专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5498109A Drilling apparatus of hard brittle material and method thereof 失效
标题翻译：硬脆材料钻孔装置及其制造方法
公开(公告)号：US5498109A
公开(公告)日：1996-03-12
申请号：US215054
申请日：1994-03-21
申请人： Toshihiro Mine , Shinichi Kazui , Kenji Morita , Hiroyuki Ogino , Takeji Shiokawa , Hideaki Sasaki
发明人： Toshihiro Mine , Shinichi Kazui , Kenji Morita , Hiroyuki Ogino , Takeji Shiokawa , Hideaki Sasaki
IPC分类号： B23Q11/10 , B23B31/00 , B23B31/20 , B23B47/24 , B23D59/00 , B23D59/02 , B23Q17/09 , B24D7/10 , B24D7/18 , B25B11/00 , B28D1/04 , B28D1/14 , B28D7/02 , B28D7/04 , B23B35/00 , B23B39/00
CPC分类号： B25B11/005 , B23B31/201 , B23D59/001 , B23D59/025 , B23Q17/0966 , B28D1/041 , B28D7/046 , Y10T279/17111 , Y10T408/03 , Y10T408/14 , Y10T408/45
摘要： A drilling method and a drilling apparatus of a hard brittle material in which a core drill is used for abrasive grinding of high accuracy and high durability. Therefore, the structure of this invention comprises: a tubular core drill; a collet chuck for holding the core drill, including a chuck main body of an integral shape which is hollow, a seal joint provided on the chuck at the inlet side of the lubricant, a slit portion of a pin vise type for holding the core drill, which slit portion is provided on the chuck at the outlet side of the lubricant, and a seal portion provided axially inside of the slit portion, which seal portion has an inner diameter substantially equal to an outer diameter of the core drill applied to the seal portion, and a threaded portion formed on the outer periphery of a portion further axially inside of the seal portion, so that after inserting the core drill into the seal portion, a fastening nut is engaged with and tightened on the threaded portion to thereby seal and fix the core drill, and that the lubricant at a high pressure can be supplied into a central space of the core drill; and a structure for delivering the lubricant through the inner passage of the core drill.
摘要翻译：一种硬脆材料的钻孔方法和钻孔装置，其中使用芯钻进行高精度和高耐久性的研磨。因此，本发明的结构包括：管状芯钻; 用于保持芯钻的夹头卡盘，包括中空的整体形状的卡盘主体，设置在润滑剂入口侧的卡盘上的密封接头，用于保持芯钻的针脚的狭缝部分所述狭缝部设置在所述润滑剂的出口侧的所述卡盘上，以及密封部，其设置在所述狭缝部的轴向内侧，所述密封部的内径基本上等于施加于所述密封件的所述芯钻的外径以及形成在密封部分的另外轴向内侧的一部分的外周上的螺纹部分，使得在将芯钻头插入密封部分之后，紧固螺母与螺纹部分接合并紧固，从而密封和固定芯钻，高压润滑剂可以供应到钻芯的中心空间; 以及用于通过芯钻的内部通道输送润滑剂的结构。

2. 发明授权

US5390446A Grinding method and grinding machine 失效
标题翻译：研磨方法和研磨机
公开(公告)号：US5390446A
公开(公告)日：1995-02-21
申请号：US900572
申请日：1992-06-18
申请人： Shinichi Kazui , Hiroyuki Ogino , Kenji Morita , Kuninori Imai , Hideaki Sasaki , Takao Oguro
发明人： Shinichi Kazui , Hiroyuki Ogino , Kenji Morita , Kuninori Imai , Hideaki Sasaki , Takao Oguro
IPC分类号： B24B7/22 , B24B1/00
CPC分类号： B24B1/00
摘要： A grinding method and a grinding machine of reduced grinding resistance, in which letting f [mm] denote the diamond particle size of a diamond grindstone, V [m/min] denote the peripheral speed of the diamond grindstone, and f [m/min] denote the feed speed of a workpiece made of Aluminum nitride ceramic, the peripheral speed of the diamond grindstone and the feed speed of the workpiece are set so as to satisfy V.gtoreq.35 .phi.+2000 and V/f.gtoreq.70 .phi.+800.
摘要翻译：研磨方法和耐磨性降低的研磨机，其中f [mm]表示金刚石磨石的金刚石粒度，V [m / min]表示金刚石磨石的圆周速度，f [m / min ]表示由氮化铝陶瓷制成的工件的进给速度，金刚石磨石的圆周速度和工件的进给速度被设定为满足V> / = 35phi + 2000和V / f> / 70 phi +800。

