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1. 发明申请

US20080316120A1 ELECTRONIC APPARATUS 审中-公开
标题翻译：电子设备
公开(公告)号：US20080316120A1
公开(公告)日：2008-12-25
申请号：US12140876
申请日：2008-06-17
申请人： Toshiyuki Hirota , Hironori Motoe , Noriyasu Kawamura , Tomomi Murayama , Kentaro Tomioka
发明人： Toshiyuki Hirota , Hironori Motoe , Noriyasu Kawamura , Tomomi Murayama , Kentaro Tomioka
IPC分类号： H01Q1/24
CPC分类号： H01Q1/48 , H01Q1/2258 , H01Q1/38 , H01Q9/42 , H01Q21/28
摘要： According to one embodiment, an electronic apparatus includes a housing, an inner conductor member provided inside the housing, a conductor part with which the housing is provided, and which restrains undesired electromagnetic radiation from leaking from inside the housing to the outside, and an antenna including an antenna element that is provided on an outer surface of the housing, the antenna using the conductor part as an antenna ground. The housing includes a non-conductor part that is out of the conductor part at least at a part of a region in which the antenna element is provided. When the antenna is viewed from a direction in which the antenna element and the housing overlap each other, a size of a part of the antenna element overlapping the non-conductor part is larger than a part of the antenna element overlapping the conductor part.
摘要翻译：根据一个实施例，电子设备包括壳体，设置在壳体内部的内部导体构件，设置有壳体的导体部分，并且其抑制不期望的电磁辐射从壳体内部泄漏到外部，并且天线包括设置在壳体的外表面上的天线元件，使用导体部分作为天线接地的天线。壳体包括至少在设置有天线元件的区域的一部分处的导体部分外的非导体部分。当从天线元件和壳体彼此重叠的方向观察天线时，与非导体部分重叠的天线元件的一部分的尺寸大于天线元件与导体部分重叠的部分的尺寸。

2. 发明申请

US20080318447A1 Electronic Apparatus 失效
标题翻译：电子仪器
公开(公告)号：US20080318447A1
公开(公告)日：2008-12-25
申请号：US12140884
申请日：2008-06-17
申请人： Kentaro Tomioka , Tomomi Murayama , Noriyasu Kawamura , Toshiyuki Hirota , Hironori Motoe
发明人： Kentaro Tomioka , Tomomi Murayama , Noriyasu Kawamura , Toshiyuki Hirota , Hironori Motoe
IPC分类号： H01R12/04
CPC分类号： H01Q1/2258 , H01Q1/243 , H01Q21/28 , Y10S439/927
摘要： According to one embodiment, an electronic apparatus includes a conductive layer provided on an outer surface of a housing, a conductive member provided inside the housing, and a connecting component attached to the housing. The housing is provided with a through hole which causes the inside of the housing to communicate with the outside. The connecting component has conductivity, and is provided with a major diameter section and a minor diameter section. The major diameter section is formed larger than the through hole, is opposed to the conductive layer from outside the housing, and is electrically connected to the conductive layer. The minor diameter section is formed smaller than the through hole, is inserted in the through hole to reach the inside of the housing, and is electrically connected to the conductive member.
摘要翻译：根据一个实施例，电子设备包括设置在壳体的外表面上的导电层，设置在壳体内部的导电构件和附接到壳体的连接构件。壳体设置有使外壳内部与外部连通的通孔。连接部件具有导电性，并且设置有大直径部分和小直径部分。大直径部形成为比通孔大，与壳体外侧与导电层相对，并且与导电层电连接。小直径部形成为小于通孔，插入通孔中以到达壳体的内部，并且与导电构件电连接。

