专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07439451B2 Tape carrier 失效
标题翻译：磁带载体
公开(公告)号：US07439451B2
公开(公告)日：2008-10-21
申请号：US10728911
申请日：2003-12-08
申请人： Toshiki Naito , Toshihiko Omote , Hiroshi Yamazaki
发明人： Toshiki Naito , Toshihiko Omote , Hiroshi Yamazaki
IPC分类号： H05K1/16
CPC分类号： H01L21/6835 , H01L21/67132 , H01L23/4985 , H01L2924/0002 , H05K3/007 , H05K3/0097 , H05K2201/10681 , H05K2203/0156 , H05K2203/1545 , H01L2924/00
摘要： Only individual piece-like flexible wiring boards produced separately and judged to be non-defective products in an inspection step in advance are mounted at regular intervals on a carrying support film to thereby obtain a TAB tape carrier. According to this method, the yield on continuous production can be improved while the step of replacing defective flexible wiring boards found by inspection with non-defective flexible wiring boards can be omitted after mounting of the flexible wiring boards. A difference in level between the respective flexible wiring boards can be prevented from being caused by the replacement, so that high connection reliability can be ensured.
摘要翻译：预先在检查步骤中单独制造并判断为不合格产品的单独的片状柔性布线板以规则的间隔安装在承载支撑膜上，从而获得TAB带状载体。根据该方法，可以在安装柔性布线板之后，可以省略在通过无缺陷柔性布线板检查而发现的有缺陷的挠性布线板的步骤的同时省略连续生产的产量。可以防止各个柔性布线板之间的电平差异被更换引起，从而可以确保高的连接可靠性。

2. 发明申请

US20100072065A1 SUBSTANCE DETECTION SENSOR 有权
标题翻译：物质检测传感器
公开(公告)号：US20100072065A1
公开(公告)日：2010-03-25
申请号：US12448853
申请日：2007-10-16
申请人： Toshiki Naito , Hiroshi Yamazaki , Toshihiko Omote
发明人： Toshiki Naito , Hiroshi Yamazaki , Toshihiko Omote
IPC分类号： G01N27/26
CPC分类号： G01N27/12 , G01N27/126
摘要： A substance detection sensor comprises an insulation layer (2) having flexibility, two electrodes (3A, 3B) so disposed on the insulation layer as to be opposite to each other at a space therebetween and connected to an electric resistance detector, and a conductive layer (4) which is so formed on the insulation layer as to span the two electrodes and to be electrically connected to the two electrodes. The swelling ratio of the conductive layer (4) is changed according to the type and/or the quantity of a specific substance.
摘要翻译：一种物质检测传感器包括具有柔性的绝缘层（2），两个电极（3A，3B），其设置在绝缘层上，在它们之间的空间处彼此相对并连接到电阻检测器，以及导电层（4），其形成在绝缘层上以跨越两个电极并与两个电极电连接。导电层（4）的溶胀比根据特定物质的种类和/或数量而改变。

3. 发明授权

US07205482B2 Tape carrier for TAB 有权
标题翻译： TAB的磁带架
公开(公告)号：US07205482B2
公开(公告)日：2007-04-17
申请号：US10680112
申请日：2003-10-08
申请人： Toshiki Naito , Hiroshi Yamazaki , Toshihiko Omote
发明人： Toshiki Naito , Hiroshi Yamazaki , Toshihiko Omote
IPC分类号： H05K1/03
CPC分类号： H01L23/49572 , H01L23/4985 , H01L2924/0002 , H05K1/0393 , H05K3/0097 , H05K2201/2009 , H05K2203/1545 , Y10T428/24777 , H01L2924/00
摘要： Electric conductor patterns having inner leads arranged at a pitch of not larger than 60 μm are formed on a front surface of an insulating layer of a tape carrier for TAB. A reinforcing layer of stainless steel foil is formed on a rear surface of the insulating layer so as to be extend along a lengthwise direction at opposite side edge portions in a widthwise direction of the insulating layer. Accordingly, both dimensional accuracy and positional accuracy can be improved at the time of carrying the tape carrier for TAB or at the time of mounting and bonding electronic parts though the insulating layer can be formed so as to be thin.
摘要翻译：在TAB的带状载体的绝缘层的前表面上形成具有以不大于60μm的间距布置的内部引线的电导体图案。在绝缘层的后表面上形成不锈钢箔的加强层，以沿着绝缘层的宽度方向的相对侧边缘部分的长度方向延伸。因此，在携带用于TAB的带载体时或在安装和接合电子部件时，可以提高尺寸精度和位置精度，尽管绝缘层可以形成为薄。

