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1. 发明申请

US20050266334A1 Positive-working photosensitive resin composition, method for producing pattern-formed resin film, semicoductor device, display device, and method for producing the semiconductor device and the display device 有权
标题翻译：正性感光性树脂组合物，图案形成树脂膜的制造方法，半导体装置，显示装置以及半导体装置及显示装置的制造方法
公开(公告)号：US20050266334A1
公开(公告)日：2005-12-01
申请号：US11175813
申请日：2005-07-06
申请人： Toshio Banba , Takuji Ikeda , Tatsuya Yano , Takashi Hirano
发明人： Toshio Banba , Takuji Ikeda , Tatsuya Yano , Takashi Hirano
IPC分类号： G03F7/004 , G03F7/022 , G03F7/023 , G03F7/075 , G03C5/18
CPC分类号： G03F7/0757 , G03F7/0048 , G03F7/0226 , G03F7/0233
摘要： A positive-working photosensitive resin composition containing an alkali soluble resin (A), a diazoquinone compound (B) and a compound (C) which contains a —CH20H group but not a phenolic hydroxyl group, a method for producing a pattern-formed resin film using the composition, a semiconductor device and a display device using the composition, and a method for producing the semiconductor device and the display device. Also, disclosed is a positive-working photosensitive resin composition containing an alkali soluble resin (A), a diazoquinone compound (B) and a mixture solvent of two or more kinds (D), wherein the mixture solvent (D) contains γ-butyrolactone and propylene glycol monoalkyl ether and the total amount of γ-butyrolactone and propylene glycol monoalkyl ether is about 70 wt % or more of the total amount of solvent, a method for producing a pattern-formed resin film using the composition, a semiconductor device and a display device using the composition, and a method for producing the semiconductor device and the display device.
摘要翻译：含有碱溶性树脂（A），重氮醌化合物（B）和含有-CH 2 OH基但不含酚羟基的化合物（C）的正性感光性树脂组合物，使用该组合物制造图案形成树脂膜的方法，使用该组合物的半导体装置和显示装置，以及制造半导体装置和显示装置的方法。另外，公开了含有碱溶性树脂（A），重氮醌化合物（B）和两种以上（D）的混合溶剂的正性感光性树脂组合物，其中，混合溶剂（D）含有γ-丁内酯和丙二醇单烷基醚，γ-丁内酯和丙二醇单烷基醚的总量为溶剂总量的约70重量％以上，使用该组合物制造图案形成树脂膜的方法，半导体装置和使用该组合物的显示装置，以及半导体装置和显示装置的制造方法。

2. 发明授权

US07361445B2 Positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device 有权
标题翻译：正性感光性树脂组合物，图案形成树脂膜的制造方法，半导体装置，显示装置以及半导体装置及显示装置的制造方法
公开(公告)号：US07361445B2
公开(公告)日：2008-04-22
申请号：US11175813
申请日：2005-07-06
申请人： Toshio Banba , Takuji Ikeda , Tatsuya Yano , Takashi Hirano
发明人： Toshio Banba , Takuji Ikeda , Tatsuya Yano , Takashi Hirano
IPC分类号： G03F7/023 , G03F7/30
CPC分类号： G03F7/0757 , G03F7/0048 , G03F7/0226 , G03F7/0233
摘要： A positive-working photosensitive resin composition containing an alkali soluble resin (A), a diazoquinone compound (B) and a compound (C) which contains a —CH2OH group but not a phenolic hydroxyl group, a method for producing a pattern-formed resin film using the composition, a semiconductor device and a display device using the composition, and a method for producing the semiconductor device and the display device. Also, disclosed is a positive-working photosensitive resin composition containing an alkali soluble resin (A), a diazoquinone compound (B) and a mixture solvent of two or more kinds (D), wherein the mixture solvent (D) contains γ-butyrolactone and propylene glycol monoalkyl ether and the total amount of γ-butyrolactone and propylene glycol monoalkyl ether is about 70 wt % or more of the total amount of solvent, a method for producing a pattern-formed resin film using the composition, a semiconductor device and a display device using the composition, and a method for producing the semiconductor device and the display device.
摘要翻译：含有碱溶性树脂（A），重氮醌化合物（B）和含有-CH 2 OH基而不是酚羟基的化合物（C）的正性感光性树脂组合物，使用该组合物制造图案形成树脂膜的方法，使用该组合物的半导体装置和显示装置，以及该半导体装置及显示装置的制造方法。另外，公开了含有碱溶性树脂（A），重氮醌化合物（B）和两种以上（D）的混合溶剂的正性感光性树脂组合物，其中，混合溶剂（D）含有γ-丁内酯和丙二醇单烷基醚，γ-丁内酯和丙二醇单烷基醚的总量为溶剂总量的约70重量％以上，使用该组合物制造图案形成树脂膜的方法，半导体装置和使用该组合物的显示装置，以及半导体装置和显示装置的制造方法。

