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1. 发明授权

US08590296B2 Systems and methods for reducing dead volume in compressed-gas energy storage systems 失效
公开(公告)号：US08590296B2
公开(公告)日：2013-11-26
申请号：US13462107
申请日：2012-05-02
申请人： Troy O. McBride , Benjamin Bollinger , John McCormick , Benjamin Cameron
发明人： Troy O. McBride , Benjamin Bollinger , John McCormick , Benjamin Cameron
IPC分类号： B60T1/10 , F02C6/16
CPC分类号： F15B15/02 , F17C1/00 , Y02E20/14 , Y02E60/15 , Y02E70/30 , Y10T137/86187
摘要： In various embodiments, dead space and associated coupling losses are reduced in energy storage and recovery systems employing compressed air.

2. 发明授权

US08191362B2 Systems and methods for reducing dead volume in compressed-gas energy storage systems 失效
标题翻译：减少压缩气体储能系统死体积的系统和方法
公开(公告)号：US08191362B2
公开(公告)日：2012-06-05
申请号：US13080914
申请日：2011-04-06
申请人： Troy O. McBride , Benjamin Bollinger , John McCormick , Benjamin Cameron
发明人： Troy O. McBride , Benjamin Bollinger , John McCormick , Benjamin Cameron
IPC分类号： B60T1/10 , F02C6/16
CPC分类号： F15B15/02 , F17C1/00 , Y02E20/14 , Y02E60/15 , Y02E70/30 , Y10T137/86187
摘要： In various embodiments, dead space and associated coupling losses are reduced in energy storage and recovery systems employing compressed air via use of a compressed-gas reservoir for maintaining a connector between cylinder assemblies at an intermediate pressure, thereby reducing the volume of dead space in the connector and increasing efficiency of the energy storage and recovery.
摘要翻译：在各种实施例中，在通过使用压缩气体储存器的能量储存和回收系统中，使用压缩空气的空间和相关耦合损耗减少，以在中间压力下维持气缸组件之间的连接器，从而减小了在连接器和提高储能和回收效率。

3. 发明申请

US20120210705A1 SYSTEMS AND METHODS FOR REDUCING DEAD VOLUME IN COMPRESSED-GAS ENERGY STORAGE SYSTEMS 失效
公开(公告)号：US20120210705A1
公开(公告)日：2012-08-23
申请号：US13462107
申请日：2012-05-02
申请人： Troy O. McBride , Benjamin Bollinger , John McCormick , Benjamin Cameron
发明人： Troy O. McBride , Benjamin Bollinger , John McCormick , Benjamin Cameron
IPC分类号： F15B1/02
CPC分类号： F15B15/02 , F17C1/00 , Y02E20/14 , Y02E60/15 , Y02E70/30 , Y10T137/86187
摘要： In various embodiments, dead space and associated coupling losses are reduced in energy storage and recovery systems employing compressed air.

4. 发明申请

US20110315255A1 SYSTEMS AND METHODS FOR REDUCING DEAD VOLUME IN COMPRESSED-GAS ENERGY STORAGE SYSTEMS 失效
标题翻译：压缩能源储存系统中减少死亡体积的系统和方法
公开(公告)号：US20110315255A1
公开(公告)日：2011-12-29
申请号：US13080914
申请日：2011-04-06
申请人： Troy O. McBride , Benjamin Bollinger , John McCormick , Benjamin Cameron , Alexander Bell , David Chmiel , Michael Neil Scott
发明人： Troy O. McBride , Benjamin Bollinger , John McCormick , Benjamin Cameron , Alexander Bell , David Chmiel , Michael Neil Scott
IPC分类号： F17D1/00
CPC分类号： F15B15/02 , F17C1/00 , Y02E20/14 , Y02E60/15 , Y02E70/30 , Y10T137/86187
摘要： In various embodiments, dead space and associated coupling losses are reduced in energy storage and recovery systems employing compressed air.
摘要翻译：在各种实施例中，在使用压缩空气的能量储存和回收系统中减少了死空间和相关耦合损耗。

