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1. 发明专利

JP2013044496A Evaporative cooling device and cooling system for vehicle using the same 审中-公开
标题翻译：蒸汽冷却装置及其使用的车辆的冷却系统
公开(公告)号：JP2013044496A
公开(公告)日：2013-03-04
申请号：JP2011184359
申请日：2011-08-26
申请人： Toyota Motor Corp , トヨタ自動車株式会社 , Kyushu Univ , 国立大学法人九州大学 , Tokyo Univ Of Science , 学校法人東京理科大学 , Hyogo Prefecture , 兵庫県
发明人： HAKAMATA NORIHIDE , FURUTA NORIBUMI , ABE NOBUYUKI , OTA HARUHIKO , NIIMOTO YASUHISA , SUZUKI KOICHI , YUKI KAZUHISA , KAWANAMI OSAMU
IPC分类号： F28D15/02 , F28F13/02 , H01L23/427
摘要： PROBLEM TO BE SOLVED: To effectively generate boiling in an evaporative cooling device.SOLUTION: The evaporative cooling device 10 includes: a housing 12 having an flow inlet 14 in which a refrigerant flows, a flow outlet 16 from which the refrigerant after heat transfer with boiling flows, and a channel part 18 which is surrounded with a peripheral wall and through which the refrigerant flows; and a vaporizer part which has a plurality of fins 20 protruding from an inner wall of the housing 12 in the channel part 18 and transferring heat of an inverter 8, and in which the refrigerant flowing in from the flow inlet 14 flows through gaps between the plurality of fins 20 toward the flow outlet 16 and boils on heat transfer surfaces of surfaces of the fins 20. The fins 20 have on the heat transfer surfaces, fine irreguralities 22, 24, differing in fineness of unevenness according to the degree of overheating of the refrigerant on the heat transfer surfaces. The fins 20 may includes in an inner wall of a recess having a large diameter, a large-small composite recess having irreguralities finer than the diameter.
摘要翻译：要解决的问题：有效地在蒸发冷却装置中产生沸腾。蒸发冷却装置10包括：壳体12，其具有制冷剂流过的流入口14;流出口16，沸腾流过的传热后的制冷剂流过出口16;以及通道部分18，周边壁，制冷剂通过其流动; 以及蒸发器部件，其具有从通道部分18中的壳体12的内壁突出并传递逆变器8的热量的多个翅片20，并且其中从流入口14流入的制冷剂流过多个翅片20朝向流出口16并在翅片20的表面的传热表面上沸腾。散热片20在传热表面上具有微细不透明度22,24，其根据过热程度不均匀的不均匀性传热面上的制冷剂。翅片20可以包括在具有大直径的凹部的内壁中，具有比直径更细的非常小的复合凹部。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2013017279A Vehicle cooling system 审中-公开
标题翻译：车辆冷却系统
公开(公告)号：JP2013017279A
公开(公告)日：2013-01-24
申请号：JP2011147507
申请日：2011-07-01
申请人： Toyota Motor Corp , トヨタ自動車株式会社 , Kyushu Univ , 国立大学法人九州大学 , Tokyo Univ Of Science , 学校法人東京理科大学 , Hyogo Prefecture , 兵庫県
发明人： FURUTA NORIBUMI , HAKAMATA NORIHIDE , OTA HARUHIKO , NIIMOTO YASUHISA , SUZUKI KOICHI , YUKI KAZUHISA , ABE NOBUYUKI , KAWANAMI OSAMU
IPC分类号： B60L11/18 , B60K11/02 , F01P3/12 , F28D15/02 , H01L23/427
CPC分类号： Y02T10/7005 , Y02T10/7241
摘要： PROBLEM TO BE SOLVED: To incorporate a boiling cooler, in a vehicle cooling system, suitably for mounting thereof to a vehicle.SOLUTION: The vehicle cooling system 10 includes a refrigerant discharge flow path 16 for flowing a refrigerant at temperature raised by heat generation of an engine 12 toward a radiator 14, a refrigerant supply flow path 30 for flowing the refrigerant with heat lowered by heat exchange by the radiator 14 toward the engine 12, and the boiling cooler 40 disposed in parallel with the refrigerant discharge flow path 16. The refrigerant discharge flow path 16 is constituted by an engine side flow path part 18 whose upstream side is connected to an inflow port of the boiling cooler 40 and whose downstream side is connected to an outlet port of the boiling cooler, and a radiator side flow path part 20 which is a portion on a downstream side of the engine side flow path part 18 and which allows a boiled and evaporated refrigerant from the boiling cooler 40 to be condensed by a refrigerant at temperature lower than it flowing from the engine 12.
