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    • 9. 发明授权
    • Sintered ceramic body
    • 烧结陶瓷体
    • US4939106A
    • 1990-07-03
    • US237158
    • 1988-08-26
    • Toshinobu MiyakoshiAtsushi YamadaAkio KoyamaHideaki Ninomiya
    • Toshinobu MiyakoshiAtsushi YamadaAkio KoyamaHideaki Ninomiya
    • C03C3/091C04B35/195H01B3/08H01B3/12H05K1/03
    • H01B3/087C03C3/091C04B35/195H01B3/12H05K1/0306
    • High-quality ceramic bodies suitable for use as a substrate of electronic devices can be prepared by sintering, at an outstandingly low temperature of 1000.degree. C. or below, a binary powder mixture composed of 30-50% by weight of a non-glassy phase of aluminum oxide and 70-50% by weight of a glassy phase having a quaternary composition composed of silicon dioxide, boron oxide, aluminum oxide and one or more of alkaline earth metal oxides, of which at least 60% by weight is strontium oxide, each constituent being formulated in a specified weight fraction. The ceramic body is particularly advantageous over conventional ones, along with the high mechanical strengths and low dielectric constant, in respect of the resistance against migration of metals therethrough when the ceramic body is in contact with metal-made parts such as electrodes.
    • 适合用作电子器件基板的高品质陶瓷体可以通过在1000℃以下优异的低温下烧结,由30-50重量%的非玻璃状的二元粉末混合物 氧化铝相和70-50重量%的玻璃相,其具有由二氧化硅,氧化硼,氧化铝和一种或多种碱土金属氧化物组成的季组合,其中至少60重量%是氧化锶 ,每种成分以规定的重量分数配制。 当陶瓷体与诸如电极的金属制成的部件接触时,陶瓷体相对于常规的陶瓷体,以及高的机械强度和低的介电常数,在耐金属的迁移的阻力方面是特别有利的。