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    • 7. 发明授权
    • Semiconductor laser
    • 半导体激光器
    • US4835783A
    • 1989-05-30
    • US41483
    • 1987-04-23
    • Takahiro SuyamaToshiro HayakawaKohsei TakahashiMasafumi KondoSaburo Yamamoto
    • Takahiro SuyamaToshiro HayakawaKohsei TakahashiMasafumi KondoSaburo Yamamoto
    • H01S5/00H01S5/22H01S5/34H01S5/343H01S5/40
    • B82Y20/00H01S5/22H01S5/4031H01S5/2202H01S5/3428H01S5/3432
    • A semiconductor device is formed by sequentially forming a first clad layer, active layer, second clad layer, and cap layer from, for example, an AlGaAs layer with an AlAs mixing ratio of .gtoreq.0.4, on a substrate made of GaAs or the like by MBE, MOCVD or another high precision growth process. Then AlGaAs layer is selectively removed only in the vicinity of formed ridges, and in this part, grooves on two stripes are formed from the cap layer surface, leaving the second clad layer with an intact thickness of, for example, only 3000 .ANG.. An insulation layer made of, for example, SiN is then formed in the groove area and the AlGaAs layer region, thereby creating a current stripe structure, in which only two grooves provide for current passages, that is, the light-emitting regions. In this structure, the thickness of the mesa pattern (ridge part) between the two grooves may be a minimum limit and the processing precision may be improved, while by properly selecting the thickness of the AlGaAs layer, a sufficiently large distance may be set between the mount surface and the active layer, so that the problem of solder climbing-up along the device end surface may be prevented. When the AlAs mixing ratio is controlled at 0.4 in the AlGaAs layer, it is possible to easily remove portions thereof selectively, by using hydrogen fluoride.
    • 半导体器件通过从例如AlAs混合比为> / = 0.4的AlGaAs层顺序地形成第一覆盖层,有源层,第二覆盖层和覆盖层而形成,所述AlGaAs层在由GaAs制成的衬底上或 像MBE,MOCVD或另一个高精度增长过程。 然后,仅在形成的脊的附近选择性地除去AlGaAs层,并且在该部分中,由盖层表面形成两个条纹上的槽,留下第二覆层的完整厚度例如仅为3000安。 然后在沟槽区域和AlGaAs层区域中形成例如由SiN制成的绝缘层,从而产生电流条纹结构,其中只有两个沟槽提供电流通路,即发光区域。 在这种结构中,两个槽之间的台面图案(脊部)的厚度可以是最小限度,并且可以提高加工精度,而通过适当地选择AlGaAs层的厚度,可以设置足够大的距离 安装表面和有源层,从而可以防止沿着器件端面向上爬焊的问题。 当在AlGaAs层中AlAs混合比控制在0.4时,可以通过使用氟化氢来选择性地容易地去除它们的部分。