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1. 发明申请

US20070281142A1 RESIN COMPOSITION FOR PRINTED WIRING BOARD FILM AND USE THEREOF 审中-公开
标题翻译：印刷电路板用树脂组合物及其用途
公开(公告)号：US20070281142A1
公开(公告)日：2007-12-06
申请号：US11755398
申请日：2007-05-30
申请人： Toshihiro Ohta , Kensaku Sonoda , Tomiho Yamada
发明人： Toshihiro Ohta , Kensaku Sonoda , Tomiho Yamada
IPC分类号： B32B3/00
CPC分类号： H05K1/0326 , C08F255/00 , C08F279/02 , C08F287/00 , C08L51/006 , C08L51/04 , C08L51/06 , H05K1/0393 , H05K3/4691 , Y10T428/24917 , C08L2666/24
摘要： A resin composition suitable for manufacturing an electrical insulative resin film for a printed wiring board is composed of 80 to 99.5 mass % of a first graft copolymer (a) and 0.5 to 20 mass % of a second graft copolymer (b). In the first graft copolymer (a), 15 to 40 parts by mass of an aromatic vinyl monomer are grafted to 60 to 85 parts by mass of a random or block copolymer composed of monomer units selected from nonpolar α-olefin monomers and nonpolar conjugated diene monomers. In the second graft copolymer (b), 5 to 30 parts by mass of an aromatic vinyl monomer are grafted to 70 to 95 parts by mass of a random or block copolymer composed of 60 to 90 mass % of a monomer unit, which is selected from nonpolar α-olefin monomers and nonpolar conjugated diene monomers, and 10 to 40 mass % of an aromatic vinyl monomer unit.
摘要翻译：适用于制造印刷电路板用电绝缘树脂膜的树脂组合物由第一接枝共聚物（a）的80〜99.5质量％和第二接枝共聚物（b））的0.5〜20质量％组成。在第一接枝共聚物（a）中，将15〜40质量份的芳香族乙烯基单体接枝到60〜85质量份的由选自非极性α-烯烃单体和非极性共轭二烯烃的单体单元组成的无规或嵌段共聚物单体。在第二接枝共聚物（b）中，将5〜30质量份芳族乙烯基单体接枝到70〜95质量份的由选自60〜90质量％的单体单元的无规或嵌段共聚物来自非极性α-烯烃单体和非极性共轭二烯单体，和10〜40质量％的芳族乙烯基单体单元。

2. 发明授权

US07820274B2 Prepreg and conductive layer-laminated substrate for printed wiring board 有权
标题翻译：用于印刷电路板的预浸料和导电层 - 层压基板
公开(公告)号：US07820274B2
公开(公告)日：2010-10-26
申请号：US11755374
申请日：2007-05-30
申请人： Toshihiro Ohta , Tomiho Yamada , Shigeru Asami
发明人： Toshihiro Ohta , Tomiho Yamada , Shigeru Asami
IPC分类号： B32B3/00
CPC分类号： C08J5/24 , B32B15/08 , B32B27/04 , B32B27/12 , C08J2351/04 , C08L51/006 , H05K1/0326 , H05K1/036 , H05K1/0366 , H05K2201/0158 , Y10S428/901 , Y10T428/12028 , Y10T428/24917 , Y10T428/24994 , Y10T442/2992 , C08L2666/02
摘要： A prepreg having low dielectric constant, low dielectric loss, and high heat cycle resistance. The prepreg includes a sheet-like preform and a resin-impregnated, sheet-like, fiber-reinforced material thermal pressure adhered to the sheet-like preform. The sheet-like preform includes a graft copolymer (a) in which 15 to 40 parts by mass of an aromatic vinyl monomer are grafted to 60 to 85 parts by mass of a random or block copolymer comprising monomer units selected from nonpolar α-olefin monomers and nonpolar conjugated diene monomers. The resin-impregnated, sheet-like, fiber-reinforced material includes a sheet-like, fiber-reinforced material (b1) and a thermoplastic resin (b2) into which the sheet-like, fiber-reinforced material (b1) is impregnated. The thermoplastic resin (b2) is a random or block copolymer composed of 60 to 90 mass % of a monomer unit, which is selected from nonpolar α-olefin monomers and nonpolar conjugated diene monomers, and 10 to 40 mass % of an aromatic vinyl monomer unit.
摘要翻译：具有低介电常数，低介电损耗和高耐热循环电阻的预浸料。预浸料包括片状预成型体和粘附到片状预成型体上的树脂浸渍的片状纤维增强材料的热压力。片状预成型体包括接枝共聚物（a），其中将15〜40质量份芳族乙烯基单体接枝至60〜85质量份的无规或嵌段共聚物，其包含选自非极性α-烯烃单体的单体单元和非极性共轭二烯单体。树脂浸渍的片状纤维增强材料包括片状纤维增强材料（b1）和热塑性树脂（b2），其中浸渍有片状纤维增强材料（b1）。热塑性树脂（b2）是选自非极性α-烯烃单体和非极性共轭二烯单体的60〜90质量％的单体单元和10〜40质量％的芳香族乙烯基单体的无规嵌段共聚物单元。