3. 发明授权

US07651345B2 Electronic apparatus in which an conductive layer on an outer surface of a housing is electrically connected to a conductive member in the housing 失效
标题翻译：电子设备，其中壳体的外表面上的导电层电连接到壳体中的导电构件
公开(公告)号：US07651345B2
公开(公告)日：2010-01-26
申请号：US12140884
申请日：2008-06-17
申请人： Kentaro Tomioka , Tomomi Murayama , Noriyasu Kawamura , Toshiyuki Hirota , Hironori Motoe
发明人： Kentaro Tomioka , Tomomi Murayama , Noriyasu Kawamura , Toshiyuki Hirota , Hironori Motoe
IPC分类号： H01R4/66
CPC分类号： H01Q1/2258 , H01Q1/243 , H01Q21/28 , Y10S439/927
摘要： According to one embodiment, an electronic apparatus includes a conductive layer provided on an outer surface of a housing, a conductive member provided inside the housing, and a connecting component attached to the housing. The housing is provided with a through hole which causes the inside of the housing to communicate with the outside. The connecting component has conductivity, and is provided with a major diameter section and a minor diameter section. The major diameter section is formed larger than the through hole, is opposed to the conductive layer from outside the housing, and is electrically connected to the conductive layer. The minor diameter section is formed smaller than the through hole, is inserted in the through hole to reach the inside of the housing, and is electrically connected to the conductive member.
摘要翻译：根据一个实施例，电子设备包括设置在壳体的外表面上的导电层，设置在壳体内部的导电构件和附接到壳体的连接构件。壳体设置有使外壳内部与外部连通的通孔。连接部件具有导电性，并且设置有大直径部分和小直径部分。大直径部形成为比通孔大，与壳体外侧与导电层相对，并且与导电层电连接。小直径部形成为小于通孔，插入通孔中以到达壳体的内部，并且与导电构件电连接。

4. 发明授权

US07782620B2 Electronic apparatus 失效
标题翻译：电子仪器
公开(公告)号：US07782620B2
公开(公告)日：2010-08-24
申请号：US12429948
申请日：2009-04-24
申请人： Kentaro Tomioka , Tomomi Murayama
发明人： Kentaro Tomioka , Tomomi Murayama
IPC分类号： H05K7/20
CPC分类号： H01L23/367 , G06F1/20 , G06F2200/201 , H01L23/427 , H01L24/32 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01015 , H01L2924/01021 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/19041 , H01L2924/3511
摘要： According to one embodiment, an electronic apparatus includes a semiconductor package including a resin substrate and a die mounted on the resin substrate, a printed circuit board on which the semiconductor package is mounted, and a heat receiving plate that has an area larger than an area of the die. The heat receiving plate has a concave portion that corresponds to a surface of the die at a normal temperature. The concave portion is provided with a pasty heat conductive agent. The heat receiving plate is thermally connected to the semiconductor package via the pasty heat conductive agent.
摘要翻译：根据一个实施例，一种电子设备包括：半导体封装，包括树脂基板和安装在树脂基板上的管芯，安装有半导体封装的印刷电路板和面积大于面积的热接收板的死亡。受热板具有与正常温度下的模具表面对应的凹部。凹部设有糊状导热剂。热接收板通过糊状导热剂热连接到半导体封装。

5. 发明授权

US07830331B2 Electronic device 有权
标题翻译：电子设备
公开(公告)号：US07830331B2
公开(公告)日：2010-11-09
申请号：US12233365
申请日：2008-09-18
申请人： Fuminori Yamazaki , Kentaro Tomioka , Tomomi Murayama , Toshio Ooe , Satoshi Yokote
发明人： Fuminori Yamazaki , Kentaro Tomioka , Tomomi Murayama , Toshio Ooe , Satoshi Yokote
IPC分类号： H01Q1/50 , H01Q1/24 , H01Q1/42
CPC分类号： H01Q1/243 , H01Q1/38
摘要： An electronic device includes: a circuit board that has a wireless communication module that is mounted thereon and a feed line that is formed on the circuit board and electrically connected to the wireless communication module; a planar member that is formed with an opening and has a flexible planar piece that is formed to protrude toward the circuit board from an edge of the opening; and an antenna pattern that includes an antenna part that is formed on the planar member and a feeder part that is formed on the flexible planar piece, wherein circuit board and the planar member are arranged to be in positions to flexibly bend the flexible planar piece by the circuit board to electrically connect the feeder part of the antenna pattern and the feed line formed on the circuit board.
摘要翻译：电子设备包括：电路板，其具有安装在其上的无线通信模块和形成在电路板上并电连接到无线通信模块的馈电线; 平面构件，其形成有开口，并且具有柔性平面片，其形成为从所述开口的边缘朝向所述电路板突出; 以及天线图案，其包括形成在平面构件上的天线部分和形成在柔性平面片上的馈电部分，其中电路板和平面构件被布置成通过使挠性平面片柔性弯曲的位置电路板电连接天线图案的馈电部分和形成在电路板上的馈线。