5. 发明申请

US20100257852A1 Vacuum Accumulator System and Method for Regenerative Braking System 有权
标题翻译：真空蓄能器系统及再生制动系统方法
公开(公告)号：US20100257852A1
公开(公告)日：2010-10-14
申请号：US12421895
申请日：2009-04-10
申请人： John McCormick , Gunnar Ross , Dale Scott Crombez
发明人： John McCormick , Gunnar Ross , Dale Scott Crombez
IPC分类号： B60T13/52 , B60T17/02
CPC分类号： B60T1/10 , B60T13/52 , B60T17/02 , B60W10/06 , B60W10/30 , B60W30/18127
摘要： A vacuum accumulator system includes a booster, a vacuum accumulator disposed in fluid communication with the booster and an engine disposed in fluid communication with the vacuum accumulator.
摘要翻译：真空蓄能器系统包括升压器，设置成与升压器流体连通的真空蓄能器和与真空蓄能器流体连通的发动机。

6. 发明申请

US20070046441A1 Gift-wrapping envelope 审中-公开
标题翻译：礼品包装信封
公开(公告)号：US20070046441A1
公开(公告)日：2007-03-01
申请号：US11213539
申请日：2005-08-25
申请人： John McCormick
发明人： John McCormick
IPC分类号： G08B3/00 , B65D65/38
CPC分类号： B65D27/06 , B65D27/16 , B65D2203/12
摘要： A gift-wrapping envelope including: a face panel; a back panel integrally coupled with the face panel; an expandable side panel coupled to both the face and back panels; an enclosure panel integrally coupled to the face, back, or side panels and releasably couplable to one of the panels to which it is not integrally coupled; a nametag area; and a releasably couplable accessory area. The gift-wrapping envelope may include an audio label. The nametag panel may be erasably writable. The releasably couplable accessory area may include a release liner and/or a no-rip material. The expandable side panel may include accordion-type folds.
摘要翻译：礼品包装信封包括：面板; 与所述面板一体地联接的后面板; 耦合到面板和后面板的可扩张侧板; 一体地联接到所述面，背面或侧面板并且可释放地联接到所述面板之一的外壳面板，所述面板未整体联接到所述外壳面板; 名词区和可释放地联接的附件区域。礼品包装信封可以包括音频标签。命名面板可能是可擦写的。可释放地联接的附件区域可以包括释放衬垫和/或无撕裂材料。可膨胀侧板可以包括手风琴型折叠。

7. 发明申请

US20050274164A1 Combination grass colorant and fertilizer 审中-公开
标题翻译：组合草色素和肥料
公开(公告)号：US20050274164A1
公开(公告)日：2005-12-15
申请号：US10868251
申请日：2004-06-14
申请人： Brian Coates , John McCormick
发明人： Brian Coates , John McCormick
IPC分类号： C05B7/00 , C05C1/00 , C05G3/00
CPC分类号： C05G3/0076 , C05B7/00 , C05G3/00 , C05C1/00 , C05C3/00 , C05C9/00 , C05D1/02
摘要： A ready-to-use lawn colorant and fertilizer composition is provided in a spray bottle. The composition includes a water-based lawn paint, fertilizer with nitrogen, phosphate and potash, and water.
摘要翻译：在喷雾瓶中提供了即用型草坪着色剂和肥料组合物。该组合物包括水性草坪漆，氮肥，磷酸钾，钾肥和水。

