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1. 发明申请

US20120196075A1 RESIN COMPOSITION, SEMICONDUCTOR WAFER BONDING PRODUCT AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：树脂组合物，半导体波形粘结产品和半导体器件
公开(公告)号：US20120196075A1
公开(公告)日：2012-08-02
申请号：US13502002
申请日：2010-10-14
申请人： Toyosei Takahashi , Masakazu Kawata , Masahiro Yoneyama , Hirohisa Dejima , Fumihiro Shiraishi , Toshihiro Sato
发明人： Toyosei Takahashi , Masakazu Kawata , Masahiro Yoneyama , Hirohisa Dejima , Fumihiro Shiraishi , Toshihiro Sato
IPC分类号： B32B3/02 , C09J163/00
CPC分类号： H01L23/3114 , H01L23/293 , H01L2924/0002 , H01L2924/15311 , Y10T428/21 , H01L2924/00
摘要： A resin composition of the present invention is used for providing a spacer 104 having a grid-like shape at a planar view thereof between a semiconductor wafer 101′ and a transparent substrate 102. The resin composition includes a constituent material containing an alkali soluble resin, a thermosetting resin and a photo initiator. In the case where a semiconductor wafer 101′ and a transparent substrate 102 are bonded together through a spacer 104 formed on a substantially overall surface thereof to obtain a bonded body 2000, and then the semiconductor wafer makes one-fifth thickness, a warpage of the bonded body 2000 is 3,000 μm or less. Further, it is preferred that the warpage of the bonded body 2000 before the process thereof is 500 μm or less, and an increasing ratio of the warpage of the bonded body 2000 after the process thereof is 600% or less.
摘要翻译：本发明的树脂组合物用于在半导体晶片101'和透明基板102之间的平面视图中提供具有格子状的间隔物104.树脂组合物包括含有碱溶性树脂的构成材料，热固性树脂和光引发剂。在半导体晶片101'和透明基板102通过形成在其基本上整个表面上的间隔件104结合在一起以获得粘合体2000的情况下，然后半导体晶片形成五分之一厚度，粘结体2000为3000μm以下。此外，优选在其加工前的粘合体2000的翘曲为500μm以下，并且其加工后的粘合体2000的翘曲比例增加为600％以下。

2. 发明申请

US20120187553A1 METHOD OF MANUFACTURING SEMICONDUCTOR WAFER BONDING PRODUCT, SEMICONDUCTOR WAFER BONDING PRODUCT AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：制造半导体波形粘结产品的方法，半导体波形粘结产品和半导体器件
公开(公告)号：US20120187553A1
公开(公告)日：2012-07-26
申请号：US13394993
申请日：2010-09-08
申请人： Masahiro Yoneyama , Masakazu Kawata , Toyosei Takahashi , Hirohisa Dejima , Fumihiro Shiraishi , Toshihiro Sato
发明人： Masahiro Yoneyama , Masakazu Kawata , Toyosei Takahashi , Hirohisa Dejima , Fumihiro Shiraishi , Toshihiro Sato
IPC分类号： H01L23/04 , H01L21/50
CPC分类号： H01L23/16 , H01L23/3114 , H01L27/14618 , H01L27/14683 , H01L2924/0002 , H01L2924/15311 , H01L2924/00
摘要： A method of manufacturing a semiconductor wafer bonding product according to the present invention includes: a step of preparing a spacer formation film including a support base having a sheet-like shape and a spacer formation layer provided on the support base and having photosensitivity; a step of attaching the spacer formation layer to a semiconductor wafer having one surface from a side of the one surface; a step of forming a spacer by subjecting the spacer formation layer to exposure and development to be patterned and removing the support base; and a step of bonding a transparent substrate to a region of the spacer where the removed support base was provided so that transparent substrate is included within the region. This makes it possible to manufacture a semiconductor wafer bonding product in which the semiconductor wafer and the transparent substrate are bonded together through the spacer uniformly and reliably.
摘要翻译：根据本发明的制造半导体晶片接合产品的方法包括：制备包括具有片状形状的支撑基底和设置在支撑基底上并具有光敏性的间隔物形成层的间隔物形成膜的步骤; 将间隔物形成层从一个表面的一侧附着到具有一个表面的半导体晶片的步骤; 通过对间隔物形成层进行曝光和显影以图案化并去除支撑基底来形成间隔物的步骤; 以及将透明基板粘合到设置有去除的支撑基底的间隔件的区域，使得在该区域内包含透明基板的步骤。这使得可以制造半导体晶片接合产品，其中半导体晶片和透明基板通过间隔件均匀可靠地结合在一起。

