专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2004128176A Junction for members having different coefficient of linear expansion 有权
公开(公告)号：JP2004128176A
公开(公告)日：2004-04-22
申请号：JP2002289549
申请日：2002-10-02
申请人： Toyota Central Res & Dev Lab Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社豊田中央研究所
发明人： YAMAZOE MASAKAZU , KOJIMA TAKASHI , YAGI YUJI , HASHIMOTO SHOJI , YAMADA YASUSHI
IPC分类号： H01L21/60
CPC分类号： H01L24/40 , H01L24/37 , H01L2224/36 , H01L2224/376 , H01L2224/40 , H01L2224/40137 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/13055 , H01L2224/37599 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a junction for mechanically and electrically connecting two or more members having a different coefficient of linear expansion via a conductive adhesive material layer, which can maintain the connection between the members stably against a thermal change. SOLUTION: The junction (in this case, a semiconductor device) 10 comprises a metal electrode 40, a semiconductor element 32 having a coefficient of linear expansion smaller than that of the metal electrode 40, and a solder layer 38 which is interposed between the metal electrode 40 and the semiconductor element 32 to mechanically and electrically connect the metal electrode 40 and the semiconductor element 32. In the semiconductor device 10, resin 36 with Young's modulus smaller than that of the soldering material is embedded in a peripheral region 38b of the semiconductor layer 38, while no such resin 36 is embedded in an interior region 38a of the semiconductor layer 38. COPYRIGHT: (C)2004,JPO

2. 发明专利

JP2004014994A Semiconductor device 有权
公开(公告)号：JP2004014994A
公开(公告)日：2004-01-15
申请号：JP2002170074
申请日：2002-06-11
申请人： Toyota Central Res & Dev Lab Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社豊田中央研究所
发明人： YAMAZOE MASAKAZU , GOTO HITOSHI , YAGI YUJI , HASHIMOTO SHOJI , YAMADA YASUSHI , KOJIMA TAKASHI
IPC分类号： H01L23/52 , H01L21/3205 , H01L23/48
CPC分类号： H01L24/05 , H01L24/03 , H01L2224/05 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/351 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device having such a structure that an electrode plate is soldered to the top of a semiconductor element by surface, satisfactory stress relaxation properties at its joint, and a wide space that is suitable for wire bonding secured in the electrode plate. SOLUTION: An electrode plate 170 extending planarly while being divided is connected with the top of a power element 10 by surface by a solder layer 30 provided planarly. The periphery portion of the electrode plate 170 is divided into square-shaped electrode pieces 172, and the inward portion of the electrode plate 170 is divided into the square-shaped electrode pieces 174 that are larger than the electrode pieces 172. Since the periphery portion of the electrode plate 170 is divided into finer electrode pieces 172, the thermal stress or the like exerted on the solder layer 30 can be relaxed efficiently. Since the electrode pieces 174 constituting the inward part of the electrode plate 170 are divided coarsely, the connecting space of a bonding wire 20 can be taken up widely. COPYRIGHT: (C)2004,JPO

3. 发明专利

JP2007158268A Construction of terminal connector portion of electronic part 审中-公开
标题翻译：电子部件端子连接器部分的构造
公开(公告)号：JP2007158268A
公开(公告)日：2007-06-21
申请号：JP2005355325
申请日：2005-12-08
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： UTSUNO KIMITAKA , ANDO HIDEKI , YAMAZOE MASAKAZU , OKUBO HIDEMI , TAGAWA HIROYUKI
IPC分类号： H01L25/18 , H01L25/07
摘要： PROBLEM TO BE SOLVED: To provide a construction preventing a resin connector portion from burning and igniting regarding a terminal connector portion processed by local soldering.
SOLUTION: A construction of terminal connector portion 10 of electronic part, to which the other electrode (power element electrode 4) is electrically connected with the local soldering with respect to a connector electrode 3 housed in a concave portion 2 arranged in a resin connector portion 1, is characterized in that a space 5 for accumulating dissolved substance generated at soldering is arranged between a vertical wall portion 2a of the concave portion 2 and vertical wall portion 3a of the connector electrode 3.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供防止树脂连接器部分关于通过局部焊接加工的端子连接器部分燃烧和点燃的结构。解决方案：电子部件的端子连接器部分10的结构，另一个电极（功率元件电极4）相对于容纳在布置在其中的凹部2中的连接器电极3与局部焊接电连接树脂连接器部分1的特征在于，在凹部2的垂直壁部分2a和连接器电极3的垂直壁部分3a之间布置有用于积聚焊接时产生的溶解物质的空间5。）2007，JPO＆INPIT