8. 发明授权

US5763952A Multi-layer tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same 失效
标题翻译：具有不同信号，功率和接地层的多层带，采用其的半导体器件组件，其装配方法和组装方法
公开(公告)号：US5763952A
公开(公告)日：1998-06-09
申请号：US606243
申请日：1996-03-08
申请人： Brian Lynch , John McCormick
发明人： Brian Lynch , John McCormick
IPC分类号： G01R1/073 , H01L21/60 , H01L21/607 , H01L23/13 , H01L23/31 , H01L23/367 , H01L23/495 , H01L23/498 , H01L23/50 , H01L23/58 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： G01R1/07342 , H01L22/32 , H01L23/13 , H01L23/3121 , H01L23/3128 , H01L23/3675 , H01L23/49572 , H01L23/49822 , H01L23/49833 , H01L23/4985 , H01L23/50 , H01L24/86 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/4899 , H01L2224/49109 , H01L2224/49171 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15173 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , Y10T29/49121 , Y10T29/49135 , Y10T29/49151
摘要： One or two, or more, additional conductive layers, separated from one another (if two or more) and separated from a patterned (signal) conductive layer are formed in a flexible substrate, for mounting a semiconductor die in a semiconductor device assembly. These additional layers are used as separate planes for carrying power and/or ground from outside the assembly to the die, on a separate plane from signals entering or exiting the die. TAB processes are disclosed for cutting, bending and bonding inner and outer portions of selected signal layer traces to respective inner and outer edge portions of the additional conductive layer(s), including a two-stage process of (1) first cutting, bending and tacking the selected traces to the additional layer(s), and then (2) repositioning a bonding tool and securely bonding the selected traces to the additional layer(s). A tool (die pedestal) for aiding in the assembly process is also disclosed.
摘要翻译：一个或两个或更多个另外的导电层，彼此分开（如果两个或更多个）并且与图案化（信号）导电层分离，形成在柔性衬底中，用于将半导体管芯安装在半导体器件组件中。这些附加层被用作从组件外部向模具承载动力和/或地面的独立平面，其与进入或离开模具的信号分开。公开了用于将所选择的信号层迹线的内部和外部部分切割，弯曲和粘合到附加导电层的相应内部和外部边缘部分的TAB工艺，包括（1）第一次切割，弯曲和将所选择的迹线固定到附加层，然后（2）重新定位接合工具并将所选择的迹线牢固地结合到附加层。还公开了用于辅助组装过程的工具（模座）。

9. 发明授权

US5681777A Process for manufacturing a multi-layer tab tape semiconductor device 失效
标题翻译：多层贴片带半导体器件的制造方法
公开(公告)号：US5681777A
公开(公告)日：1997-10-28
申请号：US625641
申请日：1996-03-29
申请人： Brian Lynch , John McCormick
发明人： Brian Lynch , John McCormick
IPC分类号： G01R1/073 , H01L21/60 , H01L21/607 , H01L23/13 , H01L23/31 , H01L23/367 , H01L23/495 , H01L23/498 , H01L23/50 , H01L23/58 , H01L21/58
CPC分类号： G01R1/07342 , H01L22/32 , H01L23/13 , H01L23/3121 , H01L23/3128 , H01L23/3675 , H01L23/49572 , H01L23/49822 , H01L23/49833 , H01L23/4985 , H01L23/50 , H01L24/86 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/4899 , H01L2224/49109 , H01L2224/49171 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15173 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , Y10T29/49121 , Y10T29/49135 , Y10T29/49151
摘要： One or two, or more, additional conductive layers, separated from one another (if two or more) and separated from a patterned (signal) conductive layer are formed in a flexible substrate, for mounting a semiconductor die in a semiconductor device assembly. These additional layers are used as separate planes for carrying power and/or ground from outside the assembly to the die, on a separate plane from signals entering or exiting the die. TAB processes are disclosed for cutting, bending and bonding inner and outer portions of selected signal layer traces to respective inner and outer edge portions of the additional conductive layer(s), including a two-stage process of (1) first cutting, bending and tacking the selected traces to the additional layer(s), and then (2) repositioning a bonding tool and securely bonding the selected traces to the additional layer(s). A tool (die pedestal) for aiding in the assembly process is also disclosed.
摘要翻译：一个或两个或更多个另外的导电层，彼此分开（如果两个或更多个）并且与图案化（信号）导电层分离，形成在柔性基板中，用于将半导体管芯安装在半导体器件组件中。这些附加层被用作从组件外部向模具承载动力和/或地面的独立平面，其与进入或离开模具的信号分开。公开了用于将所选择的信号层迹线的内部和外部部分切割，弯曲和粘合到附加导电层的相应内部和外部边缘部分的TAB工艺，包括（1）第一次切割，弯曲和将所选择的迹线固定到附加层，然后（2）重新定位接合工具并将所选择的迹线牢固地结合到附加层。还公开了用于辅助组装过程的工具（模座）。