3. 发明申请

US20120032284A1 FILM FOR RESIN SPACER, LIGHT-RECEIVING DEVICE AND METHOD FOR MANUFACTURING SAME, AND MEMS DEVICE AND METHOD FOR MANUFACTURING SAME 审中-公开
标题翻译：用于树脂间隔件的薄膜，光接收装置及其制造方法和MEMS装置及其制造方法
公开(公告)号：US20120032284A1
公开(公告)日：2012-02-09
申请号：US13262127
申请日：2010-03-25
申请人： Hirohisa Dejima , Masakazu Kawata , Masahiro Yoneyama , Toyosei Takahashi , Fumihiro Shiraishi , Toshihiro Sato
发明人： Hirohisa Dejima , Masakazu Kawata , Masahiro Yoneyama , Toyosei Takahashi , Fumihiro Shiraishi , Toshihiro Sato
IPC分类号： H01L29/84 , C09J167/06 , H01L21/00 , H01L31/0203 , H01L31/18 , C09J161/10 , C09J177/00
CPC分类号： C09J163/10 , C08L79/08 , H01L31/0203
摘要： According to one aspect of the present invention, a film for a resin spacer (10) comprises an adhesive layer (12) made of a resin composition and a cover film (14) covering a surface of the adhesive layer (12). In the above-described film for a resin spacer (10), an adhesion force C1 between the adhesive layer (12) and the cover film (14) and an adhesion force D between the adhesive layer (12) and a silicone resin are set so as to satisfy the condition C1>D. Consequently, it is possible to reduce resin adherence to a cutting table at the time of cutting the film for a resin spacer (10).
摘要翻译：根据本发明的一个方面，用于树脂间隔物（10）的膜包括由树脂组合物制成的粘合剂层（12）和覆盖粘合剂层（12）的表面的覆盖膜（14）。在上述用于树脂间隔件（10）的膜中，设置粘合剂层（12）和覆盖膜（14）之间的粘附力C1和粘合剂层（12）和硅树脂之间的粘附力D 以满足条件C1> D。因此，在切割用于树脂间隔物（10）的膜时，可以减少对切割台的树脂粘附性。

4. 发明申请

US20120168970A1 SPACER FORMATION FILM, METHOD OF MANUFACTURING SEMICONDUCTOR WAFER BONDING PRODUCT, SEMICONDUCTOR WAFER BONDING PRODUCT AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：隔膜形成膜，制造半导体波形粘结产品的方法，半导体波形粘结产品和半导体器件
公开(公告)号：US20120168970A1
公开(公告)日：2012-07-05
申请号：US13496354
申请日：2010-09-13
申请人： Toshihiro Sato , Masakazu Kawata , Masahiro Yoneyama , Toyosei Takahashi , Hirohisa Dejima , Fumihiro Shiraishi
发明人： Toshihiro Sato , Masakazu Kawata , Masahiro Yoneyama , Toyosei Takahashi , Hirohisa Dejima , Fumihiro Shiraishi
IPC分类号： H01L23/544 , H01L23/12 , B32B7/02 , H01L21/50
CPC分类号： H01L24/29 , H01L24/13 , H01L24/32 , H01L24/83 , H01L24/94 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/29388 , H01L2224/83 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01033 , H01L2924/01052 , H01L2924/01059 , H01L2924/01074 , H01L2924/014 , H01L2924/0665 , H01L2924/15788 , H01L2924/181 , Y10T428/2495 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2924/05432 , H01L2924/00014 , H01L2924/05442 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A method of manufacturing a semiconductor wafer bonding product according to the present invention includes: a step of preparing a spacer formation film including a support base having a sheet-like shape and a spacer formation layer provided on the support base and having photosensitivity; a step of attaching the spacer formation layer to a semiconductor wafer having one surface from a side of the one surface; a step of forming a spacer by subjecting exposure and development to the spacer formation layer to be patterned and removing the support base; a step of bonding a transparent substrate to a region of the spacer, with which the removed support base made contact, so as to be included within the region. This makes it possible to manufacture a semiconductor wafer bonding product in which the semiconductor wafer and the transparent substrate are bonded together through the spacer uniformly and reliably.
摘要翻译：根据本发明的制造半导体晶片接合产品的方法包括：制备包括具有片状形状的支撑基底和设置在支撑基底上并具有光敏性的间隔物形成层的间隔物形成膜的步骤; 将间隔物形成层从一个表面的一侧附着到具有一个表面的半导体晶片的步骤; 通过对间隔物形成层进行曝光和显影以形成图案化并去除支撑基底来形成间隔物的步骤; 将透明基板粘合到被移除的支撑基底与之接触的间隔件的区域中以便包括在该区域内的步骤。这使得可以制造半导体晶片接合产品，其中半导体晶片和透明基板通过间隔件均匀可靠地结合在一起。

