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1. 发明申请

US20050212069A1 Solid state imaging device 失效
标题翻译：固态成像装置
公开(公告)号：US20050212069A1
公开(公告)日：2005-09-29
申请号：US11089180
申请日：2005-03-25
申请人： Tsuneo Sato , Atsuhiko Ishihara , Akihiro Uchida , Koji Kaseda , Masahiro Kato , Shigeru Kondo
发明人： Tsuneo Sato , Atsuhiko Ishihara , Akihiro Uchida , Koji Kaseda , Masahiro Kato , Shigeru Kondo
IPC分类号： H01L27/14 , H01L27/146 , H01L31/0232 , H04N5/217 , H04N5/372
CPC分类号： H01L21/67294 , H01L27/14618 , H01L27/14632 , H01L27/14687 , H01L2924/0002 , H04N5/2257 , H04N5/3577 , H01L2924/00
摘要： A zener diode is formed in a spacer, which adhered on the semiconductor substrate so as to surround an image sensor, by semiconductor process. A first contact terminal is connected to a CCD output terminal of the image sensor, and a second contact terminal is connected to a ZD ground terminal on the semiconductor substrate. When the ZD ground terminal is connected to ground, the zener diode is actuated. Capacitance components of the zener diode smoothes a waveform of the CCD output so as to prevent an unnecessary radiation noise from generating.
摘要翻译：齐纳二极管形成在间隔物中，其通过半导体工艺粘附在半导体衬底上以围绕图像传感器。第一接触端子连接到图像传感器的CCD输出端子，第二接触端子连接到半导体衬底上的ZD接地端子。当ZD接地端子接地时，齐纳二极管被启动。齐纳二极管的电容分量平滑了CCD输出的波形，以防止产生不必要的辐射噪声。

2. 发明申请

US20050211888A1 Solid state imaging device 失效
标题翻译：固态成像装置
公开(公告)号：US20050211888A1
公开(公告)日：2005-09-29
申请号：US11090794
申请日：2005-03-25
申请人： Tsuneo Sato , Atsuhiko Ishihara , Akihiro Uchida , Koji Kaseda , Masahiro Kato , Shigeru Kondo
发明人： Tsuneo Sato , Atsuhiko Ishihara , Akihiro Uchida , Koji Kaseda , Masahiro Kato , Shigeru Kondo
IPC分类号： H01J40/14 , H01L23/49 , H01L23/552 , H01L27/146 , H04N5/225 , H04N5/335
CPC分类号： H01L27/14618 , H01L23/552 , H01L24/16 , H01L24/48 , H01L24/49 , H01L2224/05001 , H01L2224/05009 , H01L2224/05554 , H01L2224/05568 , H01L2224/13099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49175 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/014 , H01L2924/15787 , H01L2924/16152 , H01L2924/1617 , H01L2924/3025 , H04N5/2253 , H01L2924/00 , H01L2224/05599 , H01L2224/05099 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A solid state imaging device is constituted of an image sensor chip, a circuit board, and an electromagnetic-wave absorber formed of copper. The image sensor chip is constituted of a bare chip, a spacer, and a cover glass. First contact terminals are formed on the bare chip, and second contact terminals and GND wires are formed on the circuit board. When manufacturing, the image sensor chip is mounted at a predetermined position on the circuit board, and the first contact terminals and the second contact terminals are connected with bonding wires. The electromagnetic-wave absorber is formed to cover the bonding wires, while its end contacts to the GND wires.
摘要翻译：固态成像装置由图像传感器芯片，电路板和由铜构成的电磁波吸收体构成。图像传感器芯片由裸芯片，间隔件和盖玻璃构成。第一接触端子形成在裸芯片上，并且第二接触端子和GND线形成在电路板上。当制造时，图像传感器芯片安装在电路板上的预定位置，并且第一接触端子和第二接触端子与接合线连接。电磁波吸收体形成为覆盖接合线，而其端部接触GND线。

