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    • 1. 发明授权
    • Head chip and method of producing the same
    • 头芯片及其制造方法
    • US06830319B2
    • 2004-12-14
    • US10383050
    • 2003-03-06
    • Toshihiko HarajiriYutaka Hongou
    • Toshihiko HarajiriYutaka Hongou
    • B41J2045
    • B41J2/1609B41J2/14209B41J2/14274B41J2/1612B41J2/1623B41J2/1625B41J2/1632B41J2/1634B41J2202/12
    • Disclosed is a head chip and a method of producing the same which help to achieve an improvement in production yield and a reduction in production cost and which allow high speed printing and high density printing. The head chip is of the type in which grooves defined by side walls are provided in one surface of a substrate and in which by applying voltage to electrodes provided on the side walls, ink in the grooves is ejected from nozzle openings of a nozzle plate joined to one surface of the substrate, wherein the plurality of piezoelectric ceramic members extending in a reference direction are embedded in one surface of an insulating main body of the substrate to form the substrate, wherein the grooves are formed at predetermined intervals so as to extend over the row of piezoelectric ceramic members to thereby provide the side walls, wherein the electrodes are provided in the regions of the side walls where the piezoelectric ceramic members are provided to thereby form drive portions for independent driving, and wherein the nozzle openings are provided at positions corresponding to the drive portions of the grooves to form the plurality of nozzle rows.
    • 公开了一种头片及其制造方法,其有助于提高生产率和降低生产成本,并且允许高速印刷和高密度印刷。 头芯片是其中由侧壁限定的凹槽设置在基板的一个表面中并且其中通过向设置在侧壁上的电极施加电压的类型,凹槽中的墨从喷嘴板的喷嘴开口连接 在所述基板的一个表面上,其中沿基准方向延伸的所述多个压电陶瓷构件嵌入在所述基板的绝缘主体的一个表面中以形成所述基板,其中所述凹槽以预定间隔形成以延伸 一排压电陶瓷构件,从而提供侧壁,其中电极设置在侧壁的设置有压电陶瓷构件的区域中,从而形成用于独立驱动的驱动部分,并且其中喷嘴开口设置在位置 对应于槽的驱动部分以形成多个喷嘴列。
    • 2. 发明授权
    • Head chip and head unit having head chip
    • 头芯片和头单元具有头芯片
    • US06568796B2
    • 2003-05-27
    • US09864960
    • 2001-05-24
    • Toshihiko Harajiri
    • Toshihiko Harajiri
    • B41J2045
    • B41J2/1623B41J2/14209B41J2/1609B41J2/1631B41J2/1632B41J2/1643B41J2/1646B41J2002/14362B41J2202/03
    • A head chip has a substrate having a first main surface and a second main surface opposite the first main surface. First partition walls are disposed on the first main surface of the substrate in spaced apart relation at a preselected interval to form first channels each for receiving ink. Second partition walls are disposed on the second main surface of the substrate in spaced apart relation at a preselected interval to form second channels each for receiving ink. Electrodes are connected to side walls of the first and second channels and are driven by a voltage signal to deform the side walls to vary the volume in the first and second channels to thereby eject ink from the first and second channels.
    • 头芯片具有基板,该基板具有与第一主表面相对的第一主表面和第二主表面。 第一分隔壁以预定间隔以间隔的关系设置在基板的第一主表面上,以形成用于接收墨水的第一通道。 第二分隔壁以预定间隔以间隔关系设置在基板的第二主表面上,以形成用于接收墨水的第二通道。 电极连接到第一和第二通道的侧壁并由电压信号驱动,以使侧壁变形以改变第一和第二通道中的体积,从而从第一和第二通道喷射墨水。
    • 5. 发明授权
    • Head chip and head unit
    • 头部和头部单元
    • US06491383B2
    • 2002-12-10
    • US09864939
    • 2001-05-24
    • Toshihiko Harajiri
    • Toshihiko Harajiri
    • B41J214
    • B41J2/1623B41J2/14209B41J2/1609B41J2/1632B41J2/1643B41J2002/14362
    • A head chip and a head unit, in which manufacturing cost is reduced and also manufacturing steps are simplified, are provided. In a head chip 10 in which: partition walls 12 made of piezoelectric ceramic are arranged on two upper and lower sheets of a first board 11 and a second board 16 with predetermined intervals; chambers 13 are defined between the respective partition walls 12; a driver voltage is applied to electrodes 14 provided on the side surfaces of the partition walls 12 to change the capacity in ink flow paths; and the ink filled in the ink flow paths is jetted from nozzle openings, the first board 11 and the second board 16 are formed of a dielectric material; wiring lines 15 which are electrically conducted to the electrodes 14 and elongated to the outside of the end portions of the partition walls 12 in the longitudinal direction, are provided on the surface of any one of the first board 11 and the second board 16; and further the wiring lines 15 include an inorganic conductive film 15a as the lowermost layer and metal films 15b and 15c formed thereon.
    • 提供了制造成本降低并简化制造步骤的头部芯片和头部单元。 在其中:由压电陶瓷制成的隔壁12以预定间隔布置在第一板11和第二板16的两个上板和下板上的头芯片10中; 腔室13限定在相应的隔壁12之间; 驱动电压被施加到设置在隔壁12的侧表面上的电极14,以改变墨流路中的容量; 并且填充在墨流路中的墨从喷嘴开口喷射,第一基板11和第二基板16由电介质材料形成; 在第一板11和第二板16中的任何一个的表面上设置有电导体14并沿长度方向延伸到隔壁12的端部的外侧的布线15; 此外,布线15包括作为最下层的无机导电膜15a和形成在其上的金属膜15b和15c。