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1. 发明授权

US08792044B2 Image pickup device and method for manufacturing the image pickup device 有权
标题翻译：用于制造图像拾取装置的图像拾取装置和方法
公开(公告)号：US08792044B2
公开(公告)日：2014-07-29
申请号：US13503826
申请日：2010-10-26
申请人： Toshiyuki Imai , Tougo Teramoto , Yasushi Iijima , Shigeru Hosoe , Akira Sato , Yuiti Fujii , Daisuke Watanabe
发明人： Toshiyuki Imai , Tougo Teramoto , Yasushi Iijima , Shigeru Hosoe , Akira Sato , Yuiti Fujii , Daisuke Watanabe
IPC分类号： H04N5/225
CPC分类号： G02B13/001 , G02B13/0085 , H04N5/2254 , H04N5/2257
摘要： Disclosed is an image pickup device, by which cut resistance at the time of cutting a wafer lens is reduced, high production efficiency is maintained, and excellent optical characteristics are obtained. The image pickup device has a first lens block, a second lens block, a spacer, and a sensor unit. The side surface section of the first lens block, the side surface section of the second lens block, and the side surface section of the spacer are formed on the same plane. A lens cover that covers the first and the second lens blocks is provided in a step formed by respective side surface sections of the first lens block, the second lens block and the spacer, and the side surface section of the sensor unit.
摘要翻译：公开了一种图像拾取装置，通过该方式，切割晶片透镜时的切割电阻降低，生产效率高，并且获得了优异的光学特性。图像拾取装置具有第一透镜块，第二透镜块，间隔件和传感器单元。第一透镜块的侧表面部分，第二透镜块的侧表面部分和间隔件的侧表面部分形成在同一平面上。覆盖第一透镜块和第二透镜块的透镜盖设置在由第一透镜块，第二透镜块和间隔件的相应侧表面部分以及传感器单元的侧表面部分形成的台阶中。

2. 发明申请

US20120218455A1 Image Pickup Device and Method for Manufacturing the Image Pickup Device 有权
标题翻译：图像拾取装置和制造图像拾取装置的方法
公开(公告)号：US20120218455A1
公开(公告)日：2012-08-30
申请号：US13503826
申请日：2010-10-26
申请人： Toshiyuki Imai , Tougo Teramoto , Yasushi Iijima , Shigeru Hosoe , Akira Sato , Yuiti Fujii , Daisuke Watanabe
发明人： Toshiyuki Imai , Tougo Teramoto , Yasushi Iijima , Shigeru Hosoe , Akira Sato , Yuiti Fujii , Daisuke Watanabe
IPC分类号： H04N5/225
CPC分类号： G02B13/001 , G02B13/0085 , H04N5/2254 , H04N5/2257
摘要： Disclosed is an image pickup device, by which cut resistance at the time of cutting a wafer lens is reduced, high production efficiency is maintained, and excellent optical characteristics are obtained. The image pickup device has a first lens block, a second lens block, a spacer, and a sensor unit. The side surface section of the first lens block, the side surface section of the second lens block, and the side surface section of the spacer are formed on the same plane. A lens cover that covers the first and the second lens blocks is provided in a step formed by respective side surface sections of the first lens block, the second lens block and the spacer, and the side surface section of the sensor unit.
摘要翻译：公开了一种图像拾取装置，通过该方式，切割晶片透镜时的切割电阻降低，生产效率高，并且获得了优异的光学特性。图像拾取装置具有第一透镜块，第二透镜块，间隔件和传感器单元。第一透镜块的侧表面部分，第二透镜块的侧表面部分和间隔件的侧表面部分形成在同一平面上。覆盖第一透镜块和第二透镜块的透镜盖设置在由第一透镜块，第二透镜块和间隔件的相应侧表面部分以及传感器单元的侧表面部分形成的台阶中。