3. 发明授权

US07492023B2 Solid state imaging device 失效
标题翻译：固态成像装置
公开(公告)号：US07492023B2
公开(公告)日：2009-02-17
申请号：US11089180
申请日：2005-03-25
申请人： Tsuneo Sato , Atsuhiko Ishihara , Akihiro Uchida , Koji Kaseda , Masahiro Kato , Shigeru Kondo
发明人： Tsuneo Sato , Atsuhiko Ishihara , Akihiro Uchida , Koji Kaseda , Masahiro Kato , Shigeru Kondo
IPC分类号： H01L31/232
CPC分类号： H01L21/67294 , H01L27/14618 , H01L27/14632 , H01L27/14687 , H01L2924/0002 , H04N5/2257 , H04N5/3577 , H01L2924/00
摘要： A zener diode is formed in a spacer, which adhered on the semiconductor substrate so as to surround an image sensor, by semiconductor process. A first contact terminal is connected to a CCD output terminal of the image sensor, and a second contact terminal is connected to a ZD ground terminal on the semiconductor substrate. When the ZD ground terminal is connected to ground, the zener diode is actuated. Capacitance components of the zener diode smoothes a waveform of the CCD output so as to prevent an unnecessary radiation noise from generating.
摘要翻译：齐纳二极管形成在间隔物中，其通过半导体工艺粘附在半导体衬底上以围绕图像传感器。第一接触端子连接到图像传感器的CCD输出端子，第二接触端子连接到半导体衬底上的ZD接地端子。当ZD接地端子接地时，齐纳二极管被启动。齐纳二极管的电容分量平滑了CCD输出的波形，以防止产生不必要的辐射噪声。

4. 发明授权

US07391002B2 Solid state imaging device having electromagnetic wave absorber attached to a mounting board 失效
标题翻译：具有附接到安装板的电磁波吸收体的固态成像装置
公开(公告)号：US07391002B2
公开(公告)日：2008-06-24
申请号：US11090794
申请日：2005-03-25
申请人： Tsuneo Sato , Atsuhiko Ishihara , Akihiro Uchida , Koji Kaseda , Masahiro Kato , Shigeru Kondo
发明人： Tsuneo Sato , Atsuhiko Ishihara , Akihiro Uchida , Koji Kaseda , Masahiro Kato , Shigeru Kondo
IPC分类号： H01L27/00
CPC分类号： H01L27/14618 , H01L23/552 , H01L24/16 , H01L24/48 , H01L24/49 , H01L2224/05001 , H01L2224/05009 , H01L2224/05554 , H01L2224/05568 , H01L2224/13099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49175 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/014 , H01L2924/15787 , H01L2924/16152 , H01L2924/1617 , H01L2924/3025 , H04N5/2253 , H01L2924/00 , H01L2224/05599 , H01L2224/05099 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A solid state imaging device is constituted of an image sensor chip, a circuit board, and an electromagnetic-wave absorber formed of copper. The image sensor chip is constituted of a bare chip, a spacer, and a cover glass. First contact terminals are formed on the bare chip, and second contact terminals and GND wires are formed on the circuit board. When manufacturing, the image sensor chip is mounted at a predetermined position on the circuit board, and the first contact terminals and the second contact terminals are connected with bonding wires. The electromagnetic-wave absorber is formed to cover the bonding wires, while its end contacts to the GND wires.
摘要翻译：固态成像装置由图像传感器芯片，电路板和由铜构成的电磁波吸收体构成。图像传感器芯片由裸芯片，间隔件和盖玻璃构成。第一接触端子形成在裸芯片上，并且第二接触端子和GND线形成在电路板上。当制造时，图像传感器芯片安装在电路板上的预定位置，并且第一接触端子和第二接触端子与接合线连接。电磁波吸收体形成为覆盖接合线，而其端部接触GND线。

5. 发明申请

US20050212947A1 Image capture apparatus 审中-公开
标题翻译：图像采集设备
公开(公告)号：US20050212947A1
公开(公告)日：2005-09-29
申请号：US11088835
申请日：2005-03-25
申请人： Tsuneo Sato , Atsuhiko Ishihara , Hiroshi Yamasako , Youichi Sawachi , Takao Kiuchi , Naoya Iwata
发明人： Tsuneo Sato , Atsuhiko Ishihara , Hiroshi Yamasako , Youichi Sawachi , Takao Kiuchi , Naoya Iwata
IPC分类号： H01L27/14 , H04N5/225
CPC分类号： H04N5/2254
摘要： A solid state imaging device is consisted of an image sensor chip having a light receiving portion, a frame-like spacer attached on the image sensor chip so as to surround the light receiving portion, and a transparent cover glass attached on the spacer so as to close the light receiving portion. An outer periphery of the spacer is projected from that of the solid state imaging device to form a projection. Along an inner periphery of a lens holding frame, a groove is formed. When the lens holding frame is attached to the solid state imaging device to cover it, the groove of the lens holding frame is engaged to the projection of the solid state imaging device.
摘要翻译：固态成像装置由具有光接收部分的图像传感器芯片，附接在图像传感器芯片上的框状间隔件围绕光接收部分，以及安装在间隔物上的透明盖玻片，以便关闭光接收部分。间隔物的外周从固态成像装置的外周突出形成突起。沿着透镜保持框架的内周，形成凹槽。当透镜保持框架附接到固态成像装置以覆盖其时，透镜保持框架的凹槽与固态成像装置的突起接合。