4. 发明授权

US08252237B2 Substance detection sensor 有权
标题翻译：物质检测传感器
公开(公告)号：US08252237B2
公开(公告)日：2012-08-28
申请号：US12448853
申请日：2007-10-16
申请人： Toshiki Naito , Hiroshi Yamazaki , Toshihiko Omote
发明人： Toshiki Naito , Hiroshi Yamazaki , Toshihiko Omote
IPC分类号： G01N15/06 , G01N33/00 , G01N33/48
CPC分类号： G01N27/12 , G01N27/126
摘要： A substance detection sensor comprises an insulation layer (2) having flexibility, two electrodes (3A, 3B) so disposed on the insulation layer as to be opposite to each other at a space therebetween and connected to an electric resistance detector, and a conductive layer (4) which is so formed on the insulation layer as to span the two electrodes and to be electrically connected to the two electrodes. The swelling ratio of the conductive layer (4) is changed according to the type and/or the quantity of a specific substance.
摘要翻译：物质检测传感器包括具有柔性的绝缘层（2），两个电极（3A，3B），它们设置在绝缘层上，在它们之间的空间处彼此相对并连接到电阻检测器，以及导电层（4），其形成在绝缘层上以跨越两个电极并与两个电极电连接。导电层（4）的溶胀比根据特定物质的种类和/或数量而改变。

5. 发明申请

US20050230790A1 Tape carrier for TAB 有权
标题翻译： TAB的磁带架
公开(公告)号：US20050230790A1
公开(公告)日：2005-10-20
申请号：US10680112
申请日：2003-10-08
申请人： Toshiki Naito , Hiroshi Yamazaki , Toshihiko Omote
发明人： Toshiki Naito , Hiroshi Yamazaki , Toshihiko Omote
IPC分类号： H01L21/60 , H01L23/12 , H01L23/495 , H01L23/498 , H01L23/50 , H01R43/00 , H05K1/00 , H05K3/00
CPC分类号： H01L23/49572 , H01L23/4985 , H01L2924/0002 , H05K1/0393 , H05K3/0097 , H05K2201/2009 , H05K2203/1545 , Y10T428/24777 , H01L2924/00
摘要： Electric conductor patterns having inner leads arranged at a pitch of not larger than 60 μm are formed on a front surface of an insulating layer of a tape carrier for TAB. A reinforcing layer of stainless steel foil is formed on a rear surface of the insulating layer so as to be extend along a lengthwise direction at opposite side edge portions in a widthwise direction of the insulating layer. Accordingly, both dimensional accuracy and positional accuracy can be improved at the time of carrying the tape carrier for TAB or at the time of mounting and bonding electronic parts though the insulating layer can be formed so as to be thin.
摘要翻译：在TAB的带状载体的绝缘层的前表面上形成具有以不大于60μm的间距布置的内部引线的电导体图案。在绝缘层的后表面上形成不锈钢箔的加强层，以沿着绝缘层的宽度方向的相对侧边缘部分的长度方向延伸。因此，在携带用于TAB的带载体时或在安装和接合电子部件时，可以提高尺寸精度和位置精度，尽管绝缘层可以形成为薄。

