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    • 7. 发明授权
    • Evaluation value calculating apparatus, recording and playback apparatus, evaluation value calculating method, recording method
    • 评估值计算装置,记录和重放装置,评估值计算方法,记录方法
    • US07835245B2
    • 2010-11-16
    • US11592482
    • 2006-11-03
    • Toshiki ShimizuJumpei KuraMariko Fukuyama
    • Toshiki ShimizuJumpei KuraMariko Fukuyama
    • G11B20/10
    • G11B20/1816G11B20/10009G11B2020/1863H03M13/3738H03M13/41H03M13/6331H03M13/6343
    • An evaluation value calculating apparatus includes the following elements. A difference metric selecting unit selects a difference metric for a specific recorded sequence in recorded sequences obtained in a maximum likelihood decoding process when information expressed with marks and spaces on a recording medium is played back, the difference metric being obtained in the maximum likelihood decoding process. A difference metric error value calculating unit determines a difference metric error value for the selected difference metric using a calculation method that is selected according to an edge shift direction of each of the marks on a time axis, the difference metric error value representing an error from an ideal difference metric and the edge shift direction on the time axis. A statistical processing unit performs statistical processing on the determined difference metric error value on the basis of each of states of path meeting points to generate an evaluation value.
    • 评价值计算装置包括以下要素。 当在最大似然解码处理中获得的信息被记录在记录介质上的标记和空格的信息被重放时,差分度量选择单元选择在特定记录序列中的差值度量,在最大似然解码处理中获得的差分度量 。 差分度量误差值计算单元使用根据时间轴上的每个标记的边沿移位方向选择的计算方法来确定所选差分度量的差分度量误差值,差值度量误差值表示来自 理想差值度量和时间轴上的边沿移位方向。 统计处理单元基于路径会合点的状态的每一个对所确定的差分度量误差值执行统计处理,以生成评估值。
    • 8. 发明授权
    • Shaped material for use in sealing electronic parts
    • 用于密封电子部件的成型材料
    • US5126188A
    • 1992-06-30
    • US539816
    • 1990-06-18
    • Toshiki ShimizuSeiichi FukunagaMinoru Matsumura
    • Toshiki ShimizuSeiichi FukunagaMinoru Matsumura
    • C09J7/02H01G2/10H01L23/10H01L23/29
    • H01G2/103C09J7/0242H01L23/10H01L23/293H01L2224/48091Y10T428/24967Y10T428/31507Y10T428/31515Y10T428/31518Y10T428/31533Y10T428/31721Y10T428/31725Y10T428/31946
    • The present invention provides a film-coated shaped material for use in sealing an electronic part having high shape retentivity and prepared by blanking a film-coated epoxy resin sheet in a shape in conformity with the configuration of the electronic part, the epoxy resin sheet comprising a plastics film having a thickness of 10 to 1000.mu. and a layer of a curable epoxy resin composition in a substantially uncured state and formed on one surface of the film, the epoxy resin composition comprising per 100 parts by weight of an epoxy resin, 5 to 50 parts by weight of a thermoplastic resin having a number average molecular weight of at least 5000, 5 to 300 parts by weight of an inorganic filler and a curing agent, and a chip sealing material flow preventing frame comprising the above film-coated epoxy resin.The present invention further provides a shaped material for use in sealing an electronic part, having high shape retentivity and comprising the film-coated epoxy resin sheet, the shaped material being thermally curable by two divided steps, i.e., a first step of gelling the shaped material at a temperature at which the material melts and adheres to an adherend without flowing out, and a second step of curing the epoxy resin composition at a higher temperature than in the first step without allowing the composition to flow out, and a chip sealing material flow preventing frame comprising the shaped material.
    • 本发明提供一种用于密封具有高形状保持性的电子部件的薄膜形成材料,并且通过将与该电子部件的构造相一致的形式的薄膜包覆环氧树脂片材冲裁而制备,所述环氧树脂片材包括 厚度为10〜1000μm的塑料膜和基本上未固化状态的可固化环氧树脂组合物层,形成在膜的一个表面上,环氧树脂组合物包含每100重量份的环氧树脂5 至50重量份的数均分子量为至少5000的热塑性树脂,5至300重量份的无机填料和固化剂,以及包含上述薄膜包衣的环氧树脂的片状密封材料流动防止框架 树脂。 本发明还提供一种用于密封具有高形状保持性的电子部件的成形材料,并且包括该薄膜包衣的环氧树脂片材,该成形材料可通过两个分开的步骤热固化,即,第一步骤, 材料在不流出的情况下熔融粘附到被粘物的温度下进行,第二步是在不使组合物流出的情况下在比第一步高的温度下固化环氧树脂组合物,以及芯片密封材料 防流体框架包括成形材料。