摘要翻译：要解决的问题：在车辆冷却系统中并入沸腾冷却器，适于将其安装到车辆上。解决方案：车辆冷却系统10包括用于使发动机12的发热升高的制冷剂朝向散热器14流动的制冷剂排出流路16，制冷剂供给流路30，用于使制冷剂的热量降低通过散热器14对发动机12的热交换，以及与制冷剂排出流路16平行设置的沸腾冷却器40.制冷剂排出流路16由发动机侧流路部18构成，发动机侧流路部18的上游侧与沸腾冷却器40的流入口，其下游侧与沸腾冷却器的出口连接，散热器侧流路部20是发动机侧流路部18的下游侧的一部分，煮沸和蒸发的制冷剂从沸腾的冷却器40被冷却，在低于从发动机12流出的温度下由制冷剂冷凝。（C）2013，JPO＆INPIT

3. 发明专利

JP2013016590A Boil cooling device, and cooling system for vehicle using boil cooling device 审中-公开
标题翻译：锅炉冷却装置和使用锅炉冷却装置的车辆的冷却系统
公开(公告)号：JP2013016590A
公开(公告)日：2013-01-24
申请号：JP2011147509
申请日：2011-07-01
申请人： Toyota Motor Corp , トヨタ自動車株式会社 , Kyushu Univ , 国立大学法人九州大学 , Tokyo Univ Of Science , 学校法人東京理科大学 , Hyogo Prefecture , 兵庫県
发明人： FURUTA NORIBUMI , HAKAMATA NORIHIDE , OTA HARUHIKO , NIIMOTO YASUHISA , MIURA SHINICHI , SUZUKI KOICHI , YUKI KAZUHISA , ABE NOBUYUKI , KAWANAMI OSAMU
IPC分类号： H01L23/427
摘要： PROBLEM TO BE SOLVED: To provide a passage structure capable of properly supplying a new refrigerant by removing boiled bubbles from a heating wall in a boil cooling device.SOLUTION: A boil cooling device 10 comprises: an evaporator part 32 for boiling a refrigerant by heat of an inverter 8 at a pipeline part 30 of a housing 12; a central circulation part 34 provided adjacent to the evaporator part 32 at a center part of a cross section of the pipeline part 30, and side wall side circulation parts 36 provided adjacent to the evaporator part 32 along right and left side walls 22, 24 of the pipeline 30, flowing the refrigerant circulated in the evaporator part 32, and circulating it toward a flow outlet 16. The evaporator part 32 is provided with a plurality of fins 40 projecting from a bottom wall 20 toward the circulation part 34, and inclined from an upstream side toward a downstream side while the center part of the cross section of the pipeline 30 is an upstream side and the side wall side circulation parts 36 on both sides are downstream sides.
