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1. 发明专利

JP2012160548A Insulation substrate, and power module having insulation substrate 审中-公开
标题翻译：绝缘衬底和具有绝缘衬底的电源模块
公开(公告)号：JP2012160548A
公开(公告)日：2012-08-23
申请号：JP2011018624
申请日：2011-01-31
申请人： Toyota Central R&D Labs Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社豊田中央研究所
发明人： USUI MASANORI , YAGI YUJI , SHOJI TOMOYUKI , ASADA TAKASHI , SUZUKI TOMOKIYO
IPC分类号： H01L23/36
CPC分类号： H01L2224/32225
摘要： PROBLEM TO BE SOLVED: To provide an insulation substrate capable of satisfying both of a cold heat cycle test and a power cycle test.SOLUTION: An insulation substrate 50 comprises a first wiring layer 52, an insulation layer 54, and a second wiring layer 56. The first wiring layer 52 is constituted with one or more layers. The second wiring layer 56 is constituted with one or more layers. Total sum of 0.2% strength and thickness of each of the one or more layers constituting the first wiring layer 52 is smaller than total sum of 0.2% strength and thickness of each of the one or more layers constituting the second wiring layer 56. Thereby, the insulation substrate 50 is warped into a convex shape toward a radiator 30.
摘要翻译：要解决的问题：提供能够满足冷热循环试验和动力循环试验两者的绝缘基板。解决方案：绝缘基板50包括第一布线层52，绝缘层54和第二布线层56.第一布线层52由一层或多层构成。第二布线层56由一层或多层构成。构成第一布线层52的一个或多个层中的每一个的强度和厚度的0.2％的总和小于构成第二布线层56的一个或多个层中的每一个的强度的0.2％和厚度的总和。因此，绝缘基板50朝向散热器30翘曲成凸形。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2011159662A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2011159662A
公开(公告)日：2011-08-18
申请号：JP2010017870
申请日：2010-01-29
申请人： Toyota Central R&D Labs Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社豊田中央研究所
发明人： SHOJI TOMOYUKI , YAGI YUJI , ASADA TAKASHI , OSADA YUJI , SUZUKI TOMOKIYO
IPC分类号： H01L23/36
CPC分类号： H01L24/33 , H01L2224/32225 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device capable of dissipating heat generated by a semiconductor element through a substrate and more properly inhibiting deterioration of a junction between the semiconductor element and the substrate. SOLUTION: The semiconductor device 10 includes the semiconductor element 11, the junction 12, and a heat sink 15 laminated in order. A direction in which the semiconductor element 11 and the heat sink 15 are laminated is assumed as a thickness direction, and a direction along a plane perpendicular to the thickness direction is assumed as a plane direction. The heat sink 15 includes: a first embedded portion 16 formed in a central region corresponding to a laminate range of the semiconductor element 11, the heat sink having a thermal conductivity in the thickness direction higher than the thermal conductivity in the plane direction and the thermal conductivity of a base material of the heat sink 15; and a second embedded portion 17 formed in a peripheral region, the second embedded portion having a linear expansion coefficient in the plane direction smaller than the linear expansion coefficient in the plane direction of the first embedded portion 16 and the linear expansion coefficient of the base material of the heat sink 15 and having a rigidity in the plane direction higher than the rigidity in the plane direction of the first embedded portion 16 and the rigidity of the base material of the heat sink 15. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提供一种半导体器件，其能够通过衬底散发由半导体元件产生的热量，并且更适当地抑制半导体元件和衬底之间的接合的劣化。解决方案：半导体器件10包括依次层叠的半导体元件11，接合部12和散热片15。将半导体元件11和散热片15层叠的方向作为厚度方向，将与厚度方向垂直的面的方向作为平面方向。散热器15包括：形成在对应于半导体元件11的层叠范围的中心区域中的第一嵌入部分16，散热器在厚度方向上的热传导率高于平面方向上的热导率，热量散热片15的基材的导电性; 以及形成在周边区域中的第二嵌入部分17，第二嵌入部分在平面方向上具有小于第一嵌入部分16的平面方向上的线膨胀系数的线膨胀系数和基材的线膨胀系数并且具有比第一嵌入部16的平面方向的刚性高的平面方向的刚性和散热片15的基材的刚性。（C）2011年， JPO＆INPIT

3. 发明专利

JP2013243238A Insulation laminate substrate and power module 审中-公开
标题翻译：绝缘层压板和功率模块
公开(公告)号：JP2013243238A
公开(公告)日：2013-12-05
申请号：JP2012115250
申请日：2012-05-21
申请人： Toyota Central R&D Labs Inc , 株式会社豊田中央研究所 , Toyota Motor Corp , トヨタ自動車株式会社
发明人： HOJO HIROSHI , KIMURA HIDEHIKO , ASADA TAKASHI , MAKINO HIROAKI , HIRATA SHUICHI
IPC分类号： H01L23/40 , H01L23/12 , H02M7/48 , H05K7/20
摘要： PROBLEM TO BE SOLVED: To provide an insulation laminate substrate capable of restraining progress of cracks or exfoliation generated on a jointing interface at low costs.SOLUTION: An insulation laminate substrate (1) according to the present invention comprises: an insulation plate (10); a first metal layer (11) having a first jointing face (11a) jointed to one face side of the insulation plate and a mounting face (11b) on which an electronic device serving as a heat generation source is mounted on a side opposite to the first jointing face; and a second metal layer (12) having a second jointing face (12b) jointed to the other face side of the insulation plate and a brazing face (12a) brazed to a heat transfer apparatus (2) on a side opposite to the second jointing face. The second metal layer has a peripheral groove (121) passing through an inner side than an outer peripheral edge of the second jointing face and opened on the second jointing face. The peripheral groove deteriorates and retains a leading tip of cracks or exfoliation generated on a jointing interface of the insulation plate and the metal layer. Therefore, when the insulation laminate substrate according to the present invention is used for a power module, heat generated from a power device can be stably dissipated through the second metal layer for a long time.
摘要翻译：要解决的问题：提供能够以低成本抑制在接合界面上产生的裂纹或剥离的进行的绝缘层压基板。解决方案：根据本发明的绝缘层叠基板（1）包括：绝缘板（10） ; 第一金属层（11），其具有连接到绝缘板的一个正面侧的第一接合面（11a）和安装面（11b），在该安装面上安装有用作发热源的电子设备第一接合面; 以及第二金属层（12），其具有与所述绝缘板的另一面接合的第二接合面（12b），钎焊面（12a）钎焊到与所述第二接合部相反的一侧的传热装置（2）面对。第二金属层具有通过第二接合面的外周缘的内侧的周边槽（121），并且在第二接合面上开口。周边沟槽劣化并保持在绝缘板和金属层的接合界面上产生的裂纹或剥离的前端。因此，当将本发明的绝缘层叠基板用于功率模块时，能够从功率器件产生的热量通过第二金属层长时间稳定地散发。

