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1. 发明授权

US07965009B2 Motor rotor and manufacturing method thereof 有权
标题翻译：电动机转子及其制造方法
公开(公告)号：US07965009B2
公开(公告)日：2011-06-21
申请号：US12445805
申请日：2007-10-16
申请人： Toshihito Miyashita , Takashi Matsushita , Norihito Tanaka
发明人： Toshihito Miyashita , Takashi Matsushita , Norihito Tanaka
IPC分类号： H02K1/28 , H02K1/30 , H02K21/12 , H02K1/22 , H02K15/00 , H02K15/02
CPC分类号： H02K15/03 , H02K1/2753 , H02K2005/1287 , Y10T29/49009 , Y10T29/49012
摘要： A motor rotor has a resin-impregnated thread layer formed by winding a thread of a reinforced fiber material around a permanent magnet layer with a gap between an outer peripheral surface of the thread layer and an inner peripheral surface of a cylindrical body, and impregnating the thread layer with a curable resin. A subsequent thread layer is formed by leading a continuous thread into an annular passage through thread passing recesses, winding the continuous thread around a bottom portion of the passage, and impregnating the subsequent thread layer with a curable resin. A curable resin is injected into the gap between the outer peripheral surfaces of the thread layer and the subsequent thread layer and the inner peripheral surface of the cylindrical body through resin injection passages and/or the thread passing recesses before heating and curing.
摘要翻译：电动机转子具有通过将增强纤维材料的线缠绕在永磁体层上而形成的树脂浸渍线层，其中，线圈层的外周面与圆筒体的内周面之间具有间隙，螺纹层与可固化树脂。后续的螺纹层通过将连续螺纹引导通过螺纹通过凹槽的环形通道，将连续螺纹缠绕在通道的底部部分上，并用可固化树脂浸渍随后的螺纹层而形成。在加热固化之前，通过树脂注入通道和/或螺纹通孔将可固化树脂注入到螺纹层的外周表面和随后的螺纹层和圆筒体的内周表面之间的间隙中。

2. 发明申请

US20100295402A1 MOTOR ROTOR AND MANUFACTURING METHOD THEREOF 有权
标题翻译：电机转子及其制造方法
公开(公告)号：US20100295402A1
公开(公告)日：2010-11-25
申请号：US12445805
申请日：2007-10-16
申请人： Toshihito Miyashita , Takashi Matsushita , Norihito Tanaka
发明人： Toshihito Miyashita , Takashi Matsushita , Norihito Tanaka
IPC分类号： H02K1/28 , B29C45/14 , H02K15/03
CPC分类号： H02K15/03 , H02K1/2753 , H02K2005/1287 , Y10T29/49009 , Y10T29/49012
摘要： A motor rotor is provided wherein a resin with which a thread layer is impregnated is preventing from being broken even if the motor rotor is rotated at a high speed. A thread layer 9 is formed by winding a thread of a reinforced fiber material around a permanent magnet layer 5 with a gap formed between an outer peripheral surface 9a of the thread layer 9 and an inner peripheral surface 53a of a cylindrical body 53. The thread layer 9 is impregnated with a curable resin. A subsequent thread layer 13 is formed by leading a continuous thread, which is continuous with the thread forming the thread layer 9, into an annular passage 35 through thread passing recesses 33a, and winding the continuous thread around a bottom portion of the passage 35. The subsequent thread layer 13 is impregnated with a curable resin. A cylindrical member 17 is fixed to first and second annular members 21, 7 by shrink fitting. A curable resin is injected into the gap between the outer peripheral surface 9a of the thread layer 9 and the inner peripheral surface 53a of the cylindrical body 53 through resin injection passages 27a and the thread passing recesses 33a. A curable resin is injected into the gap between an outer peripheral surface 13a of the subsequent thread layer 13 and the inner peripheral surface 53a of the cylindrical body 53 through the resin injection passages 27a. Air bubbles contained in the curable resins are removed through the resin injection passages 27a and the thread passing recesses 33a before the curable resins are heated to be cured.
摘要翻译：提供了一种马达转子，其中即使马达转子高速旋转，也可防止其中浸渍有螺纹层的树脂破裂。螺纹层9通过将增强纤维材料的线缠绕在永久磁铁层5上而形成，在螺纹层9的外周表面9a和圆柱体53的内周表面53a之间形成间隙。螺纹层9用可固化树脂浸渍。随后的螺纹层13通过将与形成螺纹层9的螺纹连续的连续螺纹通过螺纹通过凹槽33a引导到环形通道35中，并且将连续螺纹缠绕在通道35的底部。随后的螺纹层13用可固化树脂浸渍。圆筒形构件17通过收缩配合固定到第一和第二环形构件21,7。通过树脂注入通道27a和螺纹通过凹槽33a将可固化树脂注入螺纹层9的外周表面9a和圆柱体53的内周表面53a之间的间隙中。通过树脂注入通道27a将可固化树脂注入到随后的螺纹层13的外周表面13a和圆柱体53的内周表面53a之间的间隙中。在可固化树脂被加热固化之前，通过树脂注入通道27a和螺纹通过凹槽33a除去包含在可固化树脂中的气泡。

