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1. 发明授权

US08598282B2 High adhesiveness silicone resin composition and an optical semiconductor device provided with a cured product thereof 有权
标题翻译：高粘合性有机硅树脂组合物和具有其固化产物的光学半导体装置
公开(公告)号：US08598282B2
公开(公告)日：2013-12-03
申请号：US13097509
申请日：2011-04-29
申请人： Yoshihira Hamamoto , Tsutomu Kashiwagi
发明人： Yoshihira Hamamoto , Tsutomu Kashiwagi
IPC分类号： C08G77/16 , C08G77/18 , C08F283/12
CPC分类号： H01L33/56 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08K5/56 , C08K5/57 , C08L83/00 , C08L83/04
摘要： The object of the present invention is to provide a silicone resin composition for encapsulating an optical semiconductor element which has strong adhesiveness to a substrate and provide an optical semiconductor element which has high reliability. The present invention provides a silicone resin composition comprising an organopolysiloxane (A) having at least two alkenyl groups per molecule, a liner organohydrogenpolysiloxane (B-1) which has hydrogen atoms each bonded to a silicon atom at the both terminals and a liner organohydrogenpolysiloxane (B-2) which has a hydrogen atom bonded to a silicon atom at one terminal and a hydroxyl or alkoxy group bonded to a silicon atom at the other terminal, a branched organohydrogenpolysiloxane (C) having at least three hydrosilyl groups per molecule, a catalytic (D), and a condensation catalyst (E). The present invention also provides an optical semiconductor device provided with a cured product thereof.
摘要翻译：本发明的目的是提供一种用于封装光学半导体元件的有机硅树脂组合物，该光学半导体元件对基片具有很强的粘附性，并且提供了具有高可靠性的光学半导体元件。本发明提供一种有机硅树脂组合物，其包含每分子具有至少两个链烯基的有机聚硅氧烷（A），具有各自键合在两端的硅原子上的氢原子的衬里有机氢聚硅氧烷（B-1）和衬里有机氢聚硅氧烷（ B-2），其具有与一个末端的硅原子键合的氢原子和在另一个末端与硅原子键合的羟基或烷氧基，每分子具有至少三个氢化甲硅烷基的支链有机氢聚硅氧烷（C），催化剂（D）和缩合催化剂（E）。本发明还提供一种设置有其固化产物的光学半导体器件。

2. 发明授权

US08481656B2 Silicone resin composition and optical semiconductor device using the composition 有权
标题翻译：硅树脂组合物和使用该组合物的光学半导体器件
公开(公告)号：US08481656B2
公开(公告)日：2013-07-09
申请号：US13441115
申请日：2012-04-06
申请人： Tsutomu Kashiwagi , Yoshihira Hamamoto
发明人： Tsutomu Kashiwagi , Yoshihira Hamamoto
IPC分类号： C08F283/12 , C08G77/12 , H01L23/29 , H01L33/54
CPC分类号： H01L23/296 , H01L2924/0002 , H01L2924/00
摘要： A silicone resin composition that exhibits low gas permeability and is suitable for encapsulating optical semiconductors. The composition includes: (A) an organopolysiloxane having a specific structure containing two or more alkenyl groups, (B) an organohydrogenpolysiloxane composed of two organohydrogenpolysiloxanes having specific structures, in which the mass ratio between the two organohydrogenpolysiloxanes is within a range from 10:90 to 90:10, in an amount that provides 0.4 to 4.0 mols of silicon atom-bonded hydrogen atoms within the component (B) per 1 mol of alkenyl groups within the component (A), and (C) an addition reaction catalyst.
摘要翻译：表现出低透气性并适用于封装光学半导体的有机硅树脂组合物。该组合物包括：（A）具有特定结构含有两个或多个烯基的有机聚硅氧烷，（B）由具有特定结构的两个有机氢聚硅氧烷组成的有机氢聚硅氧烷，其中两个有机氢聚硅氧烷之间的质量比在10:90 至（A）中每1摩尔烯基中组分（B）中提供0.4至4.0摩尔硅原子键合的氢原子的量，和（C）加成反应催化剂。

