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1. 发明申请

US20110256309A1 MONOLITHIC CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：单晶陶瓷电子元件及其制造方法
公开(公告)号：US20110256309A1
公开(公告)日：2011-10-20
申请号：US13162659
申请日：2011-06-17
申请人： Toshiyuki IWANAGA , Akihiro MOTOKI , Makoto OGAWA , Kenichi KAWASAKI , Shunsuki TAKEUCHI , Seiichi NISHIHARA , Shuji MATSUMOTO
发明人： Toshiyuki IWANAGA , Akihiro MOTOKI , Makoto OGAWA , Kenichi KAWASAKI , Shunsuki TAKEUCHI , Seiichi NISHIHARA , Shuji MATSUMOTO
IPC分类号： B05D5/12
CPC分类号： H01G4/30 , B32B18/00 , C04B2237/346 , C04B2237/66 , C04B2237/68 , C04B2237/704 , H01C1/142 , H01C7/008 , H01G4/232 , Y10T428/265 , Y10T428/31678
摘要： A method for manufacturing a monolithic ceramic electronic component includes a plating substep of depositing precipitates primarily composed of a specific metal on an end of each of internal electrodes exposed at a predetermined surface of a laminate and growing the precipitates to coalesce into a continuous plated layer, wherein the specific metal is different from that of the internal electrodes, and the same or substantially the same metal that defines the internal electrodes is distributed throughout the plated layer.
摘要翻译：一种用于制造单块陶瓷电子部件的方法包括：在层叠体的预定表面露出的每个内部电极的端部上沉积主要由特定金属构成的析出物的电镀子步骤，并使析出物凝聚成连续镀层，其中特定金属与内部电极不同，并且限定内部电极的相同或基本相同的金属分布在整个镀层中。

2. 发明申请

US20100020464A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAME 审中-公开
标题翻译：多层陶瓷电子元件及其制造方法
公开(公告)号：US20100020464A1
公开(公告)日：2010-01-28
申请号：US12405372
申请日：2009-03-17
申请人： Toshiyuki IWANAGA , Akihiro MOTOKI , Makoto OGAWA , Kenichi KAWASAKI , Shunsuke TAKEUCHI , Seiichi NISHIHARA , Shuji MATSUMOTO
发明人： Toshiyuki IWANAGA , Akihiro MOTOKI , Makoto OGAWA , Kenichi KAWASAKI , Shunsuke TAKEUCHI , Seiichi NISHIHARA , Shuji MATSUMOTO
IPC分类号： H01G4/30
CPC分类号： H01G4/30 , H01G4/005 , H01G13/00 , Y10T29/435
摘要： A method for producing a multilayer ceramic electronic component includes a plating step including depositing a plating material on the ends of internal electrodes exposed at a predetermined surface of a laminate to form plating deposits primarily composed of a specific metal and growing the plating deposits so as to connect the plating deposits to each other to form a continuous plated layer. The specific metal primarily defining the plated layer is different from a metal defining the internal electrodes. The same or substantially the same metal as the metal defining the internal electrodes is present throughout the plated layer.
摘要翻译：一种多层陶瓷电子部件的制造方法，其特征在于，具有：在层叠体的规定表面露出的内部电极的端部上形成电镀材料，形成主要由特定金属构成的镀覆层，将电镀沉积物彼此连接以形成连续的镀层。主要限定镀层的特定金属与限定内部电极的金属不同。与定义内部电极的金属相同或基本相同的金属存在于整个镀层中。

3. 发明申请

US20090280319A1 MONOLITHIC CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：单晶陶瓷电子元件及其制造方法
公开(公告)号：US20090280319A1
公开(公告)日：2009-11-12
申请号：US12405370
申请日：2009-03-17
申请人： Toshiyuki IWANAGA , Akihiro MOTOKI , Makoto OGAWA , Kenichi KAWASAKI , Shunsuke TAKEUCHI , Seiichi NISHIHARA , Shuji MATSUMOTO
发明人： Toshiyuki IWANAGA , Akihiro MOTOKI , Makoto OGAWA , Kenichi KAWASAKI , Shunsuke TAKEUCHI , Seiichi NISHIHARA , Shuji MATSUMOTO
IPC分类号： B32B5/00 , B32B38/00 , B32B15/04
CPC分类号： H01G4/30 , B32B18/00 , C04B2237/346 , C04B2237/66 , C04B2237/68 , C04B2237/704 , H01C1/142 , H01C7/008 , H01G4/232 , Y10T428/265 , Y10T428/31678
摘要： A method for manufacturing a monolithic ceramic electronic component includes a plating substep of depositing precipitates primarily composed of a specific metal on an end of each of internal electrodes exposed at a predetermined surface of a laminate and growing the precipitates to coalesce into a continuous plated layer, wherein the specific metal is different from that of the internal electrodes, and the same or substantially the same metal that defines the internal electrodes is distributed throughout the plated layer.
摘要翻译：一种用于制造单块陶瓷电子部件的方法包括：在层叠体的预定表面露出的每个内部电极的端部上沉积主要由特定金属构成的析出物的电镀子步骤，并使析出物凝聚成连续镀层，其中特定金属与内部电极不同，并且限定内部电极的相同或基本相同的金属分布在整个镀层中。