10. 发明授权

US5638596A Method of employing multi-layer tab tape in semiconductor device assembly by selecting, breaking, downwardly bending and bonding tab tape trace free ends to a ground or power plane 失效
标题翻译：在半导体器件组件中采用多层贴片带的方法，通过选择，断开，向下弯曲和将片状带无轨迹结合到地面或电源平面
公开(公告)号：US5638596A
公开(公告)日：1997-06-17
申请号：US462194
申请日：1995-06-05
申请人： John McCormick
发明人： John McCormick
IPC分类号： G01R1/073 , H01L21/60 , H01L21/607 , H01L23/13 , H01L23/31 , H01L23/367 , H01L23/495 , H01L23/498 , H01L23/50 , H01L23/58 , H01R43/00 , H05K3/30
CPC分类号： G01R1/07342 , H01L22/32 , H01L23/13 , H01L23/3121 , H01L23/3128 , H01L23/3675 , H01L23/49572 , H01L23/49822 , H01L23/49833 , H01L23/4985 , H01L23/50 , H01L24/86 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/4899 , H01L2224/49109 , H01L2224/49171 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15173 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , Y10T29/49121 , Y10T29/49135 , Y10T29/49151
摘要： One or two, or more, additional conductive layers, separated from one another (if two or more) and separated from a patterned (signal) conductive layer are formed in a flexible substrate, for mounting a semiconductor die in a semiconductor device assembly. These additional layers are used as separate planes for carrying power and/or ground from outside the assembly to the die, on a separate plane from signals entering or exiting the die. Another aspect of the present invention provides a semiconductor device assembly including a first conductive layer with a plurality of traces formed on an insulating layer, a second conductive layer with an inner edge portion exposed within the central opening in the insulating layer, and a leadframe having a number of leads the inner end of one or more of the leads being electrically connected to an outer end of one or more of the traces. Selected traces are cut substantially at an inner peripheral edge of the first insulating layer, bent past the first insulating layer, and bonded to the exposed inner edge portion of the second conductive layer. The insulating layer may also include an outer peripheral opening through which an outer edge portion of the second conductive layer is exposed. The selected traces are cut substantially at the inner edge of the outer peripheral opening in the insulating layer, bent past the insulating layer, and bonded to the outer edge portion of the second conductive layer.
摘要翻译：一个或两个或更多个另外的导电层，彼此分开（如果两个或更多个）并且与图案化（信号）导电层分离，形成在柔性衬底中，用于将半导体管芯安装在半导体器件组件中。这些附加层被用作从组件外部向模具承载动力和/或地面的独立平面，其与进入或离开模具的信号分开。本发明的另一方面提供了一种半导体器件组件，其包括具有形成在绝缘层上的多个迹线的第一导电层，具有暴露在绝缘层中的中心开口内的内边缘部分的第二导电层，以及引线框架，多个引线中的一个或多个引线的内端电连接到一个或多个迹线的外端。所选择的迹线基本上在第一绝缘层的内周边缘处被切割，弯曲经过第一绝缘层，并且接合到第二导电层的暴露的内边缘部分。绝缘层还可以包括外周边开口，第二导电层的外边缘部分暴露在外周开口中。所选择的迹线基本上在绝缘层中的外周开口的内边缘处被切割，弯曲穿过绝缘层，并且结合到第二导电层的外边缘部分。

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