摘要翻译：要解决的问题：提供一种能够通过在煮沸冷却装置中从加热壁去除煮沸的气泡来适当地供应新的制冷剂的通道结构。沸腾冷却装置10包括：用于通过壳体12的管线部分30处的逆变器8的热量使制冷剂沸腾的蒸发器部分32; 在管状部30的截面的中央部与蒸发器部32相邻设置的中央循环部34，以及沿着蒸发器部32的左右侧壁22,24配置的侧壁侧循环部36 管道30使流过在蒸发器部分32中的制冷剂流动并将其循环到流出口16.蒸发器部分32设置有从底壁20向循环部分34突出的多个翅片40，上游侧朝向下游侧，而管路30的截面的中心部分为上游侧，并且两侧的侧壁侧循环部36为下游侧。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2013016589A Boil cooling device, and cooling system for vehicle using boil cooling device 审中-公开
标题翻译：锅炉冷却装置和使用锅炉冷却装置的车辆的冷却系统
公开(公告)号：JP2013016589A
公开(公告)日：2013-01-24
申请号：JP2011147508
申请日：2011-07-01
申请人： Toyota Motor Corp , トヨタ自動車株式会社 , Kyushu Univ , 国立大学法人九州大学 , Tokyo Univ Of Science , 学校法人東京理科大学 , Hyogo Prefecture , 兵庫県
发明人： FURUTA NORIBUMI , HAKAMATA NORIHIDE , OTA HARUHIKO , NIIMOTO YASUHISA , ABE NOBUYUKI , SUZUKI KOICHI , YUKI KAZUHISA , KAWANAMI OSAMU
IPC分类号： H01L23/427
摘要： PROBLEM TO BE SOLVED: To provide a passage structure suitable for evaporating a refrigerant in a boil cooling device.SOLUTION: A boil cooling device 10 comprises: an evaporator part 32 for boiling a refrigerant by heat of an inverter 8 that is a heating element at a pipeline part 30 of a housing 12; and a circulation part 34 provided adjacent to the evaporator part 32 at the pipeline part 30 and circulating the refrigerant from a flow inlet 14 directly to a flow outlet 16. The evaporator part 32 is provided with a plurality of fins 40 projecting from a bottom wall 20 toward the circulation part 34, and the refrigerant is circulated in a gap between the fins 40. A flow velocity v of the refrigerant at the evaporator part 32 is lower than a flow velocity V of the refrigerant at the circulation part 34. A relationship between a height position of the flow inlet 14 and a height position of the flow outlet 16 in a Z-direction can be changed appropriately.
摘要翻译：要解决的问题：提供适于蒸发煮沸冷却装置中的制冷剂的通道结构。沸腾冷却装置10包括：蒸发器部分32，用于通过在壳体12的管道部分30处的加热元件的逆变器8的热量来使制冷剂沸腾; 以及在管道部分30处邻近蒸发器部分32设置的循环部分34，并且将制冷剂从流动入口14直接循环到流出口16.蒸发器部分32设置有从底壁突出的多个翅片40 20朝向循环部34，并且制冷剂在翅片40之间的间隙中循环。蒸发器部32处的制冷剂的流速v低于循环部34处的制冷剂的流速V.关系可以适当地改变流入口14的高度位置与流出口16在Z方向上的高度位置之间的位置。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2013194919A Self-excited oscillation heat pipe and program 审中-公开
标题翻译：自激振荡热管和程序
公开(公告)号：JP2013194919A
公开(公告)日：2013-09-30
申请号：JP2012058968
申请日：2012-03-15
申请人： Toyota Central R&D Labs Inc , 株式会社豊田中央研究所 , Toyota Motor Corp , トヨタ自動車株式会社
发明人： MIYAJI YUKIO , OSADA YUJI , FURUTA NORIBUMI
IPC分类号： F28D15/06 , F28D15/02
摘要： PROBLEM TO BE SOLVED: To provide a self-excited oscillation heat pipe with excellent startup performance.SOLUTION: One hollow capillary 7 forming a closed loop is routed several times between a heat generating unit 3 and a cooling unit 5. Between a heat source 23 disposed in the heat generating unit 3 and a cooling device 25 disposed in the cooling unit 5, for example, a heating device 24 with a cartridge heater 6 embedded therein is arranged. The heating device 24 heats the cooling unit 5, to prevent the situation where, In the cooling unit 5, hydraulic fluid vapor is condensed excessively to wipe out bubbles, thus hindering the movement of liquid columns. As a result, startup performance is improved, and burn out to be caused by liquid dry-out is avoided in the heat generating unit 3.