4. 发明申请

US20100328843A1 LAMINATED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：层压陶瓷电子元件及其制造方法
公开(公告)号：US20100328843A1
公开(公告)日：2010-12-30
申请号：US12821305
申请日：2010-06-23
申请人： Masahito SARUBAN , Makoto OGAWA , Toshiyuki IWANAGA , Seiichi MATSUMOTO , Akihiro MOTOKI , Shunsuke TAKEUCHI , Seiichi NISHIHARA , Kenichi KAWASAKI
发明人： Masahito SARUBAN , Makoto OGAWA , Toshiyuki IWANAGA , Seiichi MATSUMOTO , Akihiro MOTOKI , Shunsuke TAKEUCHI , Seiichi NISHIHARA , Kenichi KAWASAKI
IPC分类号： H01G4/008 , B05D5/12
CPC分类号： H01G4/2325 , H01G4/30 , H01L41/083 , H01L41/293
摘要： In a method for manufacturing a laminated ceramic electronic component, after a plating layer for an external terminal electrode is formed by applying copper plating to an end surface of a component main body at which respective ends of a plurality of internal electrodes primarily including nickel are exposed, when a heat treatment at a temperature of about 800° C. or more is applied in order to improve adhesion strength and resistance to moisture of the external terminal electrode, voids may occur in the plating layer. The step of applying a heat treatment at a temperature of about 800° C. or more to a component main body with plating layers formed thereon includes not only a step of maintaining a top temperature of about 1000° C. or more but also a step of maintaining a temperature of about 600° C. to 900° C. at least once before the step of maintaining the top temperature. These steps preliminarily diffuse copper included in the plating layers, which has a relatively high diffusion velocity, into the internal electrodes primarily including nickel, thereby reducing a difference in diffusion velocity between copper and nickel at the top temperature, which causes the occurrence of voids.
摘要翻译：在层叠陶瓷电子部件的制造方法中，在将外部端子电极的镀覆层通过在主体的主体的多个内部电极的各端露出的部件主体的端面上进行镀铜而形成后，为了提高外部端子电极的附着强度和耐潮湿性而在800℃以上的温度下进行热处理时，可能会在镀层中产生空隙。在其上形成有镀层的组件主体上，在约800℃以上的温度下进行热处理的步骤不仅包括保持顶部温度为约1000℃以上的步骤，还包括步骤在保持顶部温度的步骤之前至少保持约600℃至900℃的温度。这些步骤将包含在具有较高扩散速度的镀层中的铜初步扩散到主要包括镍的内部电极中，从而减少了在最高温度下铜和镍之间扩散速度的差异，这导致空隙的发生。

5. 发明申请

US20110234045A1 LAMINATED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：层压陶瓷电子元件及其制造方法
公开(公告)号：US20110234045A1
公开(公告)日：2011-09-29
申请号：US13050977
申请日：2011-03-18
申请人： Akihiro MOTOKI , Syunsuke TAKEUCHI , Makoto OGAWA , Seiichi NISHIHARA , Kenichi KAWASAKI , Shuji MATSUMOTO
发明人： Akihiro MOTOKI , Syunsuke TAKEUCHI , Makoto OGAWA , Seiichi NISHIHARA , Kenichi KAWASAKI , Shuji MATSUMOTO
IPC分类号： H01L41/00 , H01C7/13 , H01F5/00 , H01G4/12 , C04B33/32
CPC分类号： H01G4/248 , B32B18/00 , B32B37/18 , B32B2307/202 , B32B2315/02 , B32B2457/00 , C23C18/40 , H01G4/005 , H01G4/012 , H01G4/12 , H01G4/228 , H01G4/30
摘要： In a method of forming a plating layer for an external terminal electrode by applying, for example, copper plating to an end surface of a component main body with respective ends of internal electrodes exposed, and then applying a heat treatment at a temperature of about 1000° C. or more in order to improve the adhesion strength and moisture resistance of the external terminal electrode, the plating layer may be partially melted to decrease the bonding strength of the plating layer. In the step of applying a heat treatment at a temperature of about 1000° C. or more to a component main body with plating layers formed thereon, the average rate of temperature increase from room temperature to the temperature of about 1000° C. or more is set to about 100° C./minute or more. This average rate of temperature increase maintains a moderate eutectic state in the plating layer and ensures a sufficient bonding strength of the plating layer.
摘要翻译：在形成外部端子电极用镀层的方法中，例如通过对内部电极的两端露出的部件主体的端面进行镀铜，然后在约1000℃的温度下进行热处理 ℃以上，为了提高外部端子电极的粘合强度和耐湿性，可以使镀层部分熔融，降低镀层的接合强度。在其上形成有镀层的组件主体上，在约1000℃以上的温度下进行热处理的步骤中，平均温度从室温升高至约1000℃以上的温度设定为约100℃/分钟以上。该平均升温速率在镀层中保持中等的共晶状态，并确保镀层的充分的接合强度。