3. 发明申请

US20090020733A1 CONDUCTIVE PASTE 审中-公开
标题翻译：导电胶
公开(公告)号：US20090020733A1
公开(公告)日：2009-01-22
申请号：US11814535
申请日：2006-01-20
申请人： Yohei Hirakawa , Katsutomo Wakabayashi , Yuta Yotsuyanagi , Norihito Tanaka
发明人： Yohei Hirakawa , Katsutomo Wakabayashi , Yuta Yotsuyanagi , Norihito Tanaka
IPC分类号： H01B1/16
CPC分类号： H05K1/095 , H01B1/22 , H05K3/4069
摘要： A conductive paste that includes a binder containing a thermosetting resin and conductive particles, in which the lowest exothermic peak temperature T1 (degrees C.) among at least one exothermic peak obtained by differential scanning calorimetry of the binder and the lowest endothermic peak temperature t1 (degrees C.) among at least one endothermic peak obtained by differential scanning calorimetry of the conductive particles satisfy the relation t1−20
摘要翻译：包括含有热固性树脂和导电颗粒的粘合剂的导电糊，其中通过粘合剂的差示扫描量热法获得的至少一个放热峰中的最低放热峰温度T1（℃）和最低吸热峰温度t1（在导电粒子的差示扫描量热法得到的至少一个吸热峰中满足关系t1-20

4. 发明申请

US20090194745A1 Conductive Filler 有权
标题翻译：导电填料
公开(公告)号：US20090194745A1
公开(公告)日：2009-08-06
申请号：US12306859
申请日：2007-06-26
申请人： Norihito Tanaka , Tsuyoshi Shiratori
发明人： Norihito Tanaka , Tsuyoshi Shiratori
IPC分类号： H01B1/22
CPC分类号： H05K3/3484 , B23K35/262 , B23K35/30 , C22C13/02 , H05K2201/0272
摘要： Disclosed is a conductive filler which can be fusion-bonded under lower temperature conditions (with the peak temperature of not less than 181° C.) than the reflow heat treatment conditions for an Sn-37Pb eutectic solder. This conductive filler is applicable to heat-resistant uses similar to those of the Sn-37Pb eutectic solder. The conductive filler is a mixture of first metal particles composed of an alloy having a chemical composition including 25-40% by mass of Ag, 2-8% by mass of Bi, 5-15% by mass of Cu, 2-8% by mass of In and 29-66% by mass of Sn, and second metal particles composed of an alloy having a chemical composition including 5-20% by mass of Ag, 10-20% by mass of Bi, 1-15% by mass of Cu and 50-80% by mass of Sn. In the mixture, 20-10,000 parts by mass of the second metal particles are contained per 100 parts by mass of the first metal particles.
摘要翻译：公开了一种导电填料，其可以在比Sn-37Pb共晶焊料的回流热处理条件更低的温度条件（峰值温度不低于181℃）下进行熔融粘结。该导电填料适用于与Sn-37Pb共晶焊料类似的耐热用途。导电性填料是由Ag，25〜40质量％，Bi：2-8质量％，Cu：5〜15质量％，Cu：2-8质量％的In和29-66质量％的Sn，第二金属粒子由化学成分含有5〜20质量％的Ag，10〜20质量％的Bi，1-15质量％ Cu的质量和Sn的50〜80质量％。在该混合物中，每100质量份的第一金属粒子含有20〜10000质量份的第二金属粒子。