5. 发明申请

US20120012989A1 METHOD OF MANUFACTURING SEMICONDUCTOR WAFER BONDING PRODUCT, SEMICONDUCTOR WAFER BONDING PRODUCT AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：制造半导体波形粘结产品的方法，半导体波形粘结产品和半导体器件
公开(公告)号：US20120012989A1
公开(公告)日：2012-01-19
申请号：US13202659
申请日：2010-02-15
申请人： Toshihiro Sato , Masakazu Kawata , Masahiro Yoneyama , Toyosei Takahashi , Hirohisa Dejima , Fumihiro Shiraishi
发明人： Toshihiro Sato , Masakazu Kawata , Masahiro Yoneyama , Toyosei Takahashi , Hirohisa Dejima , Fumihiro Shiraishi
IPC分类号： H01L29/02 , H01L21/762
CPC分类号： H01L27/14683 , H01L23/3114 , H01L27/14618 , H01L31/0203 , H01L2924/0002 , H01L2924/00
摘要： A method of manufacturing a semiconductor wafer bonding product according to the present invention, including: a step of preparing a spacer formation film including a support base and a spacer formation layer; a step of attaching the spacer formation layer of the spacer formation film to a semiconductor wafer; a step of selectively exposing the spacer formation layer with an exposure light via a mask, which is placed at a side of the support base of the spacer formation film, so as to be passed through the support base; a step of removing the support base; a step of developing the spacer formation layer to form a spacer on the semiconductor wafer; and a step of bonding a transparent substrate to a surface of the spacer opposite to the semiconductor wafer.
摘要翻译：一种制造根据本发明的半导体晶片接合产品的方法，包括：制备包括支撑基体和间隔物形成层的间隔物形成膜的步骤; 将间隔物形成膜的间隔物形成层附着到半导体晶片的步骤; 通过放置在间隔物形成膜的支撑基底的一侧的掩模，用曝光光选择性地曝光间隔物形成层以使其穿过支撑基底的步骤; 去除支撑基底的步骤; 显影间隔物形成层以在半导体晶片上形成间隔物的步骤; 以及将透明基板接合到与半导体晶片相反的间隔物的表面的步骤。

6. 发明申请

US20110316116A1 PHOTOSENSITIVE RESIN COMPOSITION, ADHESIVE FILM AND LIGHT-RECEIVING DEVICE 审中-公开
标题翻译：感光树脂组合物，胶粘膜和收光装置
公开(公告)号：US20110316116A1
公开(公告)日：2011-12-29
申请号：US13254658
申请日：2010-04-08
申请人： Toshihiro Sato , Masakazu Kawata , Masahiro Yoneyama , Toyosei Takahashi , Hirohisa Dejima , Fumihiro Shiraishi
发明人： Toshihiro Sato , Masakazu Kawata , Masahiro Yoneyama , Toyosei Takahashi , Hirohisa Dejima , Fumihiro Shiraishi
IPC分类号： H01L29/06 , G03F7/028
CPC分类号： H01L31/0203 , G03F7/027 , G03F7/038 , G03F7/0388 , H01L2224/48091 , H01L2924/00014
摘要： An object of the present invention is to provide a photosensitive resin composition which leaves a small amount of resin residues after patterning by light-exposure and development and can reduce condensation between the semiconductor wafer and the transparent substrate under a high temperature and high humidity environment, an adhesive film made of the photosensitive resin composition and a light-receiving device including the adhesive film. The photosensitive resin composition of the present invention contains an alkali soluble resin (A), a photopolymerization initiator (B) and a compound (C) having a phenolic hydroxyl group and a carboxyl group.
摘要翻译：本发明的目的是提供一种通过曝光和显影在图案化之后留下少量树脂残留物的感光性树脂组合物，并且可以在高温高湿环境下减少半导体晶片和透明基板之间的冷凝，由感光性树脂组合物制成的粘合膜和包含粘合膜的光接收装置。本发明的感光性树脂组合物含有碱溶性树脂（A），光聚合引发剂（B）和具有酚羟基和羧基的化合物（C）。

