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    • 5. 发明授权
    • Laser processing apparatus
    • 激光加工设备
    • US07473866B2
    • 2009-01-06
    • US11483614
    • 2006-07-11
    • Yukio MorishigeHiroshi MorikazuToshio TsuchiyaKoichi Takeyama
    • Yukio MorishigeHiroshi MorikazuToshio TsuchiyaKoichi Takeyama
    • B23K26/08B23K26/40B23K15/08H01L21/00
    • B23K26/364B23K26/0613B23K26/083B23K26/40B23K2101/40B23K2103/172
    • A laser processing apparatus comprising a chuck table, laser beam irradiation means for irradiating a workpiece held on the chuck table with a laser beam, and processing feed means for processing-feeding the chuck table and the laser beam irradiation means relative to each other. The laser beam irradiation means includes first laser beam irradiation means for throwing a first pulsed laser beam having a wavelength in the intermediate-infrared radiation region, and second laser beam irradiation means for throwing a second pulsed laser beam having a wavelength in the ultraviolet radiation region. The first laser beam irradiation means and the second laser beam irradiation means are set such that at least a part, in the processing feed direction, of the focus spot of the second pulsed laser beam overlaps the focus spot of the first pulsed laser beam.
    • 一种激光加工装置,包括:卡盘台,激光束照射夹持台上夹持的工件的激光束照射装置,以及用于相对于彼此加工卡盘台和激光束照射装置的加工进给装置。 激光束照射装置包括用于投射在中红外辐射区域具有波长的第一脉冲激光束的第一激光束照射装置和用于投射在紫外线辐射区域中具有波长的第二脉冲激光束的第二激光束照射装置 。 第一激光束照射装置和第二激光束照射装置被设置为使得第二脉冲激光束的聚焦点的处理进给方向中的至少一部分与第一脉冲激光束的聚焦点重叠。
    • 6. 发明申请
    • Laser beam processing machine
    • 激光束加工机
    • US20080011725A1
    • 2008-01-17
    • US11822974
    • 2007-07-11
    • Toshio TsuchiyaHiroshi Morikazu
    • Toshio TsuchiyaHiroshi Morikazu
    • B23K26/02B23K26/00
    • B23K26/0861B23K26/0613B23K26/0622B23K2101/40H01L21/78
    • A laser beam processing machine comprising a chuck table, a laser beam application means for applying a laser beam to a workpiece held on the chuck table, and a processing-feed means for moving the chuck table and the laser beam application means relative to each other in a processing-feed direction, wherein the laser beam application means comprises a first laser beam oscillation means for oscillating a first pulse laser beam having a wavelength ranging from a visible range to a near infrared range, a second laser beam oscillation means for oscillating a second pulse laser beam having a wavelength of an ultraviolet range, a delay means for delaying the timing of oscillating the second pulse laser beam a predetermined time after the timing of oscillating the first pulse laser beam and a common condenser for converging the first pulse laser beam and the second pulse laser beam.
    • 一种激光束处理机,包括:卡盘台,用于将激光束施加到夹持在卡盘台上的工件的激光束施加装置;以及用于相对于彼此移动卡盘台和激光束施加装置的加工进给装置 在处理供给方向上,其中所述激光束施加装置包括用于振荡具有从可见范围到近红外范围的波长的第一脉冲激光束的第一激光束振荡装置,用于振荡 具有紫外线范围波长的第二脉冲激光束,延迟装置,用于在振荡第一脉冲激光束的定时和用于会聚第一脉冲激光束的公共电容器之后的预定时间内延迟振荡第二脉冲激光束的定时 和第二脉冲激光束。
    • 7. 发明申请
    • Laser processing apparatus
    • 激光加工设备
    • US20070023691A1
    • 2007-02-01
    • US11483614
    • 2006-07-11
    • Yukio MorishigeHiroshi MorikazuToshio TsuchiyaKoichi Takeyama
    • Yukio MorishigeHiroshi MorikazuToshio TsuchiyaKoichi Takeyama
    • H01S3/00
    • B23K26/364B23K26/0613B23K26/083B23K26/40B23K2101/40B23K2103/172
    • A laser processing apparatus comprising a chuck table, laser beam irradiation means for irradiating a workpiece held on the chuck table with a laser beam, and processing feed means for processing-feeding the chuck table and the laser beam irradiation means relative to each other. The laser beam irradiation means includes first laser beam irradiation means for throwing a first pulsed laser beam having a wavelength in the intermediate-infrared radiation region, and second laser beam irradiation means for throwing a second pulsed laser beam having a wavelength in the ultraviolet radiation region. The first laser beam irradiation means and the second laser beam irradiation means are set such that at least a part, in the processing feed direction, of the focus spot of the second pulsed laser beam overlaps the focus spot of the first pulsed laser beam.