3. 发明授权

US07238455B2 Positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device 失效
标题翻译：正性感光性树脂组合物，图案形成树脂膜的制造方法，半导体装置，显示装置以及半导体装置及显示装置的制造方法
公开(公告)号：US07238455B2
公开(公告)日：2007-07-03
申请号：US10874592
申请日：2004-06-23
申请人： Toshio Banba , Takuji Ikeda , Tatsuya Yano , Takashi Hirano
发明人： Toshio Banba , Takuji Ikeda , Tatsuya Yano , Takashi Hirano
IPC分类号： G03F7/023 , G03F7/30
CPC分类号： G03F7/0757 , G03F7/0048 , G03F7/0226 , G03F7/0233
摘要： The invention provides a positive-working photosensitive resin composition comprising an alkali soluble resin (A), a diazoquinone compound (B) and a compound (C) which contains a —CH2OH group but not a phenolic hydroxyl group, a method for producing a pattern-formed resin film using the composition, a semiconductor device and a display device using the composition, and a method for producing the semiconductor device and the display device. Also, the present invention provides a positive-working photosensitive resin composition comprising an alkali soluble resin (A), a diazoquinone compound (B) and a mixture solvent of two or more kinds (D), wherein the mixture solvent (D) contains γ-butyrolactone and propylene glycol monoalkyl ether and the total amount of γ-butyrolactone and propylene glycol monoalkyl ether is about 70 wt % or more of the total amount of solvent, a method for producing a pattern-formed resin film using the composition, a semiconductor device and a display device using the composition, and a method for producing the semiconductor device and the display device.
摘要翻译：本发明提供一种正性感光性树脂组合物，其包含碱溶性树脂（A），重氮醌化合物（B）和含有-CH 2 OH基但不包括酚类的化合物（C）羟基，使用该组合物制造图案形成树脂膜的方法，使用该组合物的半导体装置和显示装置，以及制造半导体装置和显示装置的方法。此外，本发明提供一种正性工作感光性树脂组合物，其含有碱溶性树脂（A），重氮醌化合物（B）和两种以上（D）的混合溶剂，其中，所述混合溶剂（D）含有γ γ-丁内酯和丙二醇单烷基醚，γ-丁内酯和丙二醇单烷基醚的总量为溶剂总量的约70重量％以上，使用该组合物制造图案形成树脂膜的方法，半导体装置和使用该组合物的显示装置，以及用于制造半导体装置和显示装置的方法。

4. 发明授权

US08530119B2 Positive photosensitive resin composition, cured film, protective film, interlayer insulating film, and semiconductor device and display element using the same 有权
标题翻译：正型感光性树脂组合物，固化膜，保护膜，层间绝缘膜，以及使用其的显示元件
公开(公告)号：US08530119B2
公开(公告)日：2013-09-10
申请号：US13321180
申请日：2009-05-20
申请人： Takashi Hirano , Toshio Banba , Shusaku Okamyo , Hiroaki Makabe
发明人： Takashi Hirano , Toshio Banba , Shusaku Okamyo , Hiroaki Makabe
IPC分类号： G03F7/023
CPC分类号： G03F7/0233 , G03F7/0226
摘要： A positive photosensitive resin composition includes (A) a polybenzoxazole precursor resin, (B) a photosensitive diazoquinone compound, (C) a hindered phenol antioxidant shown by the following general formula (1), and (D) a phenol compound shown by the following general formula (2). Formula (1) is: wherein R1 represents a hydrogen atom or an organic group having 1 to 4 carbon atoms, a is an integer from 1 to 3, and b is an integer from 1 to 3. Formula (2) is: wherein R2 represents a methylene group or a single bond, c is an integer from 1 to 3, and d is an integer from 1 to 3. A protective film, an interlayer insulating film, and a semiconductor device and a display element using the same are also disclosed.
摘要翻译：正型感光性树脂组合物包含（A）聚苯并恶唑前体树脂，（B）感光性重氮醌化合物，（C）下述通式（1）所示的受阻酚抗氧化剂，（D）下述通式通式（2）。式（1）为：式中，R 1表示氢原子或碳原子数1〜4的有机基团，a为1〜3的整数，b为1〜3的整数。式（2）表示亚甲基或单键，c为1〜3的整数，d为1〜3的整数。保护膜，层间绝缘膜及半导体装置以及使用该键的显示元件也是披露