4. 发明专利

JP2005252173A Method for manufacturing semiconductor device and device usable for it 有权
标题翻译：制造半导体器件的方法和可用于其的器件
公开(公告)号：JP2005252173A
公开(公告)日：2005-09-15
申请号：JP2004064135
申请日：2004-03-08
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： YAMAZOE MASAKAZU
IPC分类号： C23C18/16 , H01L21/02 , H01L21/301 , H01L21/68 , H01L21/683
摘要： PROBLEM TO BE SOLVED: To provide a method for efficiently manufacturing a semiconductor element, based on a thin-plate type semiconductor wafer accompanying plating process, by averting breakage of the thin-plate type wafer at plating processing. SOLUTION: The method for manufacturing the semiconductor device comprises the steps of preparing the semiconductor wafer 1, an adhesive tape 6 for holding the wafer, and a frame 7 for dicing; integrally holding the wafer and the frame through the tape by attaching one surface of the wafer to a sticking part 6b of the tape and attaching the frame to its outside; forming a plating layer 12 on the surface of the wafer by processing with a plurality of liquid formulations required for the plating process, with the wafer being held on the frame; and dicing the wafer into a plurality of chips 14, having a predetermined circuit pattern. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种基于伴随电镀工艺的薄板型半导体晶片有效地制造半导体元件的方法，通过避免在电镀处理时薄板型晶片的破损。解决方案：制造半导体器件的方法包括制备半导体晶片1，用于保持晶片的粘合带6和用于切割的框架7的步骤。通过将晶片的一个表面附接到带的粘贴部分6b并将框架附接到其外部，一体地保持晶片和框架通过带; 通过用电镀工艺所需的多种液体配方进行处理，在晶片的表面上形成镀层12，晶片保持在框架上; 并将晶片切割成具有预定电路图案的多个芯片14。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2013030579A Power conversion apparatus 有权
标题翻译：功率转换装置
公开(公告)号：JP2013030579A
公开(公告)日：2013-02-07
申请号：JP2011165022
申请日：2011-07-28
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： ONO HIROTAKA , KARASKAKI YUJI , YAMAZOE MASAKAZU , KOMINAMI YOSHIAKI
IPC分类号： H01L25/07 , H01L23/36 , H01L23/473 , H01L25/18 , H02M7/48
CPC分类号： H01L23/4012 , H01L23/4006 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a power conversion apparatus which can reduce a constitution (a size in a plane direction and a height in a height direction) in a simple seal structure.SOLUTION: A power conversion apparatus 1 comprises a power module 10L and a power module 10H each including a cooling case 50 which is bonded to a semiconductor element 20 through an insulation member 30. Each of the cooling case 50 of the power modules 10L and 10H comprises: a heat radiation part 51 which extends in a planar state and has pin fins 51c on a rear face 51b; a header part 52 which consecutively extends from the heat radiation part 51 in a planar state; water channel parts 53A and 53B in which coolant 60 inflows and outflows; and a marginal part 54 forming a coolant space RK in which the coolant 60 flows. The heat radiation part 51, the header part 52, the water channel parts 53A and 53B, and the marginal part 54 are integrally molded. The power module 10L and the power module 10H are assembled such that the pin fins 51C of them face each other, and the marginal parts 54 of them are sealed.
摘要翻译：解决的问题：提供一种在简单的密封结构中可以减小结构（平面方向上的尺寸和高度方向的高度）的电力转换装置。电力转换装置1包括功率模块10L和功率模块10H，每个功率模块10L和电源模块10H均包括通过绝缘构件30接合到半导体元件20的冷却壳体50.功率模块的每个冷却箱 10L和10H包括：散热部分51，其在平面状态下延伸并且在后表面51b上具有销散热片51c; 在平面状态下从散热部51连续地延伸的集管部52; 水通道部分53A和53B，其中冷却剂60流入和流出; 以及形成冷却剂60流过的冷却剂空间RK的边缘部分54。散热部51，集管部52，水通道部53A，53B以及边缘部54一体成型。功率模块10L和功率模块10H组装成使得它们的销翅片51C彼此面对，并且它们的边缘部分54被密封。版权所有（C）2013，JPO＆INPIT

6. 发明专利

JP2006261551A Semiconductor module and its manufacturing method 审中-公开
标题翻译：半导体模块及其制造方法
公开(公告)号：JP2006261551A
公开(公告)日：2006-09-28
申请号：JP2005079607
申请日：2005-03-18
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： YAMAZOE MASAKAZU
IPC分类号： H01L23/40
CPC分类号： H01L2224/4847 , H01L2224/73265 , H01L2924/13055 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor module which can reduce the occurrence of void in a solder layer joining between layers and can obtain a high radiation effect. SOLUTION: In the semiconductor module, a plurality of members containing thermal diffusion and radiation members are laminated on a semiconductor element 1 through a solder layer. A measure of void reduction is given to the semiconductor element itself of the most upstream of radiation stream, and the maximum of radiation effect is exhibited. The solder joining surface (electrode surface) of the semiconductor element 1 is formed of a first electrode surface 22 and a second electrode surface 24 which is positioned without a step with the first electrode surface and is composed of a metal having the solder wettability lower than a metal forming the first electrode surface. The second electrode surface 24 is a line pattern where the solder joining surface of the semiconductor element 1 is divided into a plurality of small areas or is partially separated. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种可以减少层间连接的焊料层中的空隙的发生的半导体模块，并且可以获得高的辐射效果。解决方案：在半导体模块中，包含热扩散和辐射部件的多个部件通过焊料层层叠在半导体元件1上。对辐射流最上游的半导体元件本身给出空隙减小的量度，并且显示出最大的辐射效应。半导体元件1的焊料接合面（电极表面）由第一电极表面22和第二电极表面24形成，第一电极表面22和第二电极表面24与第一电极表面没有阶梯位置，并且由焊料润湿性低于形成第一电极表面的金属。第二电极表面24是将半导体元件1的焊料接合面分割为多个小区域或部分分离的线图案。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JPH0766239A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0766239A
公开(公告)日：1995-03-10
申请号：JP21056993
申请日：1993-08-25
申请人： TOYOTA MOTOR CORP
发明人： YAMAZOE MASAKAZU , OTA KAZUHIDE
IPC分类号： H01L21/60 , H05K3/32
摘要： PURPOSE:To improve the heat radiating characteristics of a semiconductor device, and to prevent generation of stress by thermal expansion. CONSTITUTION:In the semiconductor device in which the surface 21, where the electrodes 22 and 23 of a semiconductor chip 20 are formed, is adhered to a substrate 11 and the wiring conductor layer fixed to the substrate 11 using a conductive bonding agent, an anisotropic conductive bonding agent 40, having conductive particles 42 and the particles of the diameter smaller than the conductive particles 42, is used as the conductive bonding agent. Besides, the thermal expansion coefficient of the substrate 11 is almost equalized to that of the semiconductor chip 20 in the semiconductor device.