3. 发明申请

US20100029887A1 RESIN COMPOSITION FOR ENCAPSULATING OPTICAL SEMICONDUCTOR ELEMENT 有权
标题翻译：用于封装光学半导体元件的树脂组合物
公开(公告)号：US20100029887A1
公开(公告)日：2010-02-04
申请号：US12510491
申请日：2009-07-28
申请人： Yoshihira Hamamoto , Toshio Shiobara , Miyuki Wakao , Tsutomu Kashiwagi
发明人： Yoshihira Hamamoto , Toshio Shiobara , Miyuki Wakao , Tsutomu Kashiwagi
IPC分类号： C09D183/04 , C08G77/04
CPC分类号： C08G59/306 , C08G59/3254 , C08L83/06
摘要： A resin composition for encapsulating an optical semiconductor element that comprises components (A), (B) and (C) described below: (A) a branched silicone resin containing 2 to 6 epoxy groups, one or more (R1SiO3/2) units, two or more (R2R3SiO)n structures and 3 or more (R43-xR5xSiO1/2) units per molecule, in an amount of 100 parts by weight, wherein R1, R2, R3, R4 and R5 each represents a hydrogen atom, a hydroxyl group or a monovalent organic group of 1 to 20 carbon atoms which monovalent organic group may or may not contain an oxygen atom, provided that at least two of the R5 groups within each molecule represent an epoxy group and/or an epoxy group-containing non-aromatic group, n represents an integer of 3 to 20, and x represents an integer of 1 to 3, (B) a curing agent, in such an amount that a content of epoxy reactive groups in the component (B) ranges from 0.4 to 1.5 moles per 1 mol of epoxy groups within component (A), and (C) a curing catalyst, in an amount within a range from 0.01 to 3 parts by weight per 100 parts by weight of a combination of component (A) and component (B).
摘要翻译：一种包含下述成分（A），（B）和（C）的光半导体元件的树脂组合物：（A）含有2〜6个环氧基的支链硅氧烷树脂，1个以上（R 1 SiO 3/2）两个或多个（R 2 R 3 SiO）n结构和每个分子3个以上（R 43-x R 5 x SiO 1/2）单元，其量为100重量份，其中R 1，R 2，R 3，R 4和R 5各自表示氢原子，羟基基团或1〜20个碳原子的一价有机基团，该一价有机基团可以含有或不含有氧原子，条件是每个分子中的至少两个R 5基团表示环氧基和/或含环氧基的非 - - 芳族基团，n表示3〜20的整数，x表示1〜3的整数，（B）固化剂，其量为组分（B）中环氧基反应性基团的含量为0.4 至组分（A）中每1mol环氧基团为1.5摩尔，和（C）固化催化剂，其量范围为fr 每100重量份组分（A）和组分（B）的组合0.01-1重量份。