4. 发明专利

JP2013251472A Heat transfer member and module comprising the same 有权
标题翻译：传热部件和包含其的模块
公开(公告)号：JP2013251472A
公开(公告)日：2013-12-12
申请号：JP2012126705
申请日：2012-06-04
申请人： Toyota Central R&D Labs Inc , 株式会社豊田中央研究所 , Toyota Motor Corp , トヨタ自動車株式会社
发明人： ASADA TAKASHI , USUI MASANORI , SHOJI TOMOYUKI , IMAI MAKOTO , TANIDA ATSUSHI
IPC分类号： H01L23/36 , H01L21/60 , H01L23/34 , H01L23/48
CPC分类号： H01L23/49568 , H01L23/36 , H01L23/3735 , H01L23/473 , H01L23/492 , H01L24/29 , H01L24/33 , H01L2224/29111 , H01L2924/0132 , H01L2924/0133 , H01L2924/10253 , H01L2924/10272 , H01L2924/1301 , H01L2924/13055 , H01L2924/13064 , H01L2924/13091 , H01L2924/00 , H01L2924/01029 , H01L2924/0105 , H01L2924/01047
摘要： PROBLEM TO BE SOLVED: To provide a heat transfer member capable of suppressing a gap in thermal expansion between the heat transfer member and a semiconductor element, and having a high heat radiation effect as well.SOLUTION: A heat transfer member 40 is provided between a semiconductor element 30 and an electrode plate 50. The heat transfer member 40 comprises a metal part 42 extending between a first surface 40A on a side of the semiconductor element 30 and a second surface 40B on a side of the electrode plate 50, and a ceramic part 44 surrounding the metal part 42. In the metal part 42, an area of the first surface 40A is smaller than an area of the second surface 40B.
摘要翻译：要解决的问题：提供能够抑制传热构件和半导体元件之间的热膨胀间隙并且具有高散热效果的传热构件。解决方案：传热构件40设置在半导体元件30和电极板50.传热构件40包括在半导体元件30的一侧的第一表面40A和在电极板50的侧面上的第二表面40B之间延伸的金属部分42，以及陶瓷围绕金属部分42的部分44.在金属部分42中，第一表面40A的区域小于第二表面40B的面积。

5. 发明专利

JP2013172141A Wound capacitor 审中-公开
标题翻译：绕线电容器
公开(公告)号：JP2013172141A
公开(公告)日：2013-09-02
申请号：JP2012037314
申请日：2012-02-23
申请人： Toyota Motor Corp , トヨタ自動車株式会社 , Toyota Central R&D Labs Inc , 株式会社豊田中央研究所
发明人： SUGITA MASAYUKI , TORII KAORU , KOJIMA TAKASHI , ASADA TAKASHI
IPC分类号： H01G4/224 , H01G2/00 , H01G4/32
摘要： PROBLEM TO BE SOLVED: To provide a wound capacitor in which heat generation due to current change and inductance are reduced.SOLUTION: A wound capacitor 2 comprises: a wound capacitor body 4; a first bus bar 5; and a second bus bar 3. The wound capacitor body 4 is columnar and has electrodes at both ends. The first bus bar 5 is in contact with one end of the wound capacitor body 4. The second bus bar 3 is in contact with the other end of the wound capacitor body 4. The second bus bar 3 has a bottomed cylindrical shape, which covers the periphery of the wound capacitor body 4 up to one end thereof. The connection point of the second bus bar 3 and other electronic component is located on one end side. In the wound capacitor, the direction of a current flowing through the wound capacitor body 4 is opposite from the direction of a current flowing through the cylindrical part of the second bus bar 3. Consequently, the directions of induction fields caused by current change are also opposite from each other, and the induction fields are cancelled.
摘要翻译：要解决的问题：提供一种卷绕电容器，其中由于电流变化和电感引起的热量产生降低。卷绕电容器2包括：卷绕电容器体4; 第一个母线5; 和第二母线3.绕线电容器体4是柱状的，并且在两端具有电极。第一母线5与卷绕电容器本体4的一端接触。第二母线3与卷绕电容器本体4的另一端接触。第二母线3具有有底圆筒形状，其覆盖卷绕电容器本体4的周边直到其一端。第二母线3和其他电子部件的连接点位于一端侧。在卷绕电容器中，流过卷绕电容器体4的电流的方向与流过第二母线3的圆筒部的电流方向相反。因此，由电流变化引起的感应场的方向也是彼此相反，并且感应场被取消。

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