6. 发明申请

US20090296354A1 ELECTRONIC APPARATUS 失效
标题翻译：电子设备
公开(公告)号：US20090296354A1
公开(公告)日：2009-12-03
申请号：US12429948
申请日：2009-04-24
申请人： Kentaro Tomioka , Tomomi Murayama
发明人： Kentaro Tomioka , Tomomi Murayama
IPC分类号： H05K7/20
CPC分类号： H01L23/367 , G06F1/20 , G06F2200/201 , H01L23/427 , H01L24/32 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01015 , H01L2924/01021 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/19041 , H01L2924/3511
摘要： According to one embodiment, an electronic apparatus includes a semiconductor package including a resin substrate and a die mounted on the resin substrate, a printed circuit board on which the semiconductor package is mounted, and a heat receiving plate that has an area larger than an area of the die. The heat receiving plate has a concave portion that corresponds to a surface of the die at a normal temperature. The concave portion is provided with a pasty heat conductive agent. The heat receiving plate is thermally connected to the semiconductor package via the pasty heat conductive agent.
摘要翻译：根据一个实施例，一种电子设备包括：半导体封装，包括树脂基板和安装在树脂基板上的管芯，安装有半导体封装的印刷电路板和面积大于面积的热接收板的死亡。受热板具有与正常温度下的模具表面对应的凹部。凹部设有糊状导热剂。热接收板通过糊状导热剂热连接到半导体封装。

7. 发明授权

US08400769B2 Electronic apparatus 有权
标题翻译：电子仪器
公开(公告)号：US08400769B2
公开(公告)日：2013-03-19
申请号：US12895473
申请日：2010-09-30
申请人： Kentaro Tomioka , Takeshi Hongo , Yukihiko Hata
发明人： Kentaro Tomioka , Takeshi Hongo , Yukihiko Hata
IPC分类号： H05K7/20
CPC分类号： H05K7/20336
摘要： According to one embodiment, an electronic apparatus includes a housing provided with air intake holes, a circuit board contained in the housing, with a heat producing component mounted on the circuit board, a heat sink contained in the housing, and a fan which sends cooling air to the heat sink in the housing, and includes a fan casing and an impeller contained in the fan casing. The fan casing includes a first suction port and a second suction port which face each other with the impeller inserted therebetween, and an exhaust port which faces the heat sink. The first suction port communicates with the air intake holes of the housing. The second suction port comprises an open area which faces the heat producing component in the housing, and another open area which is open to inside of the housing at a position deviated from the circuit board.
摘要翻译：根据一个实施例，一种电子设备包括：壳体，其具有进气孔，容纳在壳体中的电路板，安装在电路板上的发热部件，容纳在壳体中的散热器和发送冷却的风扇空气到壳体中的散热器，并且包括容纳在风扇壳体中的风扇壳体和叶轮。所述风扇壳体包括第一吸入口和第二吸入口，所述第一吸入口和第二吸入口在所述叶片插入其间彼此面对，以及与所述散热器相对的排气口。第一吸入口与壳体的进气孔连通。第二吸入口包括面对壳体中的发热部件的开口区域和在偏离电路板的位置处对壳体内部开口的另一开口区域。