4. 发明授权

US09306133B2 Optical semiconductor device 有权
标题翻译：光半导体器件
公开(公告)号：US09306133B2
公开(公告)日：2016-04-05
申请号：US13584426
申请日：2012-08-13
申请人： Yoshihira Hamamoto , Manabu Ueno , Tsutomu Kashiwagi
发明人： Yoshihira Hamamoto , Manabu Ueno , Tsutomu Kashiwagi
IPC分类号： C08G77/08 , H01L33/56 , C08L83/04 , H01L33/46
CPC分类号： H01L33/56 , C08G77/12 , C08G77/14 , C08G77/20 , C08G77/80 , C08K5/56 , C08L83/00 , C08L83/04 , H01L33/46 , H01L2224/16245 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
摘要： An optical semiconductor device in which an optical semiconductor element connected to a silver-plated copper lead frame is sealed with an addition curing silicone resin composition, the addition curing silicone resin composition having (A) organopolysiloxane that contains an aryl group and an alkenyl group and does not contain an epoxy group; (B) organohydrogenpolysiloxane that has at least two hydrosilyl groups per molecule and an aryl group, the organohydrogenpolysiloxane that contains 30 mol % or more of an HR2SiO0.5 unit in a constituent unit having an amount that a molar ratio of the hydrosilyl group in the component (B) with respect to the alkenyl group in the component (A) is 0.70 to 1.00; and (C) a hydrosilylation catalyst having a catalytic amount.
摘要翻译：一种光学半导体器件，其中连接到镀银铜引线框架的光学半导体元件用加成固化硅树脂组合物密封，所述加成固化有机硅树脂组合物具有（A）含有芳基和烯基的有机聚硅氧烷，和不含环氧基; （B）每分子具有至少两个氢化甲硅烷基和芳基的有机氢聚硅氧烷，所述有机氢聚硅氧烷在构成单元中含有30摩尔％以上的HR2SiO0.5单元，其含量为所述氢甲硅烷基的摩尔比组分（B）相对于组分（A）中的烯基为0.70至1.00; 和（C）具有催化量的氢化硅烷化催化剂。

5. 发明授权

US08431953B2 Silicone resin composition and an optical semiconductor device making use of the composition 有权
标题翻译：硅树脂组合物和使用该组合物的光学半导体器件
公开(公告)号：US08431953B2
公开(公告)日：2013-04-30
申请号：US13349817
申请日：2012-01-13
申请人： Yoshihira Hamamoto , Tsutomu Kashiwagi
发明人： Yoshihira Hamamoto , Tsutomu Kashiwagi
IPC分类号： H01L33/52 , C09D183/07
CPC分类号： H01L23/296 , C08G77/12 , C08G77/20 , C08L83/04 , H01L33/56 , H01L2924/0002 , H01L2924/00
摘要： [Object]To provide a silicone resin composition for optical semiconductor devices, which has a low gas permeability and high dependability.[Means for solution]The silicone resin composition of the present invention contains the following components (A) through (D): (A) an organopolysiloxane as shown in the following general formula (1) in which the number of alkenyl groups contained per one molecule is two or more (R1SiO3/2)x(R23SiO1/2)y(R22SiO2/2)z (1) (wherein R1 is a cycloalkyl group, R2 is either one kind of or more than one kind of substituted or non-substituted monovalent hydrocarbon group having 1-10 carbon atoms, x is 0.5-0.9, y is 0.1-0.5, z is 0-0.2, and x+y+z=1.0), (B) a hydrogen organopolysiloxane containing at least two SiH groups per one molecule, (C) a catalyst for addition reaction, (D) an adhesion promoter agent.
摘要翻译：本发明提供一种透光性低，可靠性高的光半导体装置用有机硅树脂组合物。 [解决方案]本发明的有机硅树脂组合物含有下列组分（A）至（D）：（A）如下通式（1）所示的有机聚硅氧烷，其中每一个所含的烯基数分子是两个或多个（R 1 SiO 3/2）x（R 23 SiO 1/2）y（R 22 SiO 2/2）z（1）（其中R 1是环烷基，R 2是取代或未取代的一种或多种）具有1-10个碳原子的取代的单价烃基，x为0.5-0.9，y为0.1-0.5，z为0-0.2，x + y + z = 1.0），（B）含有至少两个SiH的氢有机聚硅氧烷（C）加成反应用催化剂，（D）粘合促进剂。

