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    • 4. 发明专利
    • Method for manufacturing patch preparation
    • 制造配方的方法
    • JP2013082700A
    • 2013-05-09
    • JP2012215943
    • 2012-09-28
    • Nitto Denko Corp日東電工株式会社
    • SAKAMOTO SACHIKOHANATANI AKINORIOKAZAKI ARIMICHIMUKAIHATA GO
    • A61K9/70A61K31/196A61K31/34A61K31/4152A61K31/554
    • A61K9/7053A61K9/7061
    • PROBLEM TO BE SOLVED: To provide an economical method for manufacturing a patch preparation causing reduced manufacturing loss, which can provide a patch preparation which has a sufficiently high skin permeation amount of a drug without increasing the area and thickness of an adhesive layer, and hardly causes precipitation of crystal of the drug in the extreme.SOLUTION: The method for manufacturing the patch preparation 1 includes: pouring a composition for forming the adhesive layer into a container 11 having a concave part 12 with a shape corresponding to a patch preparation to be manufactured, wherein the composition contains a drug, an adhesive polymer and an organic solvent; removing the organic solvent from the composition through drying to form a drug-containing adhesive layer 3 in the concave part 12; and then laminating a support 2 on the drug-containing adhesive layer 3 to give the patch preparation 1 comprising the drug-containing adhesive layer 3 formed on one surface of the support 2.
    • 待解决的问题:提供一种经济的制造造成制造损失减小的贴片制剂的方法,其可以提供具有足够高的药物皮肤渗透量的贴剂,而不增加粘合剂层的面积和厚度 ,极难造成药物晶体沉淀。 制造贴剂1的方法包括:将用于形成粘合剂层的组合物倒入具有与要制造的贴片制剂相对应的形状的具有凹部12的容器11中,其中所述组合物含有药物 ,粘合剂聚合物和有机溶剂; 通过干燥从组合物中除去有机溶剂,以在凹部12中形成含药物的粘合剂层3; 然后将载体2层压在含药物粘合剂层3上,得到包含在载体2的一个表面上形成的含药物粘合剂层3的贴片制剂1.(C)2013,JPO&INPIT