7. 发明申请

US20110304034A1 SEMICONDUCTOR WAFER BONDING PRODUCT, METHOD OF MANUFACTURING SEMICONDUCTOR WAFER BONDING PRODUCT AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体波形粘结产品，制造半导体波形粘结产品和半导体器件的方法
公开(公告)号：US20110304034A1
公开(公告)日：2011-12-15
申请号：US13202674
申请日：2010-02-15
申请人： Hirohisa Dejima , Masakazu Kawata , Masahiro Yoneyama , Toyosei Takahashi , Fumihiro Shiraishi , Toshihiro Sato
发明人： Hirohisa Dejima , Masakazu Kawata , Masahiro Yoneyama , Toyosei Takahashi , Fumihiro Shiraishi , Toshihiro Sato
IPC分类号： H01L23/04 , H01L21/50
CPC分类号： H01L23/315 , H01L23/293 , H01L27/14618 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor wafer bonding product according to the present invention includes: a semiconductor wafer; a transparent substrate provided at a side of a functional surface of the semiconductor wafer; a spacer provided between the semiconductor wafer and the transparent substrate; and a bonded portion continuously provided along a periphery of the semiconductor wafer, the transparent substrate being bonded to the semiconductor wafer through the bonded portion. It is preferred that a minimum width of the bonded portion is 50 μm or more.
摘要翻译：根据本发明的半导体晶片接合产品包括：半导体晶片; 设置在所述半导体晶片的功能面的一侧的透明基板; 设置在所述半导体晶片和所述透明基板之间的间隔物; 以及沿着半导体晶片的周边连续设置的接合部分，透明基板通过接合部分接合到半导体晶片。接合部的最小宽度优选为50μm以上。

8. 发明授权

US07768089B2 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US07768089B2
公开(公告)日：2010-08-03
申请号：US12213485
申请日：2008-06-19
申请人： Takashi Hirano , Toyosei Takahashi , Toshihiro Sato , Masakazu Kawata
发明人： Takashi Hirano , Toyosei Takahashi , Toshihiro Sato , Masakazu Kawata
IPC分类号： G09B1/00
CPC分类号： H01L27/14618 , H01L2224/13 , H01L2224/48091 , H01L2924/00014
摘要： A semiconductor device comprises a semiconductor substrate comprised of an interposer having one surface and a semiconductor element provided on the one surface of the interposer, the semiconductor element including a light receiving portion for receiving light thereon; a transparent substrate having light-transmitting property and one surface facing the light receiving portion, the transparent substrate arranged in a spaced-apart relationship with the one surface of the interposer through a gap formed between the one surface of the interposer and the one surface of the transparent substrate; and a spacer formed in a shape of a frame, the spacer positioned between the one surface of the interposer and the one surface of the transparent substrate for regulating the gap, and the spacer having an inner surface and an outer surface, wherein the one surface of the interposer, the one surface of the transparent substrate and the inner surface of the spacer form a space which is hermetically sealed, and wherein the spacer has a wall including at least one thin wall portion and a thick wall portion other than the at least one thin wall portion, and a vapor permeability of the at least one thin wall portion is greater than a vapor permeability of the thick wall portion, wherein a vapor allowed to flow into the space through the wall of the spacer from an outside preferentially permeates from the space to the outside through the thin wall portion.
摘要翻译：半导体器件包括由具有一个表面的插入件和设置在插入件的一个表面上的半导体元件组成的半导体衬底，该半导体元件包括用于在其上接收光的光接收部分; 具有透光性的透明基板和面对光接收部分的一个表面，透明基板通过形成在插入件的一个表面之间的间隙与插入件的一个表面间隔开地布置，透明基板; 以及形成为框架形状的间隔件，所述间隔件位于所述插入件的所述一个表面和所述透明基板的用于调节所述间隙的一个表面之间，并且所述间隔件具有内表面和外表面，其中所述一个表面所述透明基板的一个表面和所述间隔件的内表面形成密封的空间，并且其中所述间隔件具有壁，所述壁包括至少一个薄壁部分和至少一个以上的厚壁部分一个薄壁部分和至少一个薄壁部分的蒸汽渗透性大于厚壁部分的蒸汽渗透性，其中允许从外部通过间隔物的壁流入空间的蒸气优先渗透从通过薄壁部分到外部的空间。