5. 发明申请

US20120100484A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INTERLAYER INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY ELEMENT USING THE SAME 有权
标题翻译：正性感光树脂组合物，固化膜，保护膜，层间绝缘膜，以及使用其的半导体器件和显示元件
公开(公告)号：US20120100484A1
公开(公告)日：2012-04-26
申请号：US13321180
申请日：2009-05-20
申请人： Takashi Hirano , Toshio Banba , Shusaku Okamyo , Hiroaki Makabe
发明人： Takashi Hirano , Toshio Banba , Shusaku Okamyo , Hiroaki Makabe
IPC分类号： G03F7/027
CPC分类号： G03F7/0233 , G03F7/0226
摘要： A positive photosensitive resin composition includes (A) a polybenzoxazole precursor resin, (B) a photosensitive diazoquinone compound, (C) a hindered phenol antioxidant shown by the following general formula (1), and (D) a phenol compound shown by the following general formula (2). Formula (1) is: wherein R1 represents a hydrogen atom or an organic group having 1 to 4 carbon atoms, a is an integer from 1 to 3, and b is an integer from 1 to 3. Formula (2) is: wherein R2 represents a methylene group or a single bond, c is an integer from 1 to 3, and d is an integer from 1 to 3. A protective film, an interlayer insulating film, and a semiconductor device and a display element using the same are also disclosed.
摘要翻译：正型感光性树脂组合物包含（A）聚苯并恶唑前体树脂，（B）感光性重氮醌化合物，（C）下述通式（1）所示的受阻酚抗氧化剂，（D）下述通式通式（2）。式（1）为：式中，R 1表示氢原子或碳原子数1〜4的有机基团，a为1〜3的整数，b为1〜3的整数。式（2）表示亚甲基或单键，c为1〜3的整数，d为1〜3的整数。保护膜，层间绝缘膜及半导体装置以及使用该键的显示元件也是披露

6. 发明申请

US20050031994A1 Polyamide resin, positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device 失效
标题翻译：聚酰胺树脂，正性感光性树脂组合物，图案形成树脂膜的制造方法，半导体装置，显示装置以及半导体装置及显示装置的制造方法
公开(公告)号：US20050031994A1
公开(公告)日：2005-02-10
申请号：US10912841
申请日：2004-08-06
申请人： Toshio Banba , Takashi Hirano
发明人： Toshio Banba , Takashi Hirano
IPC分类号： G03F7/022 , C08G69/42 , C08G77/455 , C08L77/00 , G03F7/023 , G03F7/039 , G03F7/075 , G03C1/73
CPC分类号： C08G69/42 , C08G77/455 , G03F7/0233 , G03F7/0757
摘要： The invention provides a polyamide resin having a structure represented by the formula (1), wherein about 0.1 mol % to about 30 mol % of the total amount of Y in the formula (1) has a structure represented by the formula (2), further a positive-working photosensitive resin composition comprising a diazoquinone compound, a method for producing a pattern-formed resin film using the composition, a semiconductor device and a display device using the composition, and a method for producing the semiconductor device and the display device: wherein, X is an organic group of 2 to 4 valences; Y is an organic group of 2 to 6 valences; R1 is a hydroxyl group or —O—R3 wherein m is an integer of 0 to 2; R2 is a hydroxyl group, a carboxyl group, —O—R3 or —COO—R3 wherein n is an integer of 0 to 4; R3 is an organic group having 1 to 15 carbon atoms; wherein, each of R4 and R5 is a divalent organic group; each of R6 and R7 is a monovalent organic group; n is an integer of 0 to 20.
摘要翻译：本发明提供具有式（1）所示结构的聚酰胺树脂，其中式（1）中Y的总量的约0.1mol％至约30mol％具有由式（2）表示的结构，另外，还可以使用含有重氮醌化合物的正性感光性树脂组合物，使用该组合物的图案形成树脂膜的制造方法，使用该组合物的半导体装置和显示装置，以及半导体装置及显示装置的制造方法其中，X为2〜4价的有机基团; Y为2〜6价有机基团; R1是羟基或-O-R3，其中m是0-2的整数; R2是羟基，羧基，-O-R3或-COO-R3，其中n是0-4的整数; R3是碳原子数1〜15的有机基团。其中，R 4和R 5各自为二价有机基团; R6和R7各自为一价有机基团; n为0〜20的整数。