8. 发明授权

US08045327B2 Electronic apparatus 失效
标题翻译：电子仪器
公开(公告)号：US08045327B2
公开(公告)日：2011-10-25
申请号：US12860360
申请日：2010-08-20
申请人： Kentaro Tomioka , Takeshi Hongo
发明人： Kentaro Tomioka , Takeshi Hongo
IPC分类号： H05K7/20
CPC分类号： H05K7/20136 , H05K7/20518
摘要： According to one embodiment, an electronic apparatus includes a housing, a partition, a first cooling fan, and a second cooling fan. The partition partitions an inside of the housing into a first chamber and a second chamber. The first chamber communicates with a first inlet, a third inlet, and a first outlet. The second chamber communicates with a second inlet and a second outlet. The first cooling fan locates above the third inlet in the first chamber, and includes a first intake configured to draw air in the first chamber, and a second intake configured to draw air outside the housing through the third inlet, the first cooling fan being configured to discharge the air to a heat sink. The second cooling fan locates in the second chamber and is configured to draw air in the second chamber, and to discharge the air to the second outlet.
摘要翻译：根据一个实施例，电子设备包括壳体，隔板，第一冷却风扇和第二冷却风扇。隔板将壳体的内部分隔成第一室和第二室。第一室与第一入口，第三入口和第一出口连通。第二室与第二入口和第二出口连通。第一冷却风扇位于第一室中的第三入口的上方，并且包括构造成在第一室中抽取空气的第一进气口和构造成通过第三入口将空气抽吸到壳体外部的第二进气口，第一冷却风扇被配置将空气排放到散热器。第二冷却风扇位于第二室中，并被构造成在第二室中抽取空气，并将空气排出到第二出口。

9. 发明申请

US20110075362A1 ELECTRONIC DEVICE 失效
标题翻译：电子设备
公开(公告)号：US20110075362A1
公开(公告)日：2011-03-31
申请号：US12787305
申请日：2010-05-25
申请人： Kentaro Tomioka , Takeshi HONGO
发明人： Kentaro Tomioka , Takeshi HONGO
IPC分类号： H05K7/20
CPC分类号： H05K7/20172
摘要： According to one embodiment, the electronic device includes a housing, the first to third printed circuit boards, and a fan unit. The first printed circuit board includes the first heat-generating part secured to the first wiring board. The second printed circuit board includes the second and third heat-generating parts, has an amount of heat generation larger than that of the first printed circuit board, and is located between the first printed circuit board and the second wall. The third printed circuit board includes the fourth heat-generating part, has an amount of heat generation smaller than that of the first printed circuit board, and is located between the first printed circuit board and the first wall.
摘要翻译：根据一个实施例，电子设备包括壳体，第一至第三印刷电路板以及风扇单元。第一印刷电路板包括固定到第一布线板的第一发热部。第二印刷电路板包括第二和第三发热部件，其发热量大于第一印刷电路板的发热量，并且位于第一印刷电路板和第二壁之间。第三印刷电路板包括第四发热部分，其发热量小于第一印刷电路板的发热量，并且位于第一印刷电路板和第一壁之间。

10. 发明申请

US20110075360A1 ELECTRONIC APPARATUS 审中-公开
标题翻译：电子设备
公开(公告)号：US20110075360A1
公开(公告)日：2011-03-31
申请号：US12837846
申请日：2010-07-16
申请人： Kentaro Tomioka , Takeshi Hongo , Yukihiko Hata
发明人： Kentaro Tomioka , Takeshi Hongo , Yukihiko Hata
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , G06F1/20 , G06F2200/201 , H01L23/4006 , H01L23/467 , H01L2924/0002 , H05K7/20336 , H01L2924/00
摘要： According to one embodiment, an electronic apparatus includes a housing, a heat dissipating member disposed inside the housing, a first heat generating element mounted on the circuit board, a second heat generating element mounted on the circuit board, a first heat pipe, and a second heat pipe. The first heat pipe includes a first heat receiving portion thermally connected to the first heat generating element, and a first heat releasing portion thermally connected to the heat dissipating member. The second heat pipe includes a second heat receiving portion thermally connected to the second heat generating element, a second heat releasing portion thermally connected to the heat dissipating member, and a fluid capturing structure configured to temporarily hold a working fluid enclosed inside the second heat pipe.
摘要翻译：根据一个实施例，电子设备包括壳体，设置在壳体内部的散热构件，安装在电路板上的第一发热元件，安装在电路板上的第二发热元件，第一热管和第二热管。第一热管包括热连接到第一发热元件的第一热接收部分和热连接到散热部件的第一热释放部分。第二热管包括热连接到第二发热元件的第二热接收部分，与散热部件热连接的第二热释放部分，以及流体捕获结构，其被配置为暂时保持封闭在第二热管内的工作流体。

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