6. 发明授权

US08133957B2 Resin composition for encapsulating optical semiconductor element 有权
标题翻译：用于封装光学半导体元件的树脂组合物
公开(公告)号：US08133957B2
公开(公告)日：2012-03-13
申请号：US12510491
申请日：2009-07-28
申请人： Yoshihira Hamamoto , Toshio Shiobara , Miyuki Wakao , Tsutomu Kashiwagi
发明人： Yoshihira Hamamoto , Toshio Shiobara , Miyuki Wakao , Tsutomu Kashiwagi
IPC分类号： C08G77/14
CPC分类号： C08G59/306 , C08G59/3254 , C08L83/06
摘要： A resin composition for encapsulating an optical semiconductor element that comprises components (A), (B) and (C) described below: (A) a branched silicone resin containing 2 to 6 epoxy groups, one or more (R1SiO3/2) units, two or more (R2R3SiO)n structures and 3 or more (R43-xR5xSiO1/2) units per molecule, in an amount of 100 parts by weight, wherein R1, R2, R3, R4 and R5 each represents a hydrogen atom, a hydroxyl group or a monovalent organic group of 1 to 20 carbon atoms which monovalent organic group may or may not contain an oxygen atom, provided that at least two of the R5 groups within each molecule represent an epoxy group and/or an epoxy group-containing non-aromatic group, n represents an integer of 3 to 20, and x represents an integer of 1 to 3, (B) a curing agent, in such an amount that a content of epoxy reactive groups in the component (B) ranges from 0.4 to 1.5 moles per 1 mol of epoxy groups within component (A), and (C) a curing catalyst, in an amount within a range from 0.01 to 3 parts by weight per 100 parts by weight of a combination of component (A) and component (B).
摘要翻译：一种包含下述成分（A），（B）和（C）的光半导体元件的树脂组合物：（A）含有2〜6个环氧基的支链硅氧烷树脂，1个以上（R 1 SiO 3/2）两个或多个（R 2 R 3 SiO）n结构和每个分子3个以上（R 43-x R 5 x SiO 1/2）单元，其量为100重量份，其中R 1，R 2，R 3，R 4和R 5各自表示氢原子，羟基基团或1〜20个碳原子的一价有机基团，该一价有机基团可以含有或不含有氧原子，条件是每个分子中的至少两个R 5基团表示环氧基和/或含环氧基的非 - - 芳族基团，n表示3〜20的整数，x表示1〜3的整数，（B）固化剂，其量为组分（B）中环氧基反应性基团的含量为0.4 至组分（A）中每1mol环氧基团为1.5摩尔，和（C）固化催化剂，其量范围为fr 每100重量份组分（A）和组分（B）的组合0.01-1重量份。

7. 发明授权

US08889809B2 Cycloalkyl group-containing silicone resin composition and a method of using the same 有权
标题翻译：含环烷基的有机硅树脂组合物及其使用方法
公开(公告)号：US08889809B2
公开(公告)日：2014-11-18
申请号：US13165100
申请日：2011-06-21
申请人： Yoshihira Hamamoto , Tsutomu Kashiwagi
发明人： Yoshihira Hamamoto , Tsutomu Kashiwagi
IPC分类号： C08G77/08 , H01L23/29 , C09D7/12 , G02B1/04 , C09D183/04 , C08L83/04
CPC分类号： C09D7/1241 , C08L83/04 , C09D7/48 , C09D183/04 , G02B1/041 , H01L23/296 , H01L2924/0002 , Y10T428/31663 , C08L83/00 , H01L2924/00
摘要： One object of the present invention is to provide a silicone resin composition having remarkably low gas permeability which is useful for a purpose requiring lower gas permeability. Further, another object of the present invention is to provide an optical semiconductor device provided with a cured product obtained by curing the silicone resin composition which has discoloration resistance, durable reflection efficiency and high reliability. The present invention provides a silicone resin composition comprising (A) an organopolysiloxane having at least two alkenyl groups per molecule, and is represented by the average compositional formula (1), (B) an organohydrogenpolysiloxane having at least two hydrogen atoms bonded to a silicon atom, and is represented by the average compositional formula (2), (C) a catalytic amount of a curing catalyst, and (D) 0.001 to 3 parts by mass of an antioxidant, relative to a total 100 parts by mass of components (A) and (B). The silicone resin composition contains a mixture of three dimensional organopolysiloxanes and linear organopolysiloxanes having alkenyl groups and requires at least 20 to 80 mass %, based on total of (A) and (B), of cycloalkyl groups.
摘要翻译：本发明的一个目的是提供一种具有非常低的透气性的有机硅树脂组合物，其用于要求较低气体渗透性的目的。此外，本发明的另一个目的是提供一种光学半导体器件，其具有通过固化具有耐变色性，耐久反射效率和高可靠性的有机硅树脂组合物获得的固化产物。本发明提供一种有机硅树脂组合物，其包含（A）每分子具有至少两个烯基的有机聚硅氧烷，并且由平均组成式（1）表示，（B）具有至少两个键合到硅上的氢原子的有机氢聚硅氧烷原子，由平均组成式（2）表示，（C）催化剂量的固化催化剂，（D）相对于总计100质量份成分为0.001〜3质量份的抗氧化剂（ A）和（B）。有机硅树脂组合物含有三维有机聚硅氧烷和具有烯基的线性有机聚硅氧烷的混合物，并且基于（A）和（B）的环烷基的总计需要至少20至80质量％。