5. 发明授权

US07686982B2 Conductive filler 有权
标题翻译：导电填料
公开(公告)号：US07686982B2
公开(公告)日：2010-03-30
申请号：US12306859
申请日：2007-06-26
申请人： Norihito Tanaka , Tsuyoshi Shiratori
发明人： Norihito Tanaka , Tsuyoshi Shiratori
IPC分类号： H01B1/02 , H01B1/22
CPC分类号： H05K3/3484 , B23K35/262 , B23K35/30 , C22C13/02 , H05K2201/0272
摘要： Disclosed is a conductive filler which can be fusion-bonded under lower temperature conditions (with the peak temperature of not less than 181° C.) than the reflow heat treatment conditions for an Sn-37Pb eutectic solder. This conductive filler is applicable to heat-resistant uses similar to those of the Sn-37Pb eutectic solder. The conductive filler is a mixture of first metal particles composed of an alloy having a chemical composition including 25-40% by mass of Ag, 2-8% by mass of Bi, 5-15% by mass of Cu, 2-8% by mass of In and 29-66% by mass of Sn, and second metal particles composed of an alloy having a chemical composition including 5-20% by mass of Ag, 10-20% by mass of Bi, 1-15% by mass of Cu and 50-80% by mass of Sn. In the mixture, 20-10,000 parts by mass of the second metal particles are contained per 100 parts by mass of the first metal particles.
摘要翻译：公开了一种导电填料，其可以在比Sn-37Pb共晶焊料的回流热处理条件更低的温度条件（峰值温度不低于181℃）下进行熔融粘结。该导电填料适用于与Sn-37Pb共晶焊料类似的耐热用途。导电性填料是由Ag，25〜40质量％，Bi：2-8质量％，Cu：5〜15质量％，Cu：2-8质量％的In和29-66质量％的Sn，第二金属粒子由化学成分含有5〜20质量％的Ag，10〜20质量％的Bi，1-15质量％ Cu的质量和Sn的50〜80质量％。在该混合物中，每100质量份的第一金属粒子含有20〜10000质量份的第二金属粒子。

6. 发明申请

US20090139608A1 Conductive Filler and Solder Material 有权
标题翻译：导电填料和焊料
公开(公告)号：US20090139608A1
公开(公告)日：2009-06-04
申请号：US11887181
申请日：2006-03-29
申请人： Norihito Tanaka , Yasuki Shimamura
发明人： Norihito Tanaka , Yasuki Shimamura
IPC分类号： B23K35/22 , H01B1/02
CPC分类号： H05K3/3484 , B22F1/0059 , B23K35/025 , B23K35/262 , B23K35/302 , H05K2201/0272
摘要： There is provided a conductive filler with high heat resistance which can be melt-bonded under reflow heat treatment conditions for a lead-free solder and, after the bonding, does not melt under the same heat treatment conditions. The conductive filler is characterized in that, as measured by differential scanning calorimetry, it has at least one metastable metal alloy phase observed as an exothermic peak and has at least one melting point observed as an endothermic peak in each of the 210 to 240° C. range and the 300 to 450° C. range, and that the filler, upon heat treatment at 246° C., gives a bonded object which has, as measured by differential scanning calorimetry, no melting point observed as an endothermic peak in the 210 to 240° C. range or has a melting endotherm calculated from an endothermic peak area in the 210 to 240° C. range, the melting endotherm being 90% or less of the melting endotherm of the filler before bonding calculated from an endothermic peak area in the 210 to 240° C. range.
摘要翻译：提供了具有高耐热性的导电填料，其可在回流焊热处理条件下熔融粘合无铅焊料，并且在接合之后，在相同的热处理条件下不熔化。导电填料的特征在于，通过差示扫描量热法测量，其至少观察到一个亚稳金属合金相作为放热峰，并且在210-240℃中具有至少一个作为吸热峰的熔点范围和300至450℃的范围，并且在246℃下热处理时，填料产生粘合物体，其通过差示扫描量热法测量，没有观察到作为吸热峰的熔点 210-240℃范围内，或者由210-240℃范围内的吸热峰面积计算出的熔融吸热温度，熔融吸热温度为从吸热峰值计算的接合前的填料的熔融吸热温度的90％以下面积在210〜240摄氏度范围。

