片的离子注入室,所述离子注入室包括涂覆有抗蚀剂膜或金属掩模的磁记录层,以及灰化室,用灰浆除去等离子体, 膜或包含涂覆有抗蚀剂膜或金属掩模的磁记录层的基板的金属掩模。 离子注入室和灰化室在真空状态下耦合。 磁记录介质制造装置设置有用于承载离子束从离子注入室注入至灰化室的基板的基板载体。
    • 9. 发明授权
    • Plasma doping method and manufacturing method of semiconductor device
    • 等离子体掺杂方法及半导体器件的制造方法
    • US08383496B2
    • 2013-02-26
    • US13054825
    • 2009-08-07
    • Kazuhiko TonariTsutomu Nishihashi
    • Kazuhiko TonariTsutomu Nishihashi
    • H01L21/26H01L21/42
    • H01L21/2236H01L29/6659H01L29/7833
    • A plasma doping method capable of introducing impurities into an object to be processed uniformly is supplied. Plasma of a diborane gas containing boron, which is a p-type impurity, and an argon gas, which is a rare gas, is generated, and no bias potential is applied to a silicon substrate. Thereby, the boron radicals in the plasma are deposited on the surface of the silicon substrate. After that, the supply of the diborane gas is stopped, and bias potential is applied to the silicon substrate. Thereby, the argon ions in the plasma are radiated onto the surface of the silicon substrate. The radiated argon ions collide with the boron radicals, and thereby boron radicals are introduced into the silicon substrate. The introduced boron radicals are activated by thermal processing, and thereby a p-type impurity diffusion layer is formed in the silicon substrate.
    • 提供能够均匀地将杂质引入被加工物的等离子体掺杂法。 产生作为p型杂质的硼的乙硼烷气体的等离子体和作为稀有气体的氩气,并且不会对硅衬底施加偏置电位。 由此,等离子体中的硼自由基沉积在硅衬底的表面上。 之后,停止供给乙硼烷气体,向硅基板施加偏置电位。 由此,将等离子体中的氩离子照射到硅基板的表面上。 辐射的氩离子与硼自由基碰撞,从而将硼自由基引入到硅衬底中。 引入的硼自由基通过热处理活化,从而在硅衬底中形成p型杂质扩散层。
    • 10. 发明授权
    • Ion implantation device
    • 离子注入装置
    • US07511288B2
    • 2009-03-31
    • US11575197
    • 2005-11-14
    • Seiji OgataYuzo SakuradaMasayuki SekiguchiTsutomu Nishihashi
    • Seiji OgataYuzo SakuradaMasayuki SekiguchiTsutomu Nishihashi
    • H01J37/02
    • H01L21/265H01J37/05H01J37/147H01J37/1474H01J37/3171H01J2237/057H01J2237/30483
    • To provide an ion implantation device which suppresses diffusion of an ion beam, can finely control a scanning waveform and can obtain a large scanning angle of about 10°.In the ion implantation device, first, second and third chambers 12A, 14A and 16A are arranged in predetermined places on a beam line, first and second gaps 20A and 22A intervene between the first chamber 12A and the second chamber 14A and between the second chamber 14A and the third chamber 16A, the second chamber 14A is electrically insulated from the first and third chambers 12A and 16A via first and second electrode pairs 26A and 28A attached to the first and second gaps 20A and 22A, respectively, the first and second electrode pairs 26A and 28A obliquely cross a standard axis J of the ion beam at a predetermined angle in opposite directions, and the second chamber 14 is connected to a scanning power source 40A which applies an electric potential having desired scanning waveform.
    • 为了提供抑制离子束扩散的离子注入装置,可以精细地控制扫描波形,并且可以获得大约10°的大扫描角度。 在离子注入装置中,第一,第二和第三室12A,14A和16A布置在束线上的预定位置,第一和第二间隙20A和22A插入在第一室12A和第二室14A之间以及第二室 14A和第三室16A中,第二室14A经由分别连接到第一和第二间隙20A和22A的第一和第二电极对26A和28A与第一和第三室12A和16A电绝缘,第一和第二电极 对26A和28A以相反方向以预定角度倾斜地跨越离子束的标准轴线J,并且第二腔室14连接到扫描电源40A,扫描电源40A施加具有期望的扫描波形的电位。