8. 发明授权

US08614282B2 Low gas permeable silicone resin composition and optoelectronic device 有权
标题翻译：低透气硅树脂组合物和光电器件
公开(公告)号：US08614282B2
公开(公告)日：2013-12-24
申请号：US13223937
申请日：2011-09-01
申请人： Yoshihira Hamamoto , Tsutomu Kashiwagi
发明人： Yoshihira Hamamoto , Tsutomu Kashiwagi
IPC分类号： C08L83/04
CPC分类号： H01L23/296 , C08G77/12 , C08G77/20 , C08G77/80 , C08L83/04 , H01L2924/0002 , Y10T428/31663 , C08L83/00 , H01L2924/00
摘要： A silicone resin composition comprising (A) an organopolysiloxane containing silicon-bonded aryl and alkenyl groups in a molecule, (B) an organohydrogenpolysiloxane, and (C) an addition reaction catalyst is low gas permeable. An optoelectronic device encapsulated therewith is highly reliable.
摘要翻译：一种有机硅树脂组合物，其包含（A）分子中含有硅键合的芳基和烯基的有机聚硅氧烷，（B）有机氢聚硅氧烷和（C）加成反应催化剂的低透气性。封装在其中的光电器件是高度可靠的。

9. 发明申请

US20120256325A1 SILICONE RESIN COMPOSITION AND OPTICAL SEMICONDUCTOR DEVICE USING THE COMPOSITION 有权
标题翻译：硅树脂组合物和使用组合物的光学半导体器件
公开(公告)号：US20120256325A1
公开(公告)日：2012-10-11
申请号：US13441115
申请日：2012-04-06
申请人： Tsutomu KASHIWAGI , Yoshihira Hamamoto
发明人： Tsutomu KASHIWAGI , Yoshihira Hamamoto
IPC分类号： H01L23/29 , C08G77/04
CPC分类号： H01L23/296 , H01L2924/0002 , H01L2924/00
摘要： A silicone resin composition that exhibits low gas permeability and is suitable for encapsulating optical semiconductors. The composition includes: (A) an organopolysiloxane having a specific structure containing two or more alkenyl groups, (B) an organohydrogenpolysiloxane composed of two organohydrogenpolysiloxanes having specific structures, in which the mass ratio between the two organohydrogenpolysiloxanes is within a range from 10:90 to 90:10, in an amount that provides 0.4 to 4.0 mols of silicon atom-bonded hydrogen atoms within the component (B) per 1 mol of alkenyl groups within the component (A), and (C) an addition reaction catalyst.
摘要翻译：表现出低透气性并适用于封装光学半导体的有机硅树脂组合物。该组合物包括：（A）具有特定结构含有两个或多个烯基的有机聚硅氧烷，（B）由具有特定结构的两个有机氢聚硅氧烷组成的有机氢聚硅氧烷，其中两个有机氢聚硅氧烷之间的质量比在10:90 至（A）中每1摩尔烯基中组分（B）中提供0.4至4.0摩尔硅原子键合的氢原子的量，和（C）加成反应催化剂。

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