3. 发明申请

US20120075709A1 Production Method of Wafer Lens, Intermediate Die, Optical Component, Molding Die, and Production Method of Molding Die 有权
标题翻译：晶片透镜，中间模具，光学部件，成型模具的制造方法以及成型模具的制造方法
公开(公告)号：US20120075709A1
公开(公告)日：2012-03-29
申请号：US13377390
申请日：2010-04-07
申请人： Tougo Teramoto , Shigeru Hosoe , Akira Sato , Toshiyuki Imai , Yuiti Fujii
发明人： Tougo Teramoto , Shigeru Hosoe , Akira Sato , Toshiyuki Imai , Yuiti Fujii
IPC分类号： G02B3/00 , G02B1/12 , B29D11/00 , G02B1/04
CPC分类号： B29D11/00307 , G02B3/0031 , G02B13/0085
摘要： Provided are a wafer lens production method, an intermediate die, an optical component, a molding die, and a molding die production method. The production method of a wafer lens (1) includes a first intermediate die production step using a die (7), a second intermediate die production step using the first intermediate die (8), and a wafer lens production step using the second intermediate die (9). A first intermediate-die substrate (80) is provided with a depressed section (85) on the surface facing the die (7). When photo-curable resin (84A) is pressed, at least a portion closer to the first intermediate-die substrate (80) among the top (71a) and the peripheral section (77) of the die (7) is arranged in the depressed section (85), and a gap is provided so that the die (7) does not contact with a depressed plane (85a) of the depressed section (85).
摘要翻译：提供了晶片透镜制造方法，中间模具，光学部件，成型模具和成型模具的制造方法。晶片透镜（1）的制造方法包括使用模具（7）的第一中间模具制造工序，使用第一中间模具（8）的第二中间模具制造工序和使用第二中间模具的晶片透镜制造工序（9）。第一中间模具基板（80）在面向模具（7）的表面上设置有凹部（85）。当照射光固化树脂（84A）时，在模具（7）的顶部（71a）和周边部分（77）中至少靠近第一中间模具基板（80）的部分设置在凹陷（85），并且提供间隙，使得模具（7）不与凹部（85）的凹陷平面（85a）接触。

4. 发明授权

US08792180B2 Production method of wafer lens, intermediate die, optical component, molding die, and production method of molding die 有权
标题翻译：晶片透镜，中间模具，光学部件，成型模具的制造方法以及成型模具的制造方法
公开(公告)号：US08792180B2
公开(公告)日：2014-07-29
申请号：US13377390
申请日：2010-04-07
申请人： Tougo Teramoto , Shigeru Hosoe , Akira Sato , Toshiyuki Imai , Yuiti Fujii
发明人： Tougo Teramoto , Shigeru Hosoe , Akira Sato , Toshiyuki Imai , Yuiti Fujii
IPC分类号： G02B3/00
CPC分类号： B29D11/00307 , G02B3/0031 , G02B13/0085
摘要： Provided are a wafer lens production method, an intermediate die, an optical component, a molding die, and a molding die production method. The production method of a wafer lens (1) includes a first intermediate die production step using a die (7), a second intermediate die production step using the first intermediate die (8), and a wafer lens production step using the second intermediate die (9). A first intermediate-die substrate (80) is provided with a depressed section (85) on the surface facing the die (7). When photo-curable resin (84A) is pressed, at least a portion closer to the first intermediate-die substrate (80) among the top (71a) and the peripheral section (77) of the die (7) is arranged in the depressed section (85), and a gap is provided so that the die (7) does not contact with a depressed plane (85a) of the depressed section (85).
摘要翻译：提供了晶片透镜制造方法，中间模具，光学部件，成型模具和成型模具的制造方法。晶片透镜（1）的制造方法包括使用模具（7）的第一中间模具制造工序，使用第一中间模具（8）的第二中间模具制造工序和使用第二中间模具的晶片透镜制造工序（9）。第一中间模具基板（80）在面向模具（7）的表面上设置有凹部（85）。当照射光固化树脂（84A）时，在模具（7）的顶部（71a）和周边部分（77）中至少靠近第一中间模具基板（80）的部分设置在凹陷（85），并且提供间隙，使得模具（7）不与凹部（85）的凹陷平面（85a）接触。

5. 发明申请

US20120153518A1 Apparatus for Manufacturing Wafer Lens, Molding Die, And Method for Manufacturing Wafer Lens 审中-公开
标题翻译：用于制造晶片透镜，成型模具的装置以及制造晶片透镜的方法
公开(公告)号：US20120153518A1
公开(公告)日：2012-06-21
申请号：US13392789
申请日：2010-08-09
申请人： Yuiti Fujii , Tougo Teramoto , Shigeru Hosoe , Kenichi Iwaida , Akira Sato , Toshiyuki Imai
发明人： Yuiti Fujii , Tougo Teramoto , Shigeru Hosoe , Kenichi Iwaida , Akira Sato , Toshiyuki Imai
IPC分类号： B29D11/00 , B28B5/00 , B29C39/02
CPC分类号： B29C39/10 , B29C33/42 , B29C39/006 , B29D11/00278 , B29L2011/0016 , G02B3/0031 , G02B3/0056
摘要： An invention for producing a wafer lens is disclosed in which a cured resin is prevented from having projection portions or unfilled sections. The method comprises a dispense step in which resin is dropped onto a die having plural cavities arranged to leave spaces therebetween, an alignment step in which the positions of the die and a glass substrate are adjusted, an imprint step in which one of the die and the glass substrate is pressed against the other, a curing step in which the resin is cured, and a release step in which the glass substrate is released from the die, the steps from the dispense step to the separation step being repeated as one cycle to successively form plastic lens portions on the glass substrate, wherein in the alignment step in each cycle, the cavities of the die are placed between the formed lens parts.
摘要翻译：公开了一种用于制造晶片透镜的发明，其中防止固化树脂具有突出部分或未填充部分。该方法包括一种分配步骤，其中将树脂滴落到具有多个空腔的模具上，该模具具有在其间留下间隔的对准步骤，其中模具和玻璃基板的位置被调节的对准步骤，其中模具和将玻璃基板压在另一个上，固化步骤，其中树脂固化，以及释放步骤，其中玻璃基板从模具中释放，从分配步骤到分离步骤的步骤被重复为一个循环在玻璃基板上顺序地形成塑料透镜部分，其中在每个循环中的对准步骤中，模具的空腔被放置在形成的透镜部件之间。