8. 发明专利

JP2000183508A COLLET FOR MOUNTING ELECTRONIC COMPONENT 失效
公开(公告)号：JP2000183508A
公开(公告)日：2000-06-30
申请号：JP37545798
申请日：1998-12-15
申请人： TOYOTA MOTOR CORP
发明人： YAMAZOE MASAKAZU
IPC分类号： H05K3/34 , C09J5/00
摘要： PROBLEM TO BE SOLVED: To provide a collet for mounting an electronic component, such as a bear chip and a chip part or the like in normalized height without inclination. SOLUTION: Plural protrusions 10 are formed at the top end of a collect main body 3 whose top end is used as an absorption face 3a of a bear chip 4, and a channel 11 for supplying cooling air or the like is formed inside the collet main body 3. Then, at the bringing of the bear chip 4 into contact with connecting materials (solder) 6 on a substrate 5 through pressurizing it, the protrusions 10 are butted against the substrate 5 so that the held height of the bear chip 4 can be made fixed, and the cooling air is injected through the channel 11 in this state so that fused solder can be quickly solidified. Thus, even if the collet 1 is separated from the bear chip 4 in a fast timing, the bear chip 4 will not be displaced.

9. 发明专利

JP2000114321A WIRE BONDING MONITOR DEVICE 失效
公开(公告)号：JP2000114321A
公开(公告)日：2000-04-21
申请号：JP28820498
申请日：1998-10-09
申请人： TOYOTA MOTOR CORP , DENSO CORP
发明人： YAMAZOE MASAKAZU , SASAOKA HIROSHI , MASUDA MICHIHIRO
IPC分类号： H01L21/60 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To accurately discriminate the normal/defective bonding in wire bonding. SOLUTION: A wire bonding monitor device monitors the operations of a wire bonder 1, which bonds a bonding wire 22 to a work 21 by utilizing ultrasonic vibration of a bonding tool 7. The device discriminates normal/ defective wire bonding by monitoring the portions of the waveform of at least one of control voltage, which make constant the current of a vibrator which generates the ultrasonic vibration, the phase difference between the current and voltage of the vibrator, the electric power of the vibrator, the displacement of the bonding tool 7, and the phase difference between the oscillating voltage of a voltage-controlled variable frequency oscillation circuit 2, which drives the vibrator in a plurality of windows at prescribed positions on the graph showing the waveform.

10. 发明专利

JPH02139139A ADJUSTING DEVICE FOR RIGHTENING FORCE OF BALL BEARING 失效
公开(公告)号：JPH02139139A
公开(公告)日：1990-05-29
申请号：JP28838288
申请日：1988-11-15
申请人： TOYOTA MOTOR CORP
发明人： HASHIMOTO TOSHIO , SHIRAI MIKIO , YAMAZOE MASAKAZU
IPC分类号： B23P19/06 , F16C43/00
摘要： PURPOSE:To obviate the adjustment of tightening thereafter or to shorten the time by equipping a tightening force correction means comparing the torque value of the ball bearing tightened by an initial tightening force with an aiming value and changing the tightening force according to the comparison result and the learning means thereof. CONSTITUTION:The outer body of a ball bearing B is tightened by specified tightening force by a tightening device M1, the 1st and 2nd members respectively bonding with the center body and outer body of the ball bearing B are relatively moved and measured by measuring instrument M2 by taking the necessary torque as an angle changing torque. A tightening force correction means M3 changes the tightening force of the tightening device M1 according to the comparison result of the measured angle change torque with specified target value and thus the angle changing torque of the ball bearing B approaches to the specified target value. The initial tightening force is then changed according to this comparison result by a learning means M4. Consequently, the succeeding ball bearing B is tightened by this changed initial tightening force, so the angle changing torque thereof approaches to the target value closer and the need for the operation in correcting the tightening force is eliminated or reduced.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式