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1. 发明申请

US20100052000A1 OPTOELECTRONIC SEMICONDUCTOR DEVICE 有权
标题翻译：光电半导体器件
公开(公告)号：US20100052000A1
公开(公告)日：2010-03-04
申请号：US12562917
申请日：2009-09-18
申请人： Tsun-Kai KO , Schang-Jing HON , Chien-Kai CHUNG , Hui-Chen YEH , An-Ju LIN , Chien-Fu SHEN , Crux OU
发明人： Tsun-Kai KO , Schang-Jing HON , Chien-Kai CHUNG , Hui-Chen YEH , An-Ju LIN , Chien-Fu SHEN , Crux OU
IPC分类号： H01L33/00
CPC分类号： H01L33/387 , H01L33/06 , H01L33/14 , H01L33/22 , H01L33/382 , H01L33/42 , H01L33/44 , H01L2924/0002 , H01L2924/00
摘要： An optoelectronic semiconductor device in accordance with an embodiment of present invention includes a conversion unit having a first side; an electrical connector; a contact layer having an outer perimeter; and at least three successive discontinuous-regions formed along the outer perimeter and having at least one different factor; wherein the electrical connector, the contact layer, and the discontinuous-regions are formed on the first side of the conversion unit.
摘要翻译：根据本发明实施例的光电子半导体器件包括具有第一侧的转换单元; 电连接器; 具有外周的接触层; 以及沿着所述外周边形成并且具有至少一个不同因素的至少三个连续不连续区域; 其中所述电连接器，所述接触层和所述不连续区形成在所述转换单元的第一侧上。

2. 发明申请

US20120074379A1 LIGHT-EMITTING ELEMENT AND THE MANUFACTURING METHOD THEREOF 有权
标题翻译：发光元件及其制造方法
公开(公告)号：US20120074379A1
公开(公告)日：2012-03-29
申请号：US13242495
申请日：2011-09-23
申请人： Ching-San TAO , Ting-Chia KO , De-Shan KUO , Tsun-Kai KO
发明人： Ching-San TAO , Ting-Chia KO , De-Shan KUO , Tsun-Kai KO
IPC分类号： H01L33/06 , H01L33/16
CPC分类号： H01L27/153 , H01L33/007 , H01L33/22
摘要： A light-emitting element includes: a substrate being a monocrystalline structure, comprising a plurality of recesses; and a plurality of first light-emitting stacks formed in the recesses respectively.
摘要翻译：发光元件包括：基板，其是单晶结构，包括多个凹部; 以及分别形成在所述凹部中的多个第一发光层。

3. 发明申请

US20120138980A1 OPTOELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：光电装置及其制造方法
公开(公告)号：US20120138980A1
公开(公告)日：2012-06-07
申请号：US13310339
申请日：2011-12-02
申请人： De-Shan KUO , Tsun-Kai KO
发明人： De-Shan KUO , Tsun-Kai KO
IPC分类号： H01L33/30 , H01L33/40 , B82Y20/00
CPC分类号： H01L33/30 , H01L31/035227 , H01L33/0062 , H01L33/007 , H01L33/10 , H01L33/12 , H01L33/145 , H01L51/5275 , H01S2304/12
摘要： An optoelectronic device, comprising: a substrate; a plurality of the first semiconductor rods formed on the substrate, contacted with the substrate, and exposed partial of the first surface of the substrate; a first protection layer formed on the sidewall of the plurality of the first semiconductor rods and the exposed partial of the first surface of the substrate; a first buffer layer formed on the plurality of the first semiconductor rods wherein the first buffer layer having a first surface and a second surface opposite to the first surface, and the plurality of the first semiconductor rods directly contacted with the first surface; and at least one first hollow component formed among the first semiconductor rods, the first surface of the substrate, and the first surface of the first buffer layer and the ratio of the height and the width of the first hollow component is 1/5-3.
摘要翻译：一种光电子器件，包括：衬底; 形成在基板上的多个第一半导体棒，与基板接触，并露出基板的第一表面的部分; 形成在多个第一半导体棒的侧壁上的第一保护层和基板的第一表面的暴露部分; 形成在所述多个所述第一半导体棒上的第一缓冲层，其中所述第一缓冲层具有与所述第一表面相对的第一表面和第二表面，所述多个所述第一半导体棒与所述第一表面直接接触; 并且形成在第一半导体棒，基板的第一表面和第一缓冲层的第一表面之间的第一中空部件和第一中空部件的高度和宽度的比率为1 / 5-3 。

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