6. 发明申请

US20110215490A1 Device of Producing Wafer Lens and Method of Producing Wafer Lens 审中-公开
标题翻译：制造晶圆透镜的装置和制造晶圆透镜的方法
公开(公告)号：US20110215490A1
公开(公告)日：2011-09-08
申请号：US13129181
申请日：2009-12-15
申请人： Yuiti Fujii , Nobuhiro Saruya , Toshiyuki Imai
发明人： Yuiti Fujii , Nobuhiro Saruya , Toshiyuki Imai
IPC分类号： B29D11/00 , B29C39/44
CPC分类号： B29C39/04 , B29C31/047 , B29C39/006 , B29C39/10 , B29C39/24 , B29C43/021 , B29C2035/0827 , B29C2043/025 , B29C2043/142 , B29D11/00307 , B29L2011/0016 , F16C29/025 , F16C29/10 , G02B3/0031 , G03F7/0002 , G03F7/70725 , G03F7/70816
摘要： A device for producing a wafer lens, including: a stage which supports a glass substrate; an XY-axis moving mechanism which moves the stage on an XY-plane; an XY air slide guide mechanism which floats the stage relative to an XY guide by means of air, and guides the movement of the stage; a molding die to be filled with resin; a Z-axis moving mechanism which elevates or lowers the molding die; a Z air slide guide mechanism which floats the molding die relative to a Z guide by means of air, and guides the elevation and lowering of the molding die; and a control device which locks a moving position of the stage by controlling an activation and a deactivation of the XY air slide guide mechanism, and also locks a moving position of the molding die by controlling an activation or a deactivation of the Z air slide guide mechanism.
摘要翻译：一种用于制造晶片透镜的装置，包括：支撑玻璃基板的台; 在XY平面上移动台架的XY轴移动机构; XY空气滑动引导机构，其通过空气相对于XY引导件浮动平台，并引导平台的移动; 用树脂填充的成型模具; 提高或降低成形模的Z轴移动机构; Z空气滑动引导机构，其通过空气相对于Z引导件浮动成型模具，并且引导成型模具的升高和降低; 以及控制装置，其通过控制XY空气滑动引导机构的启动和停用来锁定工作台的移动位置，并且还通过控制Z空气滑动导轨的启动或停用来锁定成型模具的移动位置机制。

7. 发明申请

US20070164636A1 Vibration body for cutting, vibration cutting unit, processing apparatus, molding die and optical element 有权
标题翻译：振动体用于切割，振动切割单元，加工设备，成型模具和光学元件
公开(公告)号：US20070164636A1
公开(公告)日：2007-07-19
申请号：US11639624
申请日：2006-12-14
申请人： Toshiyuki Imai , Shigeru Hosoe , Hiroyuki Matsuda
发明人： Toshiyuki Imai , Shigeru Hosoe , Hiroyuki Matsuda
IPC分类号： H01L41/00
CPC分类号： B23B5/36 , B23B1/00 , B23B27/1614 , B23B29/125 , B23B2260/108 , Y10S82/904 , Y10T82/10 , Y10T82/2595
摘要： In a vibration cutting unit, a root portion of a holding member for supporting a vibration body is fixed on a fixed portion of a node portion which is common to axial vibration and bending vibration, on a jointless basis. Therefore, the node portion, namely, a vibration body main part is firmly fixed, thereby, the vibration body main part is supported stably, and vibrations of the vibration body main part is stabilized. In other words, vibrations under the mode where the vibration body main part cannot be controlled can be restrained, and works representing objects to be processed can be processed accurately.
摘要翻译：在振动切割单元中，用于支撑振动体的保持构件的根部固定在与轴向振动和弯曲振动共同的节点部分的固定部分上。因此，节点部分，即振动体主体被牢固地固定，从而使振动体主体被稳定地支撑，并且振动体主体的振动稳定。换句话说，可以抑制在振动体主体不能被控制的模式下的振动，并且可以准确地处理表示要处理的物体的工作。