6. 发明申请

US20050062160A1 Double-sided wiring circuit board and process for producing the same 审中-公开
标题翻译：双面接线电路板及其制造方法
公开(公告)号：US20050062160A1
公开(公告)日：2005-03-24
申请号：US10920317
申请日：2004-08-18
申请人： Toshiki Naito , Toshihiko Omote
发明人： Toshiki Naito , Toshihiko Omote
IPC分类号： H05K1/11 , H05K1/00 , H05K1/02 , H05K3/10 , H05K3/40 , H05K3/42 , H01L27/10
CPC分类号： H05K3/421 , H05K1/0393 , H05K3/108 , H05K3/423 , H05K2201/0355 , H05K2201/0394 , H05K2201/09563 , H05K2201/09827
摘要： The invention provides a double-sided wiring circuit board which comprises: an insulating layer having a through-hole formed therein and having a first side and a second side; a conductor layer formed on the first side of the insulating layer; a thin metal film formed on the second side of the insulating layer, on the inner circumferential surface of the through-hole, and on the part of the conductor layer that is located in the through-hole; and a deposit layer formed by electroplating on the thin metal film, wherein the through-hole has an inner circumferential wall which inclines so that the inner diameter of the hole gradually increases from the first side to the second side of the insulating layer, and wherein the angle of the inclination between the first side of the insulating layer and the inner circumferential wall being from 40° to 70°. Also disclosed is a production process thereof.
摘要翻译：本发明提供一种双面布线电路板，包括：绝缘层，其具有形成在其中的具有第一侧和第二侧的通孔; 形成在所述绝缘层的第一侧上的导体层; 在绝缘层的第二面上形成的薄金属膜，在通孔的内周面上，以及位于通孔中的导体层的一部分上; 以及通过电镀在所述薄金属膜上形成的沉积层，其中所述通孔具有内壁，所述内周壁倾斜，使得所述孔的内径从所述绝缘层的第一侧向所述第二侧逐渐增加，并且其中绝缘层的第一面与内周壁之间的倾斜角为40°〜70°。还公开了其制备方法。

7. 外观设计

USD574339S1 Pattern formed on the ground layer of a multilayer printed circuit board 有权
标题翻译：图案形成在多层印刷电路板的接地层上
公开(公告)号：USD574339S1
公开(公告)日：2008-08-05
申请号：US29245352
申请日：2005-12-22
申请人： Mitsuru Honjo , Hiroshi Yamazaki , Toshiki Naito
设计人： Mitsuru Honjo , Hiroshi Yamazaki , Toshiki Naito

8. 发明申请

US20050280153A1 Wired circuit forming board, wired circuit board, and thin metal layer forming method 有权
标题翻译：有线电路板，布线电路板和薄金属层成型方法
公开(公告)号：US20050280153A1
公开(公告)日：2005-12-22
申请号：US11147345
申请日：2005-06-08
申请人： Toshiki Naito , Hiroshi Yamazaki
发明人： Toshiki Naito , Hiroshi Yamazaki
IPC分类号： C23C14/14 , C23C14/16 , C23C14/56 , H01L21/44 , H01L29/40 , H05K3/10 , H05K3/38
CPC分类号： C23C14/562 , C23C14/16 , H01L2924/0002 , H05K3/108 , H05K3/388 , H05K2201/0338 , H01L2924/00
摘要： A wired circuit forming board that can provide improved adhesion between an insulating layer and a conductive pattern and can also prevent delamination in a thin metal layer, a wired circuit board for which the same wired circuit forming board is used, and a thin metal layer forming method for forming the thin metal layer. The thin metal layer 2 is formed on the insulating base layer 1 by sputtering the first metal 35 and the second metal 36 in such a condition that a first metal diffusing region 37 for the first metal 35 to be diffused and a second metal diffusing region 38 for the second metal 36 to be diffused are overlapped with each other. This can allow formation of (i) a first unevenly-distributed metal portion 4 in which the first metal 35 is unevenly distributed and which is adjacent to the insulating base layer 1, (ii) a second unevenly-distributed metal portion 5 in which the second metal 36 is unevenly distributed and which is adjacent to the conductive pattern 6, and (iii) a metal coexisting portion 3 which is interposed between the first unevenly-distributed metal portion 4 and the second unevenly-distributed metal portion 5 and in which the first metal 35 and the second metal 36 are coexistent with each other in such a relation as to be continuously present in the thin metal layer 2 without defining any boundaries therebetween.
摘要翻译：一种布线电路形成板，其能够提供绝缘层和导电图案之间的改善的粘附性，并且还可以防止薄金属层中的分层，使用相同布线电路形成板的布线电路板和形成金属层的薄金属层用于形成薄金属层的方法。薄金属层2通过溅射第一金属35和第二金属36而形成在绝缘基底层1上，使得要扩散的第一金属35的第一金属扩散区37和第二金属扩散区38 因为要扩散的第二金属36彼此重叠。这可以形成（i）第一不均匀分布的金属部分4，其中第一金属35不均匀地分布并且与绝缘基底层1相邻，（ii）第二不均匀分布的金属部分5，其中第二金属36不均匀分布并且与导电图案6相邻，以及（iii）介于第一不均匀分布的金属部分4和第二不均匀分布的金属部分5之间的金属共存部分3，其中第一金属35和第二金属36彼此共存，从而连续地存在于薄金属层2中而不在其间限定任何边界。