摘要翻译：要解决的问题：提供具有优异启动性能的自激振荡热管。解决方案：在发热单元3和冷却单元5之间，形成闭环的一个中空毛细管7被布置多次。在热源23 布置在发热单元3中，并且设置在冷却单元5中的冷却装置25，例如，设置有嵌入其中的盒式加热器6的加热装置24。加热装置24加热冷却单元5，以防止在冷却单元5中，液压流体蒸气被过度冷凝以擦除气泡，从而阻碍液柱的移动。结果，启动性能得到改善，并且在发热单元3中避免了由液体干燥引起的烧坏。

6. 发明专利

JP2006308521A Reactor application apparatus and vehicle 审中-公开
标题翻译：反应器应用装置和车辆
公开(公告)号：JP2006308521A
公开(公告)日：2006-11-09
申请号：JP2005134379
申请日：2005-05-02
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： FURUTA NORIBUMI
IPC分类号： G01R15/20 , B60L11/14
CPC分类号： Y02T10/7077
摘要： PROBLEM TO BE SOLVED: To provide a reactor application apparatus capable of measuring current flowing in a reactor with a small and lightweight constitution of reduced cost, and to provide a vehicle on which it is mounted. SOLUTION: A boosting converter as the reactor application apparatus has the reactor L1. The reactor L1 comprises a reactor coil 52, a reactor core 54, and a current detection section 58 for detecting the strain produced in the reactor core 54 and measuring current flowing in the reactor coil. Preferably, the current detection section is fixed to the reactor core 54 and includes a piezoelectric element or strain gage for outputting an electric signal, according to the strain of the reactor core. The piezoelectric element or strain gauge is fixed to a section 56 sandwiched between two gaps G1 and G2 in the reactor core, and the reactor coil 52 is wound on the section. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：提供一种能够以低成本的小而轻的结构测量在反应器中流动的电流并提供安装在其上的车辆的电抗器施加装置。解决方案：作为反应器施加装置的升压转换器具有反应器L1。电抗器L1包括电抗器线圈52，电抗器芯54和用于检测在电抗器芯54中产生的应变并测量在电抗器线圈中流动的电流的电流检测部58。优选地，电流检测部分固定到电抗器芯54，并且包括用于根据反应堆芯的应变输出电信号的压电元件或应变计。压电元件或应变计固定在夹在反应堆芯中的两个间隙G1和G2之间的部分56上，并且电抗器线圈52缠绕在该部分上。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2006269655A Semiconductor module and its manufacturing method 有权
标题翻译：半导体模块及其制造方法
公开(公告)号：JP2006269655A
公开(公告)日：2006-10-05
申请号：JP2005084364
申请日：2005-03-23
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： FURUTA NORIBUMI
IPC分类号： H01L23/36
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor module whose insulation and reliability are improved.
SOLUTION: The semiconductor module 1 is provided with a power semiconductor device 2, a heat slinger 12, a diamond-like carbon film 10 provided between the power semiconductor device 2 and the heat slinger 12, and an insulating resin layer 8 that is stacked on the diamond-like carbon film 10 to insulate the power semiconductor device 2 and the heat slinger 12. The insulating resin layer 8 may use an insulating resin such as polyimide. The semiconductor module 1 is further provided with an aluminum foil electrode 6 that is formed on the insulating resin layer 8, and is electrically connected by the power semiconductor device 2 and a solder layer 4.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种其绝缘性和可靠性提高的半导体模块。解决方案：半导体模块1设置有功率半导体器件2，散热器12，设置在功率半导体器件2和散热器12之间的类金刚石碳膜10和绝缘树脂层8，绝缘树脂层8 堆叠在类金刚石碳膜10上以使功率半导体器件2和热抛油环12绝缘。绝缘树脂层8可以使用聚酰亚胺等绝缘树脂。半导体模块1还设置有形成在绝缘树脂层8上的铝箔电极6，并通过功率半导体器件2与焊料层4电连接。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2006264474A Motor drive device and vehicle therewith 审中-公开
标题翻译：电机驱动装置和车辆
公开(公告)号：JP2006264474A
公开(公告)日：2006-10-05
申请号：JP2005084363
申请日：2005-03-23
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： FURUTA NORIBUMI
IPC分类号： B60K7/00 , B60G3/20 , B60G11/14 , B60K17/14 , B60L15/00 , F16F1/06
CPC分类号： B60G2204/30 , Y02T10/6204