6. 发明申请

US20100128412A1 LAMINATED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF 有权
标题翻译：层压陶瓷电子元件及其制造方法
公开(公告)号：US20100128412A1
公开(公告)日：2010-05-27
申请号：US12617879
申请日：2009-11-13
申请人： Seiichi NISHIHARA , Shuji MATSUMOTO , Akihiro MOTOKI , Makoto OGAWA
发明人： Seiichi NISHIHARA , Shuji MATSUMOTO , Akihiro MOTOKI , Makoto OGAWA
IPC分类号： H01G4/228 , B05D5/12 , B05D3/02
CPC分类号： H01G4/2325 , H01G4/30
摘要： In a laminated ceramic electronic component in which, by directly carrying out a plating process on an outer surface of a component main body, an external electrode is formed thereon, an attempt is made to improve the adhesion strength between a plated film forming the external electrode and the component main body. A brazing material containing Ti is applied to at least one portion of a surface on which external electrodes of a component main body is formed, and by baking this brazing material, a metal layer containing Ti is formed. Moreover, the external electrodes are formed by a plating process so as to coat at least the metal layer, and a heating process is then carried out so as to cause counter diffusion between the metal layer and the plated film that is to form the external electrodes.
摘要翻译：在层叠陶瓷电子部件中，通过在部件主体的外表面上直接进行电镀处理，在其上形成外部电极，试图提高形成外部电极的镀膜之间的粘合强度和组件主体。将包含Ti的钎料施加到其上形成有组分主体的外部电极的表面的至少一部分，并且通过烘烤该钎焊材料，形成含有Ti的金属层。此外，外部电极通过电镀工艺形成，以便至少涂覆金属层，然后进行加热处理，以便在金属层和形成外部电极的镀膜之间产生反扩散。

7. 发明申请

US20120058257A1 LAMINATED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：层压电子元件及其制造方法
公开(公告)号：US20120058257A1
公开(公告)日：2012-03-08
申请号：US13295151
申请日：2011-11-14
申请人： Shunsuke TAKEUCHI , Kenichi KAWASAKI , Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA
发明人： Shunsuke TAKEUCHI , Kenichi KAWASAKI , Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA
IPC分类号： B05D5/12
CPC分类号： H01G4/008 , H01G4/005 , H01G4/2325 , Y10T29/417 , Y10T29/43 , Y10T29/435
摘要： A laminated electronic component is configured to include substrate plating films disposed on outer surfaces of an electronic component main body through direct plating such that external terminal electrodes are connected to exposed portions of internal conductors (internal electrodes), and the average particle diameter of metal particles defining the substrate plating film is at least about 1.0 μm. The external terminal electrode includes at least one layer of an upper plating film disposed on the substrate plating film. The metal particles defining the substrate plating film are Cu particles.
摘要翻译：层叠电子部件被配置为包括通过直接电镀设置在电子部件主体的外表面上的基板镀膜，使得外部端子电极与内部导体（内部电极）的露出部分连接，金属粒子的平均粒径限定衬底镀膜至少约1.0μm。外部端子电极包括设置在基板镀膜上的至少一层上镀层。限定衬底镀膜的金属颗粒是Cu颗粒。