8. 发明申请

US20070180961A1 Vibration body for cutting, processing device, molding die and optical element 失效
标题翻译：振动体用于切割，加工装置，成型模具和光学元件
公开(公告)号：US20070180961A1
公开(公告)日：2007-08-09
申请号：US11702171
申请日：2007-02-05
申请人： Toshiyuki Imai , Shigeru Hosoe , Hiroyuki Matsuda , Isao Takano
发明人： Toshiyuki Imai , Shigeru Hosoe , Hiroyuki Matsuda , Isao Takano
IPC分类号： B23B41/06
CPC分类号： B23B29/125 , B23B2226/31 , B23B2260/102 , B23B2260/108 , Y10S82/904 , Y10T82/128 , Y10T82/2502
摘要： In the assembly of vibration body, the first width in the lateral direction (X axis direction) is greater than the second width in the longitudinal direction (Y axis direction) in the cross sectional form perpendicular to Z axis of the first portion on the tip side from the closest node position, thereby, the rigidity of a vibration body main part in the X axis direction can be enhanced, and lateral bending vibrations on fixing portion can be restrained. Consequently, an object can be processed highly accurately by the assembly of vibration body that is controlled with a high precision.
摘要翻译：在振动体的组装中，横向（X轴方向）上的第一宽度大于垂直于尖端上的第一部分的Z轴的截面形状的纵向方向（Y轴方向）上的第二宽度从而能够提高振动体主体在X轴方向上的刚性，能够抑制固定部的横向弯曲振动。因此，可以通过高精度地控制的振动体的组装来高精度地加工物体。

9. 发明申请

US20060120816A1 Transfer optical surface machining method, optical device producing mold and optical device 有权
标题翻译：转移光学表面加工方法，光学器件生产模具和光学器件
公开(公告)号：US20060120816A1
公开(公告)日：2006-06-08
申请号：US11290499
申请日：2005-12-01
申请人： Tomoyuki Morimoto , Shigeru Hosoe , Hiroyuki Matsuda , Toshiyuki Imai
发明人： Tomoyuki Morimoto , Shigeru Hosoe , Hiroyuki Matsuda , Toshiyuki Imai
IPC分类号： B23C3/00 , B23B3/00
CPC分类号： B23P15/24 , B23B1/00 , B23B2226/125 , B23B2226/31 , B23C3/20 , Y10T82/10 , Y10T82/2502 , Y10T409/303808
摘要： A machining method of machining a transfer optical surface on a optical element producing die having the transfer optical surface made of a material having Vickers hardness of Hv1500 or more, comprising: machining the transfer optical surface on the optical element producing die by cutting with a cutting tool, wherein a rake face of a tip of a blade of the cutting tool is set with an angle of minus values at an incising point on a surface to be machined.
摘要翻译：一种在具有由维氏硬度为Hv1500以上的材料制成的转印光学面的光学元件制造模具上加工转印光学面的加工方法，其特征在于，包括：通过切割切割加工所述光学元件制造模具上的转印光学面工具，其中切削工具的刀片的尖端的前刀面在待加工表面上的切割点处被设定为负值的角度。

10. 发明授权

US07730815B2 Vibration body for cutting, processing device, molding die and optical element 失效
标题翻译：振动体用于切割，加工装置，成型模具和光学元件
公开(公告)号：US07730815B2
公开(公告)日：2010-06-08
申请号：US11702171
申请日：2007-02-05
申请人： Toshiyuki Imai , Shigeru Hosoe , Hiroyuki Matsuda , Isao Takano
发明人： Toshiyuki Imai , Shigeru Hosoe , Hiroyuki Matsuda , Isao Takano
IPC分类号： B23B7/00 , B23B29/02
CPC分类号： B23B29/125 , B23B2226/31 , B23B2260/102 , B23B2260/108 , Y10S82/904 , Y10T82/128 , Y10T82/2502
摘要： In the assembly of vibration body, the first width in the lateral direction (X axis direction) is greater than the second width in the longitudinal direction (Y axis direction) in the cross sectional form perpendicular to Z axis of the first portion on the tip side from the closest node position, thereby, the rigidity of a vibration body main part in the X axis direction can be enhanced, and lateral bending vibrations on fixing portion can be restrained.Consequently, an object can be processed highly accurately by the assembly of vibration body that is controlled with a high precision.
摘要翻译：在振动体的组装中，横向（X轴方向）上的第一宽度大于垂直于尖端上的第一部分的Z轴的截面形状的纵向方向（Y轴方向）上的第二宽度从而能够提高振动体主体在X轴方向上的刚性，能够抑制固定部的横向弯曲振动。因此，可以通过高精度地控制的振动体的组装来高精度地加工物体。

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