7. 发明授权

US06613699B2 Process for producing a semiconductor device 失效
标题翻译：半导体装置的制造方法
公开(公告)号：US06613699B2
公开(公告)日：2003-09-02
申请号：US10035325
申请日：2002-01-04
申请人： Toshio Banba , Takashi Hirano , Masahide Shinohara
发明人： Toshio Banba , Takashi Hirano , Masahide Shinohara
IPC分类号： H01L2131
CPC分类号： H01L21/31144 , H01L21/31058 , H01L21/31116 , H01L21/76802
摘要： A process for producing a semiconductor device which comprises forming a layer of an organic polymer resin on a surface of a semiconductor element, treating the formed layer by pattern working and curing, etching the element using the patterned and cured layer as a mask, exposing an electric conductive layer at open portions, treating the element with oxygen plasma at a temperature of 100° C. or higher and cleaning the electric conductive layer at the open portions. When the electric conductive layer at open portions is cleaned by the oxygen plasma treatment, formation of cracks on the organic protective layer is suppressed and adhesion between the organic protective layer and a sealing resin is improved.
摘要翻译：一种半导体器件的制造方法，其包括在半导体元件的表面形成有机聚合物树脂层，通过图案加工和固化处理所形成的层，使用图案化和固化层作为掩模蚀刻元件，在开放部分的导电层，在100℃或更高的温度下用氧等离子体处理元件，并且在开口部分清洁导电层。当通过氧等离子体处理清洁开口部分的导电层时，抑制有机保护层上的裂纹的形成，有机保护层和密封树脂之间的粘合性提高。

8. 发明授权

US06607865B2 Positive photosensitive resin composition 失效
公开(公告)号：US06607865B2
公开(公告)日：2003-08-19
申请号：US10059169
申请日：2002-01-31
申请人： Hiroaki Makabe , Toshio Banba , Takashi Hirano
发明人： Hiroaki Makabe , Toshio Banba , Takashi Hirano
IPC分类号： G03F7023
CPC分类号： G03F7/022 , G03F7/0226 , G03F7/0233
摘要： The present invention provides a positive photosensitive resin composition which can form a pattern of high resolution and high residual film ratio and has high sensitivity. That is, the present invention provides a positive photosensitive resin composition comprising 100 parts by weight of a polyamide resin and 1 to 50 parts by weight of a photosensitizer represented by, for example, the following formula (Q-1):