8. 发明申请

US20100118467A1 LAMINATED CERAMIC ELECTRONIC COMPONENT 有权
标题翻译：层压陶瓷电子元件
公开(公告)号：US20100118467A1
公开(公告)日：2010-05-13
申请号：US12616844
申请日：2009-11-12
申请人： Shunsuke TAKEUCHI , Kenichi KAWASAKI , Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA
发明人： Shunsuke TAKEUCHI , Kenichi KAWASAKI , Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA
IPC分类号： H01G4/228
CPC分类号： H01G4/232 , H01G4/2325 , H01G4/30
摘要： In a laminated ceramic electronic component, external terminal electrodes include plating films directly covering exposed portions of internal electrodes on end surfaces of a ceramic element assembly. On the boundaries between the end surfaces and principal surfaces of the ceramic element assembly, substantially rounded corners are provided, and the plating films are arranged such that the ends of the plating films stop at the corners and do not project from the principal surfaces.
摘要翻译：在层叠陶瓷电子部件中，外部端子电极包括直接覆盖陶瓷元件组件的端面上的内部电极的露出部分的电镀膜。在陶瓷元件组件的端面和主面之间的边界上，设置大致圆角，并且镀膜被布置成使得镀膜的端部停止在角部并且不从主表面突出。

9. 发明申请

US20090323253A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MAKING THE SAME 有权
标题翻译：多层陶瓷电子元件及其制造方法
公开(公告)号：US20090323253A1
公开(公告)日：2009-12-31
申请号：US12490471
申请日：2009-06-24
申请人： Tatsunori KOBAYASHI , Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA , Shunsuke TAKEUCHI , Kenichi KAWASAKI
发明人： Tatsunori KOBAYASHI , Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA , Shunsuke TAKEUCHI , Kenichi KAWASAKI
IPC分类号： H01G4/30 , B05D5/12
CPC分类号： H01G4/005 , H01G4/232 , H01G4/30 , Y10T29/435
摘要： A multilayer ceramic electronic component includes external terminal electrodes that are formed by depositing metal plating films on exposed portions of internal conductors embedded in a ceramic body, depositing a copper plating films that cover the metal plating films and make contact with the ceramic body around the metal plating films, and heat-treating the ceramic body to generate a copper liquid phase, an oxygen liquid phase, and a copper solid phase between the copper plating films and the ceramic body. The mixed phase including these phases forms a region at which a copper oxide is present in a discontinuous manner inside the copper plating film at least at the interfaces between the ceramic body and the copper plating films. The copper oxide securely attaches the copper plating films to the ceramic body and enhances the bonding force of the external terminal electrodes.
摘要翻译：多层陶瓷电子部件包括外部端子电极，其通过在嵌入陶瓷体的内部导体的露出部分上沉积金属电镀膜而形成，沉积覆盖金属电镀膜的铜电镀膜并与金属周围的陶瓷体接触并对该陶瓷体进行热处理，以在铜镀膜和陶瓷体之间产生铜液相，氧液相，铜固相。包括这些相的混合相至少在陶瓷体和镀铜膜之间的界面处形成铜镀层内不连续地存在氧化铜的区域。铜氧化物将铜电镀膜牢固地附着在陶瓷体上，提高外部端子电极的结合力。

10. 发明申请

US20090291317A1 LAMINATED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：层压电子元件及其制造方法
公开(公告)号：US20090291317A1
公开(公告)日：2009-11-26
申请号：US12466435
申请日：2009-05-15
申请人： Kenichi KAWASAKI , Shunsuke TAKEUCHI , Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA
发明人： Kenichi KAWASAKI , Shunsuke TAKEUCHI , Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA
IPC分类号： B32B5/16 , B05D5/12
CPC分类号： H01G4/005 , H01G4/008 , H01G4/232
摘要： A laminated electronic component includes outer terminal electrodes including lower plating films including metal particles having an average size of 0.5 μm or less, the lower plating films being formed by directly plating an outer surface of an electronic component body such that the lower plating films are electrically connected to exposed portions of inner conductors. The outer terminal electrodes may further include upper plating films formed on the lower plating films, the upper plating films being defined by one or more layers. Metal particles defining the upper plating films may have an average size of 0.5 μm or less. The metal particles defining the lower plating films may be Cu particles.
摘要翻译：层叠电子部件包括外部端子电极，其包括具有平均尺寸为0.5μm以下的金属粒子的下部电镀膜，下部电镀膜通过直接电镀电子部件主体的外表面而形成，使得下部电镀膜为电气连接到内部导体的暴露部分。外部端子电极还可以包括形成在下部镀膜上的上部镀膜，上部镀膜由一层或多层限定。限定上镀膜的金属颗粒可以具有0.5μm或更小的平均尺寸。限定下镀层的金属颗粒可以是Cu颗粒。

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