3. 发明授权

US06406357B1 Grinding method, semiconductor device and method of manufacturing semiconductor device 失效
标题翻译：研磨方法，半导体器件及制造半导体器件的方法
公开(公告)号：US06406357B1
公开(公告)日：2002-06-18
申请号：US09522464
申请日：2000-03-09
申请人： Shinichi Kazui , Kazuo Shirase , Kenji Morita , Hideaki Sasaki , Hitoshi Odashima
发明人： Shinichi Kazui , Kazuo Shirase , Kenji Morita , Hideaki Sasaki , Hitoshi Odashima
IPC分类号： B24B100
CPC分类号： B28D5/0094 , B24B37/042 , H01L21/6838
摘要： A surface of a wafer (semiconductor substrate) is subjected to grinding by rotating it and bringing it into contact with a rotating grinding wheel. The grinding wheel is rotated in a first direction at a rotating speed N1. The wafer is rotated in a second direction which is opposite to the first direction at a rotating speed N2, wherein a value of N2/N1 is in the range of 0.006 to 0.025. The wafer is then carried from the grinding process to a dicing process while being maintained in a horizontal position by using a wafer handling jig to prevent the breakage of the wafer. A flash etching process may also be used at the end of the grinding process.
摘要翻译：通过使晶片（半导体基板）的表面旋转并使其与旋转的砂轮接触来进行研磨。砂轮以第一方向以转速N1旋转。晶片以与第一方向相反的第二方向以旋转速度N2旋转，其中N 2 / N 1的值在0.006至0.025的范围内。然后通过使用晶片处理夹具将晶片从研磨过程运送到切割工艺，同时保持在水平位置以防止晶片的破损。在研磨过程结束时也可以使用闪光蚀刻工艺。

4. 发明授权

US5520733A Deposition apparatus and profile-following device suitable for apparatuses such as those for deposition 失效
标题翻译：沉积装置和轮廓跟随装置适用于诸如沉积装置的装置
公开(公告)号：US5520733A
公开(公告)日：1996-05-28
申请号：US266672
申请日：1994-06-28
申请人： Hiroyuki Doi , Shinichi Kazui , Takeji Shiokawa , Keiji Fujikawa , Yutaka Hashimoto , Makoto Matsuoka
发明人： Hiroyuki Doi , Shinichi Kazui , Takeji Shiokawa , Keiji Fujikawa , Yutaka Hashimoto , Makoto Matsuoka
IPC分类号： B05C5/00 , B05C5/02 , B23Q35/10 , H01L21/52 , H05K3/34 , H05K13/04 , B05C1/06
CPC分类号： B05C5/0216 , H01L24/743 , H05K13/0469 , H01L2224/743 , H01L2924/14
摘要： A depositing apparatus includes a profile-following mechanism having a translational displacement mechanism portion and a rotation mechanism portion adapted to allow a head to be swung in the directions of both X and the Y axes so that the head follows a profile of the surface of workpiece smoothly around a first contact point, thereof with the workpiece, serving as a fulcrum point.
摘要翻译：沉积设备包括具有平移位移机构部分和旋转机构部分的轮廓跟随机构，该旋转机构部分适于允许头沿X轴和Y轴的方向摆动，使得头部遵循工件表面的轮廓围绕其第一接触点与工件平齐地，作为支点。

5. 发明授权

US4659587A Electroless plating process and process for producing multilayer wiring board 失效
标题翻译：无电镀工艺及生产多层布线板的工艺
公开(公告)号：US4659587A
公开(公告)日：1987-04-21
申请号：US786056
申请日：1985-10-10
申请人： Midori Imura , Makoto Morijiri , Masanobu Hanazono , Shinichi Kazui , Youzi Miura , Hiroyuki Ogino
发明人： Midori Imura , Makoto Morijiri , Masanobu Hanazono , Shinichi Kazui , Youzi Miura , Hiroyuki Ogino
IPC分类号： C23C18/16 , H05K3/18 , H05K3/40 , H05K3/46
CPC分类号： C23C18/1608 , C23C18/1612 , C23C18/1667 , C23C18/1868 , C23C18/1879 , C23C18/1882 , C23C18/204 , C23C18/206 , C23C18/2066 , C23C18/405 , H05K3/185 , H05K2203/107 , H05K3/4038 , H05K3/4644
摘要： In a selective electroless plating process suitable for formation and correction of a minute pattern by plating film, irradiation of the surface of a workpiece with a laser beam serves to selectively activate the surface of the workpiece to allow an electroless plating film to deposited on only the activated portions. The portion of the workpiece where plating is effected is irradiated with a radiation energy beam to form a damaged portion, which is contact with a plating bath during and/or after the irradiation to selectively from a plating film on the damaged portion. The portion of a workpiece where a pole as the connector part of a multilayer wiring board is to be formed is irradiated with a laser beam and allowed to have a pole selectively formed only thereon.
摘要翻译：在适于通过镀膜形成和校正微小图案的选择性化学镀方法中，用激光束照射工件表面用于选择性地激活工件的表面，以允许化学镀膜仅沉积在激活部分。用辐射能量束照射进行电镀的工件的部分，以形成受损部分，该损伤部分在照射期间和/或之后与电镀槽接触，以选择性地从损坏部分上的镀膜上。要形成作为多层布线板的连接器部分的极的工件的部分被激光束照射，并且允许具有仅在其上选择性地形成的极。