3. 发明申请

US20070281566A1 PREPREG AND CONDUCTIVE LAYER-LAMINATED SUBSTRATE FOR PRINTED WIRING BOARD 有权
标题翻译：印刷电路板的导电层和导电层叠基板
公开(公告)号：US20070281566A1
公开(公告)日：2007-12-06
申请号：US11755374
申请日：2007-05-30
申请人： Toshihiro Ohta , Tomiho Yamada , Shigeru Asami
发明人： Toshihiro Ohta , Tomiho Yamada , Shigeru Asami
IPC分类号： B32B17/02 , B22F7/02
CPC分类号： C08J5/24 , B32B15/08 , B32B27/04 , B32B27/12 , C08J2351/04 , C08L51/006 , H05K1/0326 , H05K1/036 , H05K1/0366 , H05K2201/0158 , Y10S428/901 , Y10T428/12028 , Y10T428/24917 , Y10T428/24994 , Y10T442/2992 , C08L2666/02
摘要： A prepreg having low dielectric constant, low dielectric loss, and high heat cycle resistance. The prepreg includes a sheet-like preform and a resin-impregnated, sheet-like, fiber-reinforced material thermal pressure adhered to the sheet-like preform. The sheet-like preform includes a graft copolymer (a) in which 15 to 40 parts by mass of an aromatic vinyl monomer are grafted to 60 to 85 parts by mass of a random or block copolymer comprising monomer units selected from nonpolar α-olefin monomers and nonpolar conjugated diene monomers. The resin-impregnated, sheet-like, fiber-reinforced material includes a sheet-like, fiber-reinforced material (b1) and a thermoplastic resin (b2) into which the sheet-like, fiber-reinforced material (b1) is impregnated. The thermoplastic resin (b2) is a random or block copolymer composed of 60 to 90 mass % of a monomer unit, which is selected from nonpolar α-olefin monomers and nonpolar conjugated diene monomers, and 10 to 40 mass % of an aromatic vinyl monomer unit.
摘要翻译：具有低介电常数，低介电损耗和高耐热循环电阻的预浸料。预浸料包括片状预成型体和粘附到片状预成型体上的树脂浸渍的片状纤维增强材料的热压力。片状预成型体包括接枝共聚物（a），其中将15〜40质量份芳族乙烯基单体接枝到60〜85质量份的包含选自非极性α-烯烃单体的单体单元的无规或嵌段共聚物和非极性共轭二烯单体。树脂浸渍的片状纤维增强材料包括片状纤维增强材料（b 1）和热塑性树脂（b 2），片状纤维增强材料（b 1）被浸渍。热塑性树脂（b 2）是由60〜90质量％的选自非极性α-烯烃单体和非极性共轭二烯单体的单体单元和10〜40质量％的芳香族乙烯基组成的无规嵌段共聚物单体单元。

4. 发明授权

US06420476B1 Composite dielectric material composition, and film, substrate, electronic part and molded article produced therefrom 失效
标题翻译：复合介电材料组合物，以及由其制成的膜，基材，电子部件和模塑制品
公开(公告)号：US06420476B1
公开(公告)日：2002-07-16
申请号：US09292842
申请日：1999-04-16
申请人： Toshiaki Yamada , Hiroaki Hasegawa , Yoshiyuki Yasukawa , Kenji Endou , Michihisa Yamada , Yasuo Moriya , Tomiho Yamada , Tetsuya Itoh
发明人： Toshiaki Yamada , Hiroaki Hasegawa , Yoshiyuki Yasukawa , Kenji Endou , Michihisa Yamada , Yasuo Moriya , Tomiho Yamada , Tetsuya Itoh
IPC分类号： C08L900
CPC分类号： H01B3/442 , H05K1/024 , H05K1/032 , H05K1/0373 , H05K2201/0209
摘要： The invention has for its object to provide a composite dielectric material having any desired dielectric constant selectable from a relatively wide range in a high-frequency band and a low dielectric loss tangent, and a film, substrate, electronic part or molded or otherwise formed article using the same. To accomplish this object, there is provided a composite dielectric material composition comprising a heat-resistant, low-dielectric polymeric material that is a resin composition comprising one or two or more resins having a weight-average absolute molecular weight of at least 1,000, wherein the sum of carbon atoms and hydrogen atoms in said composition is at least 99%, and some or all resin molecules have a chemical bond therebetween, and a filler. A film, substrate, electronic part or molded or otherwise formed article is obtained using this composition.
摘要翻译：本发明的目的是提供一种具有从高频带和低介电损耗角正切相对较宽范围内选择的任何所需介电常数的复合电介质材料，以及膜，基片，电子部件或模制或其它形成的制品使用相同为了实现该目的，提供了一种复合介电材料组合物，其包括耐热低介电聚合物材料，其是包含一种或两种或更多种重均分子量绝对分子量至少为1,000的树脂组合物，其中所述组合物中碳原子和氢原子的总和为至少99％，并且部分或全部树脂分子之间具有化学键和填料。使用该组合物获得薄膜，基材，电子部件或模制或其它成型制品。