摘要： PROBLEM TO BE SOLVED: To provide a motor drive device for a vehicle capable of reducing a layout space. SOLUTION: This motor drive device for a vehicle includes a reactor 230 also used for a vehicle-mounted coil spring for resiliently supporting a heavy load and a switching element connected with the reactor 230. The coil spring supports the vehicle body by mounting on a suspension arm. The motor drive device drives an in-wheel type motor IWM placed near a wheel. The reactor 230 and the switching element compose a step-up converter CV for boosting the voltage of a DC power supply. Furthermore, the motor drive device includes an inverter INV for driving the motor by supplying the voltage boosted by the step-up converter. Preferably the reactor 230 has a covering with high insulation on the surface. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够减少布局空间的用于车辆的电动机驱动装置。该解决方案：用于车辆的电动机驱动装置包括还用于弹性支撑重载荷的车载螺旋弹簧的反应器230和与反应器230连接的开关元件。螺旋弹簧通过安装来支撑车身在悬臂上。电机驱动装置驱动放置在车轮附近的轮内电机IWM。电抗器230和开关元件组成用于升压直流电源的电压的升压转换器CV。此外，电动机驱动装置包括用于通过提供由升压转换器升压的电压来驱动电动机的反相器INV。优选地，反应器230具有在表面上具有高绝缘性的覆盖物。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2006210605A Semiconductor device and load drive device 有权
标题翻译：半导体器件和负载驱动器件
公开(公告)号：JP2006210605A
公开(公告)日：2006-08-10
申请号：JP2005020012
申请日：2005-01-27
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： FURUTA NORIBUMI
IPC分类号： H01L23/473 , H02M7/48 , H02P27/06
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device having a semiconductor stack, of which the cooling performance of a power semiconductor element is improved. SOLUTION: A plurality of semiconductor modules constituting a step-up convertor 10 and inverters 20 and 30 are laminated alternately with cooling devices 61-68. The semiconductor modules, adjoining each other in laminating direction, are staggered from each other so that the heating centers of power semiconductor elements do not face each other. Connecting members 71-77 for connecting the cooling devices 61-68 are provided in the spaces generated, when the semiconductor modules are laminated in a staggered manner. The semiconductor modules are arranged in the order of inverter 30, inverter 20, and step-up convertor 10, or the order of amount of heating, starting from the upper stream side of a cooling system. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供具有半导体堆叠的半导体器件，其中提高了功率半导体元件的冷却性能。解决方案：构成升压转换器10和反相器20和30的多个半导体模块与冷却装置61-68交替地层叠。在层叠方向上彼此相邻的半导体模块彼此交错，使得功率半导体元件的加热中心不彼此面对。连接构件71-77用于连接冷却装置61-68设置在半导体模块以交错方式层压时产生的空间中。半导体模块按照逆变器30，逆变器20和升压转换器10的顺序，或从冷却系统的上游侧开始的加热量的顺序排列。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2006156479A Power semiconductor device 审中-公开
标题翻译：功率半导体器件
公开(公告)号：JP2006156479A
公开(公告)日：2006-06-15
申请号：JP2004340918
申请日：2004-11-25
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： FURUTA NORIBUMI
IPC分类号： H01L29/78 , H01L21/60 , H01L27/04 , H01L29/06 , H01L29/12
CPC分类号： H01L24/06 , H01L24/05 , H01L2224/04042 , H01L2224/05 , H01L2224/48091 , H01L2224/49 , H01L2224/49171 , H01L2924/01004 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01031 , H01L2924/01033 , H01L2924/014 , H01L2924/10253 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/15787 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a power semiconductor device which is reduced in temperature rise due to the concentration of heat. SOLUTION: The aspect ratio of a power semiconductor element is set to 1.5 or above. Due to this structure, heat dissipation to the surrounding area is increased, and thereby even a power semiconductor element having a high current density can be operated in an efficient temperature region. The number of wires 61-87 for drawing out a main current from a source electrode 2 should be 14 or above and be directed in two different directions. The ends of the wires directed in two different directions are connected to one and the same interconnection electrode 42. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种由于热量集中而导致的温度上升的功率半导体装置。
解决方案：功率半导体元件的纵横比设定为1.5以上。由于这种结构，对周围区域的散热增加，从而即使具有高电流密度的功率半导体元件也能够在有效的温度区域中运行。用于从源电极2拉出主电流的电线61-87的数量应为14或更大并且指向两个不同的方向。引导在两个不同方向的电线的端部连接到同一个互连电极42.版权所有（C）2006，JPO＆NCIPI

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