9. 发明授权

US08511142B2 Substance detection sensor 有权
标题翻译：物质检测传感器
公开(公告)号：US08511142B2
公开(公告)日：2013-08-20
申请号：US12654483
申请日：2009-12-22
申请人： Hiroshi Yamazaki , Toshiki Naito , Hiroyuki Hanazono
发明人： Hiroshi Yamazaki , Toshiki Naito , Hiroyuki Hanazono
IPC分类号： G01N7/00 , G01R27/08
CPC分类号： G01R27/08 , G01N27/125 , G01N27/126
摘要： A substance detection sensor includes an insulating layer; two electrodes spaced in opposed relation to each other on the insulating layer; and conductive layers formed between the two electrodes on the insulating layer so as to electrically connect the two electrodes, and of which a swelling ratio varies depending on the type and/or amount of a specific gas. The conductive layers are formed by dividing into plural layers between the two electrodes.
摘要翻译：物质检测传感器包括绝缘层; 在绝缘层上彼此隔开的两个电极; 以及形成在绝缘层上的两个电极之间的导电层，以便电连接两个电极，并且其溶胀比根据特定气体的类型和/或量而变化。导电层通过在两个电极之间分成多个层而形成。

10. 发明授权

US07417316B2 Wired circuit forming board, wired circuit board, and thin metal layer forming method 有权
标题翻译：有线电路板，布线电路板和薄金属层成型方法
公开(公告)号：US07417316B2
公开(公告)日：2008-08-26
申请号：US11147345
申请日：2005-06-08
申请人： Toshiki Naito , Hiroshi Yamazaki
发明人： Toshiki Naito , Hiroshi Yamazaki
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： C23C14/562 , C23C14/16 , H01L2924/0002 , H05K3/108 , H05K3/388 , H05K2201/0338 , H01L2924/00
摘要： A wired circuit forming board that can provide improved adhesion between an insulating layer and a conductive pattern and can also prevent delamination in a thin metal layer, a wired circuit board for which the same wired circuit forming board is used, and a thin metal layer forming method for forming the thin metal layer. The thin metal layer 2 is formed on the insulating base layer 1 by sputtering the first metal 35 and the second metal 36 in such a condition that a first metal diffusing region 37 for the first metal 35 to be diffused and a second metal diffusing region 38 for the second metal 36 to be diffused are overlapped with each other. This can allow formation of (i) a first unevenly-distributed metal portion 4 in which the first metal 35 is unevenly distributed and which is adjacent to the insulating base layer 1, (ii) a second unevenly-distributed metal portion 5 in which the second metal 36 is unevenly distributed and which is adjacent to the conductive pattern 6, and (iii) a metal coexisting portion 3 which is interposed between the first unevenly-distributed metal portion 4 and the second unevenly-distributed metal portion 5 and in which the first metal 35 and the second metal 36 are coexistent with each other in such a relation as to be continuously present in the thin metal layer 2 without defining any boundaries therebetween.
摘要翻译：一种布线电路形成板，其能够提供绝缘层和导电图案之间的改善的粘附性，并且还可以防止薄金属层中的分层，使用相同布线电路形成板的布线电路板和形成金属层的薄金属层用于形成薄金属层的方法。薄金属层2通过溅射第一金属35和第二金属36而形成在绝缘基底层1上，使得要扩散的第一金属35的第一金属扩散区37和第二金属扩散区38 因为要扩散的第二金属36彼此重叠。这可以形成（i）第一不均匀分布的金属部分4，其中第一金属35不均匀地分布并且与绝缘基底层1相邻，（ii）第二不均匀分布的金属部分5，其中第二金属36不均匀分布并且与导电图案6相邻，以及（iii）介于第一不均匀分布的金属部分4和第二不均匀分布的金属部分5之间的金属共存部分3，其中第一金属35和第二金属36彼此共存，从而连续地存在于薄金属层2中而不在其间限定任何边界。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式