6. 发明授权

US5906309A Solder bump measuring method and apparatus 失效
公开(公告)号：US5906309A
公开(公告)日：1999-05-25
申请号：US759949
申请日：1996-12-03
申请人： Yutaka Hashimoto , Hideaki Sasaki , Mamoru Kobayashi , Shinichi Kazui
发明人： Yutaka Hashimoto , Hideaki Sasaki , Mamoru Kobayashi , Shinichi Kazui
IPC分类号： G01B11/02 , G01B11/06 , H01L21/60 , H01L21/66 , H05K13/08 , B23K3/08 , G01B11/24
CPC分类号： H05K13/08 , G01B11/0608 , H01L22/12
摘要： A work having a number of solder bumps on a substrate is mounted on a work positioning mechanism, and scanned by an optical micro head to measure errors of a mount posture of the work. Each stage is controlled to correct the errors, and thereafter, the apex positions of the bumps are scanned and measured. The measurement results are collected by a personal computer, and the measurement results together with control data of each axis are sent to a main personal computer and displayed on its screen. An error of an apex position of each bump from a regression plane is calculated, and if the error is smaller than a reference value, the work is judged to be good.

7. 发明授权

US5150274A Multi-chip-module 失效
标题翻译：多芯片模块
公开(公告)号：US5150274A
公开(公告)日：1992-09-22
申请号：US727042
申请日：1991-07-09
申请人： Kenichi Okada , Kyoko Amemiya , Takao Terabayashi , Hideaki Sasaki , Kuninori Imai , Shinichi Kazui
发明人： Kenichi Okada , Kyoko Amemiya , Takao Terabayashi , Hideaki Sasaki , Kuninori Imai , Shinichi Kazui
IPC分类号： H01L23/373 , H01L23/433 , H01L23/473
CPC分类号： H01L23/3733 , H01L23/4338 , H01L23/473 , H01L2224/16 , H01L2224/73253
摘要： A multi-channel module with a plurality of chips is mounted on a multilayer circuit board and has a simple and highly reliable structure cooling system for cooling the heat generated by the chips consuming a large amount of electric power. The cooling system uses in the horizontal direction a coolant supply pipe having straight tube sections and flexible bellows sections alternately disposed in the axial direction of the pipe. The straight tube sections of the aforesaid coolant supply pipe are brought into contact with the upper faces of the chips by a spring force so as to cool continuously the plurality of chips with the coolant flowing in one coolant supply pipe thereby providing a simply structured cooling system for chips. Such a structured cooling system enables the collective assembly of cooling parts for a plurality of chips with only a small number of parts and produces highly reliable effects thereby being able to implement the miniaturization of a main frame computer.
摘要翻译：具有多个芯片的多通道模块安装在多层电路板上，并且具有简单且高度可靠的结构冷却系统，用于冷却由消耗大量电力的芯片产生的热量。冷却系统在水平方向上使用具有直管段的冷却剂供应管和沿管的轴向交替设置的柔性波纹管部。上述冷却剂供给管的直管段通过弹簧力与芯片的上表面接触，以便冷却剂在一个冷却剂供应管中流动而连续地冷却多个芯片，从而提供简单的结构化冷却系统用于芯片这种结构化的冷却系统使得能够将多个芯片的冷却部件集中组装，仅具有少量的部件，并且产生高度可靠的效果，从而能够实现主机计算机的小型化。