6. 发明申请

US20050219399A1 Image capture apparatus 有权
标题翻译：图像采集设备
公开(公告)号：US20050219399A1
公开(公告)日：2005-10-06
申请号：US11091403
申请日：2005-03-29
申请人： Tsuneo Sato , Atsuhiko Ishihara , Hiroshi Yamasako , Youichi Sawachi , Takao Kiuchi , Naoya Iwata
发明人： Tsuneo Sato , Atsuhiko Ishihara , Hiroshi Yamasako , Youichi Sawachi , Takao Kiuchi , Naoya Iwata
IPC分类号： G02B7/02 , G03B17/02 , G03B17/18 , H04N5/225 , H04N101/00
CPC分类号： H04N5/2257 , H04N5/2253 , H04N5/2254
摘要： A mounting board of a camera module of a mobile phone is screwed to an outer cover through cushions formed of rubber, sponge or the like. A solid state imaging device and an optical unit of the camera module are contained in an opening formed in the outer cover and do not contact the outer cover. The mounting board is connected to a main substrate through a flexible board. Accordingly, even if the mobile phone is dropped down, the camera module is prevented from breakage by the vibration or the shock applied to the mobile phone, because the vibration and the shock are not transmitted to the camera module directly.
摘要翻译：移动电话的相机模块的安装板通过橡胶，海绵等形成的垫子被拧到外盖上。相机模块的固态成像装置和光学单元容纳在形成在外盖中的开口中，并且不接触外盖。安装板通过柔性板连接到主基板。因此，即使移动电话机掉落，由于振动和冲击不直接传送到摄像机模块，所以防止摄像机模块被施加到移动电话上的振动或震动破坏。

7. 发明申请

US20050219398A1 Image capture apparatus 有权
标题翻译：图像采集设备
公开(公告)号：US20050219398A1
公开(公告)日：2005-10-06
申请号：US11091398
申请日：2005-03-29
申请人： Tsuneo Sato , Atsuhiko Ishihara
发明人： Tsuneo Sato , Atsuhiko Ishihara
IPC分类号： G02B7/02 , G03B17/02 , H04N3/14 , H04N5/225 , H04N5/335 , H04N9/04 , H04N9/083
CPC分类号： H04N5/2254 , H04N5/2253
摘要： A mounting board has a thickness L2 being thicker than a thickness L1 of a solid state imaging device. In the mounting board, an attachment opening for containing the solid state imaging device is formed. In addition, a side surface of the solid state imaging device is a tapered surface having an inclination angle θ1, and an internal surface of the attachment opening is a tapered surface having an inclination angle θ2 larger than the inclination angle θ1. On the side surface of the solid state imaging device and the internal surface of the attachment opening respectively, contact terminals are provided for electrically connecting the solid state imaging device and the mounting board, when the contact terminals contact each other according to insertion of the solid state imaging device into the attachment opening.
摘要翻译：安装板的厚度L 2比固态成像装置的厚度L 1厚。在安装板中形成有用于容纳固态成像装置的附接开口。此外，固态成像装置的侧表面是具有倾斜角度θ1的锥形表面，并且附接开口的内表面是具有大于倾斜角度θ1的倾斜角度θ2的锥形表面。在固态成像装置的侧面和安装开口的内表面上分别设有接触端子，用于电连接固态成像装置和安装板，当接触端子根据固体的插入而彼此接触时状态成像装置进入附件开口。