    • 一种激光加工装置,包括:卡盘台,用激光束照射夹持台上的工件的激光束照射装置,以及用于相对于彼此加工卡盘台和激光束照射装置的加工进给装置。 激光束照射装置包括用于投射在中红外辐射区域具有波长的第一脉冲激光束的第一激光束照射装置和用于投射在紫外线辐射区域中具有波长的第二脉冲激光束的第二激光束照射装置 。 第一激光束照射装置和第二激光束照射装置被设置为使得第二脉冲激光束的聚焦点的处理进给方向中的至少一部分与第一脉冲激光束的聚焦点重叠。
    • 8. 发明授权
    • Laser beam processing machine
    • 激光束加工机
    • US08513566B2
    • 2013-08-20
    • US11979936
    • 2007-11-09
    • Hiroshi MorikazuKeiji Nomaru
    • Hiroshi MorikazuKeiji Nomaru
    • B23K26/02B23K26/38
    • B23K26/0853B23K26/067B23K26/0673B23K26/082B23K2101/40
    • A laser beam processing machine comprising a laser beam application means for applying a laser beam to a workpiece held on a chuck table and a processing-feed means, wherein the laser beam application means comprises a first pulse laser beam application means and a second pulse laser beam application means; the first pulse laser beam application means comprises an acousto-optic deflection means for deflecting the optical axis of a pulse laser beam oscillated by a first pulse laser beam oscillation means in the processing-feed direction (X direction), and a first condenser lens for converging a pulse laser beam passing through the acousto-optic deflection means; the second pulse laser beam application means comprises a second condenser lens for converging a pulse laser beam oscillated by the second pulse laser beam oscillation means; and an NA value of the first condenser lens is set smaller than the NA value of the second condenser lens.
    • 一种激光束处理机,包括:激光束施加装置,用于将激光束施加到夹持在卡盘台上的工件;以及加工进给装置,其中所述激光束施加装置包括第一脉冲激光束施加装置和第二脉冲激光器 射束施加装置; 第一脉冲激光束施加装置包括用于使由第一脉冲激光束振荡装置在处理进给方向(X方向)上振荡的脉冲激光束的光轴偏转的声光偏转装置,以及用于 会聚通过声光偏转装置的脉冲激光束; 第二脉冲激光束施加装置包括用于会聚由第二脉冲激光束振荡装置振荡的脉冲激光束的第二聚光透镜; 并且将第一聚光透镜的NA值设定为小于第二聚光透镜的NA值。
    • 10. 发明申请
    • LASER PROCESSING METHOD
    • 激光加工方法
    • US20090197351A1
    • 2009-08-06
    • US12363318
    • 2009-01-30
    • Hiroshi Morikazu
    • Hiroshi Morikazu
    • H01L21/00
    • H01L21/67092B23K26/03B23K26/032B23K26/034B23K26/0626B23K26/364B23K26/40B23K2103/50H01L21/78
    • In a laser beam processing method, when a laser beam is emitted along a second predetermined dividing line to form a second groove intersecting a first groove previously formed, the power output of the laser beam is allowed to be a first power output in a first interval, that is, until the second predetermined dividing line reaches a position immediately before the first groove. In a second interval from the position close to the first groove to the first groove reached by the second predetermined dividing line, the power output of the laser beam is set to a second power output lower than the first power output. Thus, overheat on the periphery of the second interval can be suppressed.
    • 在激光束处理方法中,当沿着第二预定分割线发射激光束以形成与预先形成的第一凹槽相交的第二凹槽时,激光束的功率输出被允许为第一间隔中的第一功率输出 即,直到第二预定分割线到达紧接在第一凹槽之前的位置。 在从靠近第一凹槽的位置到由第二预定分割线到达的第一凹槽的位置的第二间隔中,激光束的功率输出被设置为低于第一功率输出的第二功率输出。 因此,可以抑制第二间隔的周边的过热。