7. 发明授权

US08241436B2 Conductive filler and solder material 有权
标题翻译：导电填料和焊料
公开(公告)号：US08241436B2
公开(公告)日：2012-08-14
申请号：US11887181
申请日：2006-03-29
申请人： Norihito Tanaka , Yasuki Shimamura
发明人： Norihito Tanaka , Yasuki Shimamura
IPC分类号： B23K35/34 , H01B1/02
CPC分类号： H05K3/3484 , B22F1/0059 , B23K35/025 , B23K35/262 , B23K35/302 , H05K2201/0272
摘要： There is provided a conductive filler with high heat resistance which can be melt-bonded under reflow heat treatment conditions for a lead-free solder and, after the bonding, does not melt under the same heat treatment conditions. The conductive filler is characterized in that, as measured by differential scanning calorimetry, it has at least one metastable metal alloy phase observed as an exothermic peak and has at least one melting point observed as an endothermic peak in each of the 210 to 240° C. range and the 300 to 450° C. range, and that the filler, upon heat treatment at 246° C., gives a bonded object which has, as measured by differential scanning calorimetry, no melting point observed as an endothermic peak in the 210 to 240° C. range or has a melting endotherm calculated from an endothermic peak area in the 210 to 240° C. range, the melting endotherm being 90% or less of the melting endotherm of the filler before bonding calculated from an endothermic peak area in the 210 to 240° C. range.
摘要翻译：提供了具有高耐热性的导电填料，其可在回流焊热处理条件下熔融粘合无铅焊料，并且在接合之后，在相同的热处理条件下不熔化。导电填料的特征在于，通过差示扫描量热法测量，其至少观察到一个亚稳金属合金相作为放热峰，并且在210-240℃中具有至少一个作为吸热峰的熔点范围和300至450℃的范围，并且在246℃下热处理时，填料产生粘合物体，其通过差示扫描量热法测量，没有观察到作为吸热峰的熔点 210-240℃范围内，或者由210-240℃范围内的吸热峰面积计算出的熔融吸热温度，熔融吸热温度为从吸热峰值计算的接合前的填料的熔融吸热温度的90％以下面积在210〜240摄氏度范围。

8. 发明授权

US4472898A File search apparatus 失效
标题翻译：文件搜索装置
公开(公告)号：US4472898A
公开(公告)日：1984-09-25
申请号：US378601
申请日：1982-05-17
申请人： Norihito Tanaka
发明人： Norihito Tanaka
IPC分类号： G06K17/00 , B42F17/34
CPC分类号： G06K17/0009
摘要： A file search apparatus which is provided with a base having a center pillar, a reel which comprises file accommodating rooms accommodating therein a plurality of files having codes and juxtaposed in a circle and is supported to the center pillar rotatably therearound, a selection device which is supported revolvably to the base to revolve along the outer periphery of the reel so as to read the codes on the files and search for a desired file, a driving device for driving the selection device, and a search display means displaying the searched file, so that the reel rotates to move the searched file to a predetermined position to be taken out therethrough without the trouble of looking for the searched file around the reel.
摘要翻译：一种文件搜索装置，其具有具有中心柱的底座，卷轴，其包括文件容纳室，其中容纳有多个具有代码并并列成圆圈的文件，并且可旋转地支撑在中心柱上;选择装置，沿着卷轴的外周旋转地支撑在基座上，以便读取文件上的代码并搜索期望的文件，用于驱动选择装置的驱动装置，以及显示所搜索的文件的搜索显示装置，因此卷轴旋转以将搜索到的文件移动到预定的位置以被取出，而不用寻找围绕卷轴的搜索文件的麻烦。

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