8. 发明授权

US06551449B2 Thin electronic circuit component and method and apparatus for producing the same 失效
标题翻译：薄电子电路部件及其制造方法和装置
公开(公告)号：US06551449B2
公开(公告)日：2003-04-22
申请号：US09753671
申请日：2001-01-04
申请人： Keiji Fujikawa , Yutaka Hashimoto , Isamu Takaoka , Shinichi Kazui , Hideaki Sasaki , Hitoshi Odashima , Mitsugu Shirai
发明人： Keiji Fujikawa , Yutaka Hashimoto , Isamu Takaoka , Shinichi Kazui , Hideaki Sasaki , Hitoshi Odashima , Mitsugu Shirai
IPC分类号： B32B3120
CPC分类号： G06K19/0775 , G06K19/07749 , H01L23/49855 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/45144 , H01L2224/83192 , H01L2924/01078 , H01L2924/01079 , H05K3/284 , Y10T156/1089 , H01L2924/00
摘要： Electric conductor patterns including antenna coils are formed on one surface of a film. Electronic components are fixed onto the film by a temporary fixing material. A cover film is laminated on the film so that the electrically conductive patterns and the electronic components are covered with the cover film. Simultaneously with the lamination, the electronic components are connected to the electric conductor patterns.
摘要翻译：在膜的一个表面上形成包括天线线圈的电导体图案。电子部件通过临时固定材料固定在膜上。覆盖膜层压在膜上，使得导电图案和电子部件被覆盖膜覆盖。与层压同时，电子部件连接到电导体图案。

9. 发明授权

US5023407A Printed circuit board with a uniform conductive layer formed by equalization of metals therein 失效
标题翻译：具有通过均匀金属形成的均匀导电层的印刷电路板
公开(公告)号：US5023407A
公开(公告)日：1991-06-11
申请号：US390616
申请日：1989-08-07
申请人： Mitugu Shirai , Kaoru Katayama , Hideaki Sasaki , Shinichi Kazui , Ryohei Satoh , Tateoki Miyauchi , Mamoru Kobayashi
发明人： Mitugu Shirai , Kaoru Katayama , Hideaki Sasaki , Shinichi Kazui , Ryohei Satoh , Tateoki Miyauchi , Mamoru Kobayashi
IPC分类号： B23K1/20 , H01L21/48 , H01L21/52 , H01L21/60 , H01L23/50 , H05K1/03 , H05K1/09 , H05K3/24 , H05K3/34
CPC分类号： H05K3/246 , H01L21/4846 , H01L24/85 , H01L2224/45144 , H01L2224/48463 , H01L2224/85 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/15787 , H05K1/0306 , H05K1/092 , H05K2203/0723 , H05K2203/107 , H05K3/244 , H05K3/3457
摘要： A metal layer other than gold is formed on a ceramic substrate, a gold layer is further formed on said metal layer, and then a high density beam is applied to the treated substrate member. Thereby, the metal of the underlayer diffused through the grain boundaries of gold up to the surface of the gold layer by heat treatment or the like is uniformly mixed with gold to form an alloyed layer excellent in wettability to a solder. At the same time, nonmetallic impurities such as carbon adhering onto the surface of the gold layer are melted and removed.
摘要翻译：在陶瓷基板上形成金以外的金属层，在所述金属层上进一步形成金层，然后将高密度光束施加到处理过的基板部件。由此，通过热处理等将金的晶界扩散到金层的表面的底层的金属与金均匀混合，形成对焊料的润湿性优异的合金化层。同时，将金属杂质如粘附在金层表面上的碳熔化并除去。

10. 发明授权

US06340109B2 Solder bump measuring method and apparatus 失效
标题翻译：焊点测量方法和装置
公开(公告)号：US06340109B2
公开(公告)日：2002-01-22
申请号：US09755106
申请日：2001-01-08
申请人： Yutaka Hashimoto , Hideaki Sasaki , Mamoru Kobayashi , Shinichi Kazui
发明人： Yutaka Hashimoto , Hideaki Sasaki , Mamoru Kobayashi , Shinichi Kazui
IPC分类号： B23K3112
CPC分类号： H05K13/08 , G01B11/0608 , H01L22/12
摘要： A work having a number of solder bumps on a substrate is mounted on a work positioning mechanism, and scanned by an optical micro head to measure errors of a mount posture of the work. Each stage is controlled to correct the errors, and thereafter, the apex positions of the bumps are scanned and measured. The measurement results are collected by a personal computer, and the measurement results together with control data of each axis are sent to a main personal computer and displayed on its screen. An error of an apex position of each bump from a regression plane is calculated, and if the error is smaller than a reference value, the work is judged to be good.
摘要翻译：在基板上具有多个焊料凸块的工件安装在工件定位机构上，并由光学微头扫描，以测量工件的安装姿势的误差。控制每个阶段以校正误差，然后扫描和测量凸块的顶点位置。测量结果由个人计算机收集，测量结果连同每个轴的控制数据发送到主个人计算机并显示在其屏幕上。计算出每个凸起从回归平面的顶点位置的误差，如果误差小于参考值，则判断为良好。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式