5. 发明授权

US07291188B2 Polishing cloth and method of manufacturing semiconductor device 有权
标题翻译：抛光布和半导体器件的制造方法
公开(公告)号：US07291188B2
公开(公告)日：2007-11-06
申请号：US10994229
申请日：2004-11-23
申请人： Hideaki Hirabayashi , Naoaki Sakurai , Akiko Saito , Koji Sato , Tomiho Yamada
发明人： Hideaki Hirabayashi , Naoaki Sakurai , Akiko Saito , Koji Sato , Tomiho Yamada
IPC分类号： C09K3/14 , B24D11/00
CPC分类号： B24B37/24
摘要： A polishing cloth used in the chemical mechanical polishing treatment comprises a molded body of (meth)acrylic copolymer having an acid value of 10 to 100 mg KOH/g and a hydroxyl group value of 50 to 150 mg KOH/g.
摘要翻译：用于化学机械抛光处理的抛光布包括酸值为10至100mg KOH / g，羟基值为50至150mg KOH / g的（甲基）丙烯酸共聚物的成型体。

6. 发明授权

US07884020B2 Polishing cloth and method of manufacturing semiconductor device 有权
标题翻译：抛光布和半导体器件的制造方法
公开(公告)号：US07884020B2
公开(公告)日：2011-02-08
申请号：US11863788
申请日：2007-09-28
申请人： Hideaki Hirabayashi , Naoaki Sakurai , Akiko Saito , Koji Sato , Tomiho Yamada
发明人： Hideaki Hirabayashi , Naoaki Sakurai , Akiko Saito , Koji Sato , Tomiho Yamada
IPC分类号： H01L21/302
CPC分类号： B24B37/24
摘要： A polishing cloth used in the chemical mechanical polishing treatment comprises a molded body of (meth)acrylic copolymer having an acid value of 10 to 100 mg KOH/g and a hydroxyl group value of 50 to 150 mg KOH/g.
摘要翻译：用于化学机械抛光处理的抛光布包括酸值为10至100mg KOH / g，羟基值为50至150mg KOH / g的（甲基）丙烯酸共聚物的成型体。

7. 发明申请

US20080032504A1 POLISHING CLOTH AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 有权
标题翻译：抛光布和制造半导体器件的方法
公开(公告)号：US20080032504A1
公开(公告)日：2008-02-07
申请号：US11863788
申请日：2007-09-28
申请人： Hideaki HIRABAYASHI , Naoaki Sakurai , Akiko Saito , Koji Sato , Tomiho Yamada
发明人： Hideaki HIRABAYASHI , Naoaki Sakurai , Akiko Saito , Koji Sato , Tomiho Yamada
IPC分类号： H01L21/302
CPC分类号： B24B37/24
摘要： A polishing cloth used in the chemical mechanical polishing treatment comprises a molded body of (meth)acrylic copolymer having an acid value of 10 to 100 mg KOH/g and a hydroxyl group value of 50 to 150 mg KOH/g.
摘要翻译：用于化学机械抛光处理的抛光布包括酸值为10至100mg KOH / g，羟基值为50至150mg KOH / g的（甲基）丙烯酸共聚物的成型体。

8. 发明申请

US20050148185A1 Polishing cloth and method of manufacturing semiconductor device 有权
标题翻译：抛光布和半导体器件的制造方法
公开(公告)号：US20050148185A1
公开(公告)日：2005-07-07
申请号：US10994229
申请日：2004-11-23
申请人： Hideaki Hirabayashi , Naoaki Sakurai , Akiko Saito , Koji Sato , Tomiho Yamada
发明人： Hideaki Hirabayashi , Naoaki Sakurai , Akiko Saito , Koji Sato , Tomiho Yamada
IPC分类号： B24B37/20 , B24B37/24 , B24B53/00 , B24D3/28 , B24D13/14 , C08F220/06 , C08F220/26 , C08L33/00 , C09G1/00 , H01L21/304 , H01L21/302 , B24B31/00
CPC分类号： B24B37/24
摘要： A polishing cloth used in the chemical mechanical polishing treatment comprises a molded body of (meth)acrylic copolymer having an acid value of 10 to 100 mg KOH/g and a hydroxyl group value of 50 to 150 mg KOH/g.
摘要翻译：用于化学机械抛光处理的抛光布包括酸值为10至100mg KOH / g，羟基值为50至150mg KOH / g的（甲基）丙烯酸共聚物的成型体。

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