9. 发明授权

US6071666A Positive type photosensitive resin composition and semiconductor device using the same 失效
标题翻译：正型感光性树脂组合物及使用其的半导体装置
公开(公告)号：US6071666A
公开(公告)日：2000-06-06
申请号：US854863
申请日：1997-05-12
申请人： Takashi Hirano , Toshio Banba , Hiroaki Makabe , Naoshige Takeda , Toshiro Takeda
发明人： Takashi Hirano , Toshio Banba , Hiroaki Makabe , Naoshige Takeda , Toshiro Takeda
IPC分类号： G03F7/022 , G03F7/075 , G03F7/023
CPC分类号： G03F7/0226 , G03F7/0755 , G03F7/0757 , Y10S430/107
摘要： A positive type photosensitive resin composition which comprises (A) 100 parts by weight of a polyamide represented by the general formula (1): ##STR1## wherein X represents a tetravalent aromatic group; Y represents a divalent aromatic group; Z represents a group represented by the formula: ##STR2## in which R.sub.1 and R.sub.2 represent organic groups and R.sub.3 and R.sub.4 represent monovalent organic groups; a and b represent molar fractions; a+b=100 mole %; a=60.0-100.0 mole %; b=0-40.0 mole %; and n represents an integer of 2 to 500, (B) 1 to 100 parts by weight of a photosensitive diazoquinone compound and (C) 1 to 50 parts by weight of a phenol compound represented by a specific structural formula and/or (D) 0.1 to 20 parts by weight of an organosilicon compound represented by a specific structural formula; and a semiconductor device in which a pattern of a polybenzoxazole resin obtained by using the above photosensitive resin composition is formed in a thickness of 0.1 to 20 .mu.m on a semiconductor element.
摘要翻译：一种正型感光性树脂组合物，其包含（A）100重量份由通式（1）表示的聚酰胺：其中X表示四价芳族基团; Y表示二价芳基; Z表示由下式表示的基团：其中R1和R2表示有机基团，R3和R4表示一价有机基团; a和b表示摩尔分数; a + b = 100摩尔％ a = 60.0-100.0摩尔％ b = 0-40.0摩尔％ n表示2〜500的整数，（B）1〜100重量份感光性重氮醌化合物和（C）1〜50重量份由特定结构式表示的酚化合物和/或（D） 0.1〜20重量份的由具体结构式表示的有机硅化合物; 以及半导体装置，其中通过使用上述感光性树脂组合物得到的聚苯并恶唑树脂的图案在半导体元件上形成为0.1〜20μm的厚度。

10. 发明授权

US07368205B2 Polyamide resin, positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device 失效
标题翻译：聚酰胺树脂，正性感光性树脂组合物，图案形成树脂膜的制造方法，半导体装置，显示装置以及半导体装置及显示装置的制造方法
公开(公告)号：US07368205B2
公开(公告)日：2008-05-06
申请号：US10912841
申请日：2004-08-06
申请人： Toshio Banba , Takashi Hirano
发明人： Toshio Banba , Takashi Hirano
IPC分类号： G03F7/023 , G03F7/30
CPC分类号： C08G69/42 , C08G77/455 , G03F7/0233 , G03F7/0757
摘要： The invention provides a polyamide resin having a structure represented by the formula (1), wherein about 0.1 mol % to about 30 mol % of the total amount of Y in the formula (1) has a structure represented by the formula (2), further a positive-working photosensitive resin composition comprising a diazoquinone compound, a method for producing a pattern-formed resin film using the composition, a semiconductor device and a display device using the composition, and a method for producing the semiconductor device and the display device: wherein, X is an organic group of 2 to 4 valences; Y is an organic group of 2 to 6 valences; R1 is a hydroxyl group or —O—R3 wherein m is an integer of 0 to 2; R2 is a hydroxyl group, a carboxyl group, —O—R3 or —COO—R3 wherein n is an integer of 0 to 4; R3 is an organic group having 1 to 15 carbon atoms; wherein, each of R4 and R5 is a divalent organic group; each of R6 and R7 is a monovalent organic group; n is an integer of 0 to 20.
摘要翻译：本发明提供具有式（1）所示结构的聚酰胺树脂，其中式（1）中Y的总量的约0.1mol％至约30mol％具有由式（2）表示的结构，另外，还可以使用含有重氮醌化合物的正性感光性树脂组合物，使用该组合物的图案形成树脂膜的制造方法，使用该组合物的半导体装置和显示装置，以及半导体装置及显示装置的制造方法其中，X为2〜4价的有机基团; Y为2〜6价有机基团; R 1是羟基或-O-R 3，其中m是0-2的整数; R 2是羟基，羧基，-OR 3或-COO-R 3，其中n是0〜4的整数 ; R 3是具有1至15个碳原子的有机基团; 其中R 4和R 5各自为二价有机基团; R 6和R 7中的每一个是一价有机基团; n为0〜20的整数。

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