9. 发明申请

US20090294887A1 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US20090294887A1
公开(公告)日：2009-12-03
申请号：US12213485
申请日：2008-06-19
申请人： Takashi Hirano , Toyosei Takahashi , Toshihiro Sato , Masakazu Kawata
发明人： Takashi Hirano , Toyosei Takahashi , Toshihiro Sato , Masakazu Kawata
IPC分类号： H01L31/0203
CPC分类号： H01L27/14618 , H01L2224/13 , H01L2224/48091 , H01L2924/00014
摘要： A semiconductor device comprises a semiconductor substrate comprised of an interposer having one surface and a semiconductor element provided on the one surface of the interposer, the semiconductor element including a light receiving portion for receiving light thereon; a transparent substrate having light-transmitting property and one surface facing the light receiving portion, the transparent substrate arranged in a spaced-apart relationship with the one surface of the interposer through a gap formed between the one surface of the interposer and the one surface of the transparent substrate; and a spacer formed in a shape of a frame, the spacer positioned between the one surface of the interposer and the one surface of the transparent substrate for regulating the gap, and the spacer having an inner surface and an outer surface, wherein the one surface of the interposer, the one surface of the transparent substrate and the inner surface of the spacer form a space which is hermetically sealed, and wherein the spacer has a wall including at least one thin wall portion and a thick wall portion other than the at least one thin wall portion, and a vapor permeability of the at least one thin wall portion is greater than a vapor permeability of the thick wall portion, wherein a vapor allowed to flow into the space through the wall of the spacer from an outside preferentially permeates from the space to the outside through the thin wall portion. The semiconductor device is capable of reliably preventing dust from infiltrating into the semiconductor device and capable of reliably preventing occurrence of dew condensation in an inner wall of the semiconductor device, particularly on an inner surface of a transparent substrate.
摘要翻译：半导体器件包括由具有一个表面的插入件和设置在插入件的一个表面上的半导体元件组成的半导体衬底，该半导体元件包括用于在其上接收光的光接收部分; 具有透光性的透明基板和面对光接收部分的一个表面，透明基板通过形成在插入件的一个表面之间的间隙与插入件的一个表面间隔开地布置，透明基板; 以及形成为框架形状的间隔件，所述间隔件位于所述插入件的所述一个表面和所述透明基板的用于调节所述间隙的一个表面之间，并且所述间隔件具有内表面和外表面，其中所述一个表面所述透明基板的一个表面和所述间隔件的内表面形成密封的空间，并且其中所述间隔件具有壁，所述壁包括至少一个薄壁部分和至少一个以上的厚壁部分一个薄壁部分和至少一个薄壁部分的蒸汽渗透性大于厚壁部分的蒸汽渗透性，其中允许从外部通过间隔物的壁流入空间的蒸气优先渗透从通过薄壁部分到外部的空间。半导体装置能够可靠地防止灰尘渗透到半导体装置中，能够可靠地防止在半导体装置的内壁，特别是在透明基板的内表面上发生结露。

10. 发明授权

US08268540B2 Method of manufacturing light receiving device 失效
标题翻译：制造光接收装置的方法
公开(公告)号：US08268540B2
公开(公告)日：2012-09-18
申请号：US11886262
申请日：2007-05-30
申请人： Toyosei Takahashi , Junya Kusunoki , Kazuto Oonami , Mitsuo Sugino , Masakazu Kawata , Rie Takayama , Seiji Oohashi
发明人： Toyosei Takahashi , Junya Kusunoki , Kazuto Oonami , Mitsuo Sugino , Masakazu Kawata , Rie Takayama , Seiji Oohashi
IPC分类号： G03F7/20
CPC分类号： H01L27/14618 , H01L27/14632 , H01L27/14687 , H01L2224/48091 , H01L2924/16235 , H01L2924/00014
摘要： A method of manufacturing a light receiving device 1 includes: providing a resin layer 14 containing a photo curing resin on a transparent substrate 13 where a plurality of transparent substrate portions 13A are integrated so that the resin layer covers the transparent substrate 13; selectively irradiating the resin layer 14 with light, followed by a developing process, so that the resin layer 14 remains in regions of the transparent substrate 13 which surround portions corresponding to regions facing light receiving portions 11 in the transparent substrate portions 13A; dividing the transparent substrate 13 into units of transparent substrate portions 13A so that a plurality of transparent substrate portions 13A are obtained; dividing the base substrate 12 into units of base substrate portions 12A so that a plurality of base substrate portions 12A are obtained; and joining the base substrate portions 12A and the transparent substrate portions 13A via the resin layer 14.
摘要翻译：制造光接收装置1的方法包括：在透明基板13上设置含有光固化树脂的树脂层14，其中多个透明基板部分13A被一体化，使得树脂层覆盖透明基板13; 选择性地照射树脂层14，然后进行显影处理，使得树脂层14保留在透明基板13的围绕部分对应于透明基板部分13A中的光接收部分11的区域的区域中; 将透明基板13分割为透明基板部13A的单位，得到多个透明基板部13A; 将基底基板12分割为基底部分12A的单元，从而获得多个基底部分12A; 并且经由树脂层14与基板部分12A和透明基板部分13A接合。

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