8. 发明授权

US07646427B2 Image capture apparatus 有权
标题翻译：图像采集设备
公开(公告)号：US07646427B2
公开(公告)日：2010-01-12
申请号：US11091403
申请日：2005-03-29
申请人： Tsuneo Sato , Atsuhiko Ishihara , Hiroshi Yamasako , Youichi Sawachi , Takao Kiuchi , Naoya Iwata
发明人： Tsuneo Sato , Atsuhiko Ishihara , Hiroshi Yamasako , Youichi Sawachi , Takao Kiuchi , Naoya Iwata
IPC分类号： H04N5/225
CPC分类号： H04N5/2257 , H04N5/2253 , H04N5/2254
摘要： A mounting board of a camera module of a mobile phone is screwed to an outer cover through cushions formed of rubber, sponge or the like. A solid state imaging device and an optical unit of the camera module are contained in an opening formed in the outer cover and do not contact the outer cover. The mounting board is connected to a main substrate through a flexible board. Accordingly, even if the mobile phone is dropped down, the camera module is prevented from breakage by the vibration or the shock applied to the mobile phone, because the vibration and the shock are not transmitted to the camera module directly.
摘要翻译：移动电话的相机模块的安装板通过橡胶，海绵等形成的垫子被拧到外盖上。相机模块的固态成像装置和光学单元容纳在形成在外盖中的开口中，并且不接触外盖。安装板通过柔性板连接到主基板。因此，即使移动电话机掉落，由于振动和冲击不直接传送到摄像机模块，所以防止摄像机模块被施加到移动电话上的振动或震动破坏。

9. 发明授权

US07515203B2 Image capture apparatus 有权
标题翻译：图像采集设备
公开(公告)号：US07515203B2
公开(公告)日：2009-04-07
申请号：US11091398
申请日：2005-03-29
申请人： Tsuneo Sato , Atsuhiko Ishihara
发明人： Tsuneo Sato , Atsuhiko Ishihara
IPC分类号： H04N5/225
CPC分类号： H04N5/2254 , H04N5/2253
摘要： A mounting board has a thickness L2 being thicker than a thickness L1 of a solid state imaging device. In the mounting board, an attachment opening for containing the solid state imaging device is formed. In addition, a side surface of the solid state imaging device is a tapered surface having an inclination angle θ1, and an internal surface of the attachment opening is a tapered surface having an inclination angle θ2 larger than the inclination angle θ1. On the side surface of the solid state imaging device and the internal surface of the attachment opening respectively, contact terminals are provided for electrically connecting the solid state imaging device and the mounting board, when the contact terminals contact each other according to insertion of the solid state imaging device into the attachment opening.
摘要翻译：安装板的厚度L2比固态成像装置的厚度L1厚。在安装板中形成有用于容纳固态成像装置的附接开口。此外，固态成像装置的侧表面是具有倾斜角θ1的锥形表面，并且附接开口的内表面是具有大于倾斜角θ1的倾斜角θ2的锥形表面。在固态成像装置的侧面和安装开口的内表面上分别设有接触端子，用于电连接固态成像装置和安装板，当接触端子根据固体的插入而彼此接触时状态成像装置进入附件开口。

10. 发明授权

US08779825B2 Signal processing apparatus 失效
标题翻译：信号处理装置
公开(公告)号：US08779825B2
公开(公告)日：2014-07-15
申请号：US13981932
申请日：2011-07-06
申请人： Tsuneo Sato , Teruyoshi Yamaguchi
发明人： Tsuneo Sato , Teruyoshi Yamaguchi
IPC分类号： G06F1/04
CPC分类号： H03K5/131 , G06F1/10 , G09C1/00 , H04L9/004 , H04L9/005 , H04L2209/12
摘要： A delay element delays an output signal Dt from an arithmetic circuit and outputs a delayed signal Dd. An XOR element compares the output signal Dt with the delayed signal Dd, and outputs an XORout signal with the signal value “0” when the signals match each other, and outputs an XORout signal with the signal value “1” when the signals do not match each other. In a flip-flop, when the signal value of the XORout signal at the rise of a clock of a clock signal CK is “0”, the output signal Dt is output from a flip-flop, and when the signal value of the XORout signal at the rise of the clock becomes “1” even once, a fixed value of the signal value “0” continues to be output.
摘要翻译：延迟元件延迟来自运算电路的输出信号Dt并输出延迟信号Dd。 XOR元件将输出信号Dt与延迟信号Dd进行比较，当信号匹配时输出信号值为“0”的XORout信号，当信号不为0时，输出信号值“1”的XORout信号相互匹配在触发器中，当时钟信号CK的时钟上升时的XORout信号的信号值为“0”时，从触发器输出输出信号Dt，并且当XORout的信号值在时钟上升时的信号变为“1”甚至一次